Bi-component bisphenol A type epoxy resin structured fluid sealant and preparation thereof

Abstract

The invention discloses sealant of a dual-component and bisphenol A type epoxy resin structure and the preparation method, which comprises a first component and a second component, wherein, the first component comprises 75 parts to 95 parts of bisphenol A type epoxy resin, 8 parts to 22 parts of toughening agent, 75 parts to 95 parts of filling agent and 15 parts to 25 parts of plasticizing agent, the second component comprises 40 parts to 60 parts of curing agent, 45 parts to 55 parts of filling agent and 5 parts to 15 parts of ferric oxide powder. The preparation method comprises the followings: the preparation of the first component: the materials in the first component are poured into an agitating barrel according to the weight parts proportion, evenly stirring the materials, until grayish white fluid is obtained, namely the first component; the preparation of the second component: the materials in the second component are poured into the agitating barrel according to the weight part proportion, evenly stirring the materials, until grayish red fluid is obtained, namely the second component; the first component and the second component are mixed and evenly stirred according to the weight part of 2.8 to 3.2:1, and the sealant of the dual-component and bisphenol A type epoxy resin structure is obtained. The sealant has the advantages that the pliability is good, the stripping strength is strong, and the physical mechanical performance and the process performance are well improved.

Description

technical field [0001] The invention relates to a structural sealant and a preparation method thereof, in particular to a two-component structural sealant used for van body assembly, foam bonding in aluminum frames, and the like and a preparation method thereof. Background technique [0002] At present, simple epoxy resin adhesives are generally used for sealants used for van body assembly and foam bonding in aluminum frames. Because this adhesive contains hydroxyl active groups and epoxy groups, there is a strong hydrogen bond between them, resulting in greater intermolecular force, greater brittleness, poor flexibility, and poor peel strength of the cured epoxy polymer. Inferior question. Due to the complex application environment of the box body, especially the military van, higher requirements are placed on the quality of the box body, and this simple epoxy resin glue is far from meeting the assembly requirements of the box body. Contents of the invention [0003] Th...

AI Technical Summary

Problems solved by technology

Because this adhesive contains hydroxyl active groups and epoxy groups, there is a strong hydrogen bond between them, resulting in greater intermolecular force, greater brittleness, poor flexibility, and poor peel strength of the cured epoxy polymer. low level problem

Due to the complex application environment of the box body, especially the military van, higher requirements are placed on the quality of the box body, and this simple epoxy resin glue is far from meeting the assembly requirements of the box body