4results about How to "Reduce intermolecular forces" patented technology

The present application relates to a kind of electrolyte additives and its preparation method, belong to electrolyte technical field;The present application uses propenyl-1,3-sulfonic acid lactone as raw material, using the double bond of propenyl-1,3-sulfonic acid lactone and the amino group of 4-amino-2-(trifluoromethyl) thiophene occurs Michael addition reaction under the catalysis of 1,8-diazabicyclo (7-ene) Undecane, obtain the intermediate with tertiary amine structure, then through the quaternary ammonium salt reaction of tertiary amine structure of intermediate and bromo atom of ethyl bromoacetate, obtain additive, the additive of the present application and phosphate ester additive are compounded to obtain electrolyte additive, the present application is modified by propenyl-1,3-sulfonic acid lactone, introduce fluorinated alkyl, effectively reduce intermolecular force, weaken the dependence of electrolyte viscosity on temperature, improve the ionic conductivity of electrolyte under low temperature condition.

The application discloses an ecological and environment-friendly biodegradable fiber and a preparation method thereof. The method is that first, β-cyclodextrin and polyvinyl alcohol (PVA) are subjected to a copolymerization reaction to obtain plasticized modified PVA, then the plasticized modified PVA is used as a skin layer material of the fiber, PBS is used as a core layer material, and the ecological and environment-friendly biodegradable fiber is prepared through a coaxial skin-core spinning method. The ecological and environment-friendly biodegradable fiber prepared by the method has excellent mechanical properties, has the advantage of controllable degradation compared with existing PBS fibers, and has wide market application potential in the field of soft home furnishing which has high requirements on degradation performance.

The invention discloses an internal demoulding polyurethane composite material as well as a preparation method and application thereof, and belongs to the technical field of polyurethane materials. The composite material is prepared by mixing and curing a first component (modified polyurethane containing side chain carboxyl and end group double bonds) and a second component (cyclic polyurethane). The first component is prepared through ring opening esterification of itaconic anhydride, introduced side chain carboxyl effectively reconstructs a hydrogen bond network to enhance the mechanical strength, and end group double bonds promote demolding components to efficiently migrate to a mold interface; the unique end-group-free topological structure of the second component effectively limits excessive slippage of a macromolecular chain segment, and the demolding component is permanently and stably anchored at an interface. The composite material effectively solves the problems that a traditional composite material is difficult to demould and the mechanical property is difficult to consider at the same time, realizes an excellent and lasting internal demoulding effect, greatly improves the tensile strength and toughness of the material, and is especially suitable for preparation of composite materials such as PHC cover plates of automobile trunks and the like.

This invention relates to the field of polymer materials technology, and more particularly to a polyamide-imide polymer, its preparation method, and its applications. This invention uses a polyamide-imide polymer having the structure shown in Formula I to prepare a polyamide-imide film. The polyamide-imide polymer uses 2,2'-di(trifluoromethyl)diaminobiphenyl as a diamine monomer and 5,5'-(1,4-phenylene)bis[hexahydro-4,7-methanolisobenzofuran-1,3-dione] as an anhydride monomer, which is copolymerized with terephthaloyl chloride in different proportions and 2,2'-di(trifluoromethyl)diaminobiphenyl to obtain the polyamide-imide polymer, and then to prepare the polyamide-imide film. The PAI film prepared by this invention has high visible light transmittance, low coefficient of thermal expansion and mechanical properties, and good solubility in most organic solvents, making it easy to process and showing broad application prospects in the optoelectronic field.