The present invention provides improved methods, systems, and devices for easily, efficiently, and inexpensively patterning catalysts onto substrates to form electrical circuits, as well as methods for manufacturing such circuits from them. [Solution] The intended
metal foil is preferably roughened to an Ra of at least 0.1 μm and has a bottom surface supporting the catalytic material. The
metal foil is etchable and is typically aluminum or a derivative thereof, with a thickness of less than 500 μm. Methods and systems for forming circuits from
catalytic metal foil are also disclosed. The catalytic material supporting the surface of the
metal foil is applied to a substrate and, in some embodiments, laminated between them with a thermosetting resin or
thermoplastic resin, or with an organic material that first coats the catalytic material. The
metal foil is removed to
expose the catalytic material, and a conductor is plated onto the catalytic material.