Soluble environment-friendly adhesive and preparation process thereof

A preparation process and adhesive technology, which are applied in the field of soluble environment-friendly adhesive and its preparation, can solve the problem of reducing the packing tightness of molecular chain segments, destroying the conjugated system of polymer molecular chains, poor dissolving ability of the adhesive, etc. To solve the problem of low bonding performance, improve bonding performance and improve bonding performance

Inactive Publication Date: 2019-10-08
中著(杭州)知识产权运营有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of soluble environment-friendly adhesive and its preparation process, the adhesive uses benzidine in the main chain of the prepared polyimide, and the benzidine connects the benzene ring through the amide, so that on the main chain Form two connected benzene rings and benzene rings connected by amides, and three benzene rings form an alternating and repeated structure, which makes the entire main chain form a distorted non-fair planar structure. Through dihydroxybenzidine and tetracarboxylic acid diester di The presence of non-fair planes in the interior of the acid chloride monomer and between the monomers distorts the formed polymer molecular chain, destroys the conjugated system of the polymer molecular chain, and effectively reduces the tightness of the molecular chain stacking. degree, thereby reducing the intermolecular force and improving the solubility of the polymer. At the same time, the pyridine ring is introduced into the main chain of the adhesive, and the protonation of t

Method used

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  • Soluble environment-friendly adhesive and preparation process thereof
  • Soluble environment-friendly adhesive and preparation process thereof
  • Soluble environment-friendly adhesive and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The concrete preparation process of dihydroxybiphenyl polyamide is as follows:

[0034] Step 1: Dissolve 1kg of pyromellitic dianhydride in acetone, heat up to 70°C, add 0.48kg of absolute ethanol and 0.1kg of p-toluenesulfonic acid to it, and react under constant temperature reflux for 4-5h, and spin the obtained product Steamed, then washed with deionized water and saturated sodium chloride solution, and then dried in an oven at 50°C to obtain esterified terephthalic acid, because the two anhydride groups in pyromellitic dianhydride The group reacts with ethanol under the catalysis of p-toluenesulfonic acid to generate benzoate and benzoic acid groups;

[0035] Step 2: Add 1kg of the esterified terephthalic acid and acetone prepared in step 1 into the flask, raise the temperature to 80°C and reflux, at the same time add 1.1kg of thionyl chloride to the flask, reflux for 5 hours, and conduct the reaction on the obtained product solution Evaporation and crystallization...

Embodiment 2

[0038] The concrete preparation process of dihydroxybiphenyl polyamide is as follows:

[0039] Step 1: Dissolve 1 kg of pyromellitic dianhydride in acetone, heat up to 70°C, add 0.52 kg of absolute ethanol and 0.1 kg of p-toluenesulfonic acid to it, and react under constant temperature reflux for 4-5 hours, and spin the obtained product steamed, then washed with deionized water and saturated sodium chloride solution, and then dried in an oven at 50°C to obtain esterified terephthalic acid;

[0040] Step 2: Add 1kg of the esterified terephthalic acid and acetone prepared in step 1 into the flask, raise the temperature to 80°C for reflux, and simultaneously add 1.2kg of thionyl chloride to the flask, reflux for 5 hours, and conduct the reaction on the obtained product solution Evaporation and crystallization, and the obtained crystals are washed by absolute ethanol, and then dried in an oven at 50°C to obtain tetracarboxylic acid diester dichlorides. Due to the esterification of...

Embodiment 3

[0043] A preparation process of a soluble environment-friendly adhesive, the specific preparation process is as follows:

[0044] In the first step, 4 kg of the dihydroxybiphenyl polyamide prepared in Example 1 was added to the reaction kettle, and 8 kg of dimethylformamide and 0.4 kg of basic copper carbonate were added to it at the same time, and the temperature was raised to 100° C. to stir for 3 hours, and then Raise the temperature to 120°C for 2 hours, condense and collect the decomposed ethanol during the reaction, cool to room temperature after the reaction is complete, then filter, wash and dry with acetone to obtain dihydroxybiphenyl polyimide;

[0045] In the second step, 5kg of 3-hydroxy-2-pyridinecarboxylic acid was added to acetone, the temperature was raised to 80°C and refluxed, then 5.9kg of thionyl chloride was added to it, and the reaction was carried out under constant temperature reflux for 5 hours, and then 3-hydroxy-2 - picolinoyl chloride; add thionyl c...

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Abstract

The invention discloses a soluble environment-friendly adhesive. The soluble environment-friendly adhesive comprises the following raw material components: 40-45 parts of dihydroxybiphenyl polyamide,80-90 parts of dimethylformamide, 4-7 parts of basic cupric carbonate, 34-38 parts of siloxane hydroxypyridine, 30-34 parts of boric acid and 120-130 parts of a solvent. The prepared adhesive not onlycan maintain the physical form at a high temperature of 500 DEG C for normal use, but also can be dissolved directly in an ethanol solvent at the same time; and meanwhile the bonding performance is high, and the peeling strength of the adhesive reaches 21.6 N.cm<-1>.

Description

technical field [0001] The invention belongs to the field of adhesive preparation, and relates to a soluble environment-friendly adhesive and a preparation process thereof. Background technique [0002] As a high temperature resistant material, polyimide is widely used in various fields. At the same time, polyimide has an aromatic ring as the main chain, which has extremely high conjugation, is difficult to dissolve in common polar solvents, and has poor processing and molding properties. , at the same time, for the existing polyimide adhesive, due to its high heat resistance, it can be used normally at 350°C, but it cannot be realized for higher temperatures. At the same time, the existing adhesive Solidify after use, and then after a long time of use, if the bonding part needs to be separated, it needs to be carried out by mechanical means, and the adhesive pasted on the bonding part after separation still remains, which is not conducive to the reuse of the object. Conte...

Claims

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Application Information

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IPC IPC(8): C08G69/32C08G69/26
CPCC08G69/26C08G69/32
Inventor 周佳佳
Owner 中著(杭州)知识产权运营有限公司
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