21results about How to "Improve bonding performance" patented technology

The invention discloses an IPN multi-element heat-conducting structural adhesive resistant to high and low temperature damp heat and a preparation method thereof, and belongs to the field of IPN multi-element structural adhesives. The structural adhesive is prepared by matching a component A and a component B according to a volume ratio of 0.9: 1.1-1, the component A is prepared from the following raw materials in parts by weight: 10 to 20 parts of silane modified polyether resin A, 10 to 20 parts of silane modified polyether resin B, 2 to 5 parts of amino-containing silane coupling agent, 0.1 to 0.5 part of catalyst, 1 to 2 parts of epoxy curing agent A, 0.5 to 1 part of self-made epoxy curing agent B, 0.1 to 1 part of catalyst, 1 to 3 parts of first aid, 0.01 to 0.03 part of color paste and 50 to 70 parts of first heat-conducting filler; the component B is prepared from the following raw materials: 10 to 20 parts of epoxy resin A, 5 to 10 parts of self-made epoxy resin B, 5 to 10 parts of reactive diluent, 50 to 70 parts of second heat-conducting filler, 0.1 to 1 part of second aid, 0.01 to 0.03 part of color paste and 1 to 1.5 parts of water. The adhesive is environment-friendly in component, has excellent heat-conducting property and excellent operation performance, is smooth in construction, and can be used for firmly bonding a base material.

The invention provides a heat-conducting vegetable protein-based composition, a heat-conducting vegetable protein adhesive as well as a preparation method and application of the heat-conducting vegetable protein-based composition and the heat-conducting vegetable protein adhesive. The heat-conducting vegetable protein-based composition provided by the invention is prepared by ball-milling raw materials including a heat-conducting filler, modified vegetable protein and (3-(methacrylamido) propyl) trimethyl ammonium chloride in a mass ratio of 1: (0.3-5): (0.03-1) for 15-25 hours. The heat-conducting vegetable protein adhesive comprises the following raw materials in percentage by weight: 6-20% of the heat-conducting vegetable protein-based composition and 3-8% of a cross-linking agent, and further comprises 0.1-3% of a flame-retardant reinforcing agent on the basis of the heat-conducting vegetable protein-based composition and the cross-linking agent. The heat-conducting vegetable protein adhesive provided by the invention adopts the heat-conducting vegetable protein-based composition, has good cementing performance and water resistance, also has good heat conductivity, flame retardance and mildew resistance, is beneficial to preparation of multifunctional materials, and is beneficial to industrial application, especially in the field of artificial board industry.

The invention discloses a bamboo-wood plywood, which is formed by gluing a bamboo strip curtain layer, a wood veneer layer, a bamboo mat layer, and an impregnated paper layer. The wood veneer layer, the bamboo mat layer, and the impregnated paper layer are symmetrically arranged on both sides of the bamboo strip curtain layer in sequence. The bamboo strip curtain layer is woven from radial bamboo strips without removing bamboo green and bamboo yellow, and the bamboo mat layer is woven from chordal bamboo strips with bamboo green and bamboo yellow removed by warp and weft interweaving. The invention also discloses a preparation method of the bamboo-wood plywood. The invention has the advantages of high production efficiency, few hot pressing defects, suitable density, excellent mechanical properties, and the like.

The invention relates to the technical field of gluing printing, in particular to a high-temperature-resistant insulating protective film gluing printing technology which comprises a PET film and a PI film, the PET film and the PI film are connected through UV gluing, and the high-temperature-resistant insulating protective film gluing printing technology is implemented through gluing printing equipment. The PET film and the PI film are connected through the UV gluing technology, the PET film is known as good mechanical strength and weather resistance, the PI film has high temperature resistance and insulation performance, the high-temperature-resistant insulation protective film is obtained through combination of the PET film and the PI film, and the stability in the electrical insulation and high-temperature environment is excellent. In addition, PI has the characteristic of high temperature resistance, PET has the characteristic of insulation, and the PI film and the PET film are tightly laminated through UV glue coating, so that the product has the double-layer characteristics of fire prevention and insulation.

The invention belongs to the technical field of foaming door gluing, and discloses foaming door gluing discharging equipment which comprises a conveying frame body, a side face limiting assembly is installed at one end of the conveying frame body, a pair of vertical sliding rails is fixedly connected to one end of the conveying frame body, and a bottom supporting assembly is slidably connected to the middles of the vertical sliding rails. An adjusting assembly is arranged in the middle of the bottom supporting assembly. Through cooperation of the adjusting assembly and other structures, the transverse position of the plate can be adjusted conveniently, the conveying roller drives the adjusting roller to rotate towards the side baffle through the friction transmission roller, the gear transmission shaft and the rotating shaft, and the adjusting roller pushes the plate to move towards the side baffle till the plate is tightly attached to the side baffle; and through cooperation of structures such as the bottom supporting assembly and the adjusting assembly, the conveying rollers can continue to run conveniently when the position of the plate is adjusted.

The invention relates to the technical field of phenolic resin, in particular to dialdehyde cellulose-based phenolic resin and a preparation method thereof. The dialdehyde cellulose-based phenolic resin is prepared from dialdehyde cellulose, phenol, formaldehyde and a basic catalyst. According to the invention, the dialdehyde cellulose prepared from renewable biomass resource cellulose is used for replacing part of formaldehyde to prepare the dialdehyde cellulose-based phenolic resin, so that the use amount of formaldehyde can be reduced by 20%, and the production cost and material toxicity of the phenolic resin are reduced. Meanwhile, the dialdehyde cellulose-based phenolic resin prepared by the method disclosed by the invention has excellent bonding performance and thermal stability. Technical support is provided for solving the problems that biomass components are difficult to utilize, phenolic resin raw materials excessively depend on non-renewable resources, the bonding performance is not ideal and the like, and great application and popularization value is achieved.

The utility model belongs to semiconductor top high heat dissipation chip packaging technical field discloses a kind of pinless top heat dissipation product frame design structure, through the frame pin front half-etching structure is set and cooperate back face shallow etching design, pin heat dissipation efficiency and mechanical strength are significantly improved;Frame base island back half-etching U type glue tank of preventing overflow effectively prevents plastic encapsulation material overflow, front plum blossom Dimple substantially increases heat dissipation area and strengthens plastic encapsulation material binding force, base island edge locking step further enhances interface reliability;Silver plating layer in welding area optimizes current transmission and bonding performance.The above structure synergistic effect realizes efficient heat dissipation path optimization in limited space, completely solves the problems, such as traditional packaging heat dissipation capacity deficiency, interface delamination and overflow risk, especially suitable for the stable operation of high power density semiconductor device.

The present invention relates to a thin film bulk acoustic wave resonator and a manufacturing method thereof, wherein the thin film bulk acoustic wave resonator comprises: a first substrate provided with a first cavity; a piezoelectric laminate structure, comprising a first electrode, a piezoelectric layer and a second electrode stacked in sequence from bottom to top, the piezoelectric layer covers the first cavity, the edges of the first electrode and the second electrode are both located within the boundary of the area enclosed by the first cavity, and the effective resonance area comprises an area where the first electrode, the piezoelectric layer and the second electrode overlap each other in a direction perpendicular to the surface of the piezoelectric layer; a first electrode lead-out structure, connecting the edge of the first electrode and extending to the invalid resonance area as a first signal connection end, and enclosing a first gap with the piezoelectric laminate structure at the edge of the effective resonance area; a second electrode lead-out structure, connecting the edge of the second electrode and extending to the invalid resonance area as a second signal connection end, and enclosing a second gap with the piezoelectric laminate structure at the edge of the effective resonance area. The present invention improves the Q value by eliminating the boundary clutter of the effective resonance area.

The embodiment of the present application provides a composite film and a preparation method thereof, wherein the composite film comprises a substrate, a first isolation layer, a second isolation layer and a functional film layer, wherein the first isolation layer, the second isolation layer and the functional film layer are sequentially stacked from bottom to top on the surface of the substrate, and the first isolation layer and the second isolation layer are made of the same material, and the diameter of the second isolation layer is smaller than the diameter of the first isolation layer. The present application will make the bonding force between the first isolation layer and the second isolation layer stronger, so that the bonding body formed by the substrate and the functional substrate has a better bonding effect, and thus the composite film formed by peeling off the bonding body has better structural strength and stability.

The invention discloses a hot melt adhesive for cigarettes and a preparation method thereof, and belongs to the technical field of preparation of special adhesives, the hot melt adhesive for cigarettes comprises the following components: ethylene-vinyl acetate copolymer resin, ethylene-octene copolymer resin, hydrogenated petroleum resin, polyethylene wax, pentalyn and an antioxidant; wherein the ethylene-octylene copolymer resin is copolymer resin with a random copolymer of ethylene-octylene as a main chain and homo-polyethylene as a branch chain, the viscosity of a hot melt adhesive melt can be remarkably improved, the flowability and curing rate of the hot melt adhesive are improved, and the bonding performance of the hot melt adhesive is improved; and the basic hot melt adhesive condition of high-speed operation of the bag sealing and packaging machine can be well met.

The invention relates to the technical field of recycling of waste UV coatings, in particular to a method for preparing a composite adhesive material by using waste cured microparticles and the composite adhesive material. The method for preparing the composite adhesive material by using the waste cured microparticles comprises the following steps: mixing 8-20% by mass of waste cured microparticles and 80-92% by mass of polyvinyl acetate emulsion, and uniformly stirring to obtain the composite adhesive material. Waste cured microparticles obtained after UV coating polishing and polyvinyl acetate emulsion are subjected to physical blending modification, the waste cured microparticles can replace inorganic filler added in a polyvinyl acetate adhesive, a large number of waste cured microparticles generated in coating industry processing are effectively recycled, and pollution of solid waste to the environment is reduced; the production cost of an enterprise is reduced; compared with the conventional polyvinyl acetate adhesive, the polyvinyl acetate adhesive has the advantages that the solid content and the bonding performance are improved to a certain extent.

The invention relates to biological glue and a biological wood and grass health board applying the biological glue, and relates to the technical field of biological glue, the biological glue comprises the following components by mass: 40-60 parts of composite polyol, 15-30 parts of hexamethylene diisocyanate, 5-15 parts of herbal microcapsules, 10-20 parts of organosilicon modified epoxy resin, 3-8 parts of a chain extender, 0.01-0.02 part of a catalyst, and 1-5 parts of an emulsifier. The biological glue prepared in the invention has good bonding performance, can effectively improve the bonding strength and antibacterial performance of the biological wood and grass health board, reduces the release amount of formaldehyde, and meets the requirements of users for high-quality functional products.

The utility model discloses glue pressing equipment for wooden furniture processing, which belongs to the technical field of wooden furniture processing, and comprises a base, the top of the base is respectively connected with a support frame and two support plates, the top of the support frame is provided with a positioning mechanism, and the same gluing mechanism is arranged between the two support plates. A fixing mechanism is arranged at the top of the base; according to the utility model, the positioning mechanism is arranged, the air cylinder ejector rod drives the pressing plate to downwards extrude the upper closing plate, the first limiting block drives the positioning frame and the connecting plate to downwards move, and when the connecting plate moves to be blocked by the telescopic rod fixing part, the positioning frame is just aligned with the lower closing plate at the moment, and the pressing plate continuously extrudes the upper closing plate at the moment; and a first limiting block is driven to move into a first sliding groove, so that a pressing plate can press an upper plywood to the top of a lower plywood, the upper plywood and the lower plywood can be precisely glued, dislocation in the gluing process is avoided, and the gluing effect is improved.

This invention discloses a high-strength, flame-retardant, and moisture-proof furniture board and its preparation method, relating to the field of furniture board technology. The board produced by this invention uses bamboo as raw material, which is processed into wood shavings. Urea-formaldehyde resin, nanocellulose made from waste materials during bamboo shavings processing, a waterproofing agent, and a flame retardant are added, and the board is then hot-pressed and laid together. Hydroxymethylated sodium lignosulfonate and melamine are added to the urea-formaldehyde resin to improve its performance. The board is laid by horizontally laying the core layer of wood shavings and vertically laying the surface layer of wood shavings, followed by a surface-core-surface layer arrangement to obtain a furniture board.

The present invention relates to a gallium aluminum arsenic epitaxial alloy and a preparation method thereof, comprising: a gallium aluminum arsenic epitaxial layer; a first oxide layer, the first oxide layer comprising a plurality of first windows and first bumps formed by one-time photolithography, the first windows and the first bumps being spaced apart; a first metal layer; a second oxide layer, the second oxide layer comprising a plurality of second windows and second bumps formed by secondary photolithography, the second windows and the second bumps being spaced apart, the first windows and the second windows being staggered in a vertical direction; and a second metal layer. An alloy method based on gallium aluminum arsenic epitaxial alloy is used to improve the contact between gallium aluminum arsenic epitaxial and metal layer through a high-density oxide layer, which has excellent bonding performance between metal and gallium aluminum arsenic material, improves the ohmic contact between the metal layer and the epitaxial layer, and reduces the risk of electrode detachment.

The invention relates to an auxiliary device for testing the bonding performance of a micro-fluidic chip, belongs to the technical field of chip testing, and solves the problem that the bonding performance of the micro-fluidic chip is difficult to test in the prior art. The auxiliary device comprises an air pressure generation module, an air pressure branching and control module, a chip interface module and an air pressure detection module. The air pressure branching and control module can divide the air pressure generated by the air pressure generation module into multiple paths, and meanwhile pressure control is conducted on multiple paths of air pressure branches. The chip interface module is communicated with the air pressure branch and control module and the air pressure detection module through a plurality of air pressure inlets and a plurality of air pressure outlets, and an internal flow channel of the micro-fluidic chip is connected between the air pressure inlet and the air pressure outlet of the chip interface module. The bonding performance of the micro-fluidic chip can be judged by detecting the pressure before and after the gas flows through the micro-fluidic chip.

The utility model relates to a rotary cutter driving roller main body structure which comprises a driving shaft which is transversely and rotatably connected to a rotary cutter rack, a plurality of disc-shaped compression rollers are installed on the driving shaft in the axial direction at intervals, fluted discs are installed on one sides of the disc-shaped compression rollers in an attached mode, and convex teeth of the fluted discs protrude out of the circumferential faces of the disc-shaped compression rollers. The driving roller is compact in structure, and concave points can be formed on wood sheets which are rotationally cut.

The application belongs to the technical field of semiconductor packaging, and particularly relates to a device and method for shaping and bonding of a carrier tape flip solder metal electrode; the method comprises the following steps: positioning and sleeving an integrated device of a metal electrode and PI into a lower mold according to a positioning pin; sequentially sleeving springs on all guide pins of the lower mold; placing an upper mold on the lower mold so that guide pin through holes of the upper mold are aligned with the guide pins; vertically applying pressure to a middle position of the upper mold, and alternately tightening the pressure screws; when the gap between the upper mold and the lower mold is 2mm, stop tightening the pressure screws; placing a shaping clamp in the center of a pressure test table, and tightly pressing the upper and lower molds with a pressure of 150N; alternately tightening two fixing screws, and taking the shaping clamp off the test table when the feedback force is within the range of 150N+5N; the application has the characteristics of high efficiency, reliability, simplicity, practicality, good alignment, and effective reduction of welding stress.

The invention relates to a magnesian ramming material for a continuous casting tundish and a preparation method of the magnesian ramming material. The magnesian ramming material comprises the following components in parts by weight: 70-90 parts of natural forsterite; 50 to 65 parts of medium-grade sintered magnesia; 25 to 40 parts of fused magnesite; 5-10 parts of phenolic resol; 3-5 parts of metal silicon powder; 2-3 parts of alumina micro powder; and 1-3 parts of chromium oxide green powder. The preparation method comprises the following steps: adding the natural forsterite, the medium-grade magnesite clinker and the fused magnesite into a stirrer according to the proportion, and stirring; then adding the metal silicon powder, the alumina micro powder and the chromium oxide green powder into a stirrer for stirring; finally, adding phenolic resol to form a mixture; and pouring the mixture into a mold, and ramming and sintering. According to the invention, a certain amount of chromium oxide green powder is added, and the chromium oxide green powder has relatively high fluidity and dispersibility, can be well filled in a mixed material, and is combined with the phenolic resol to enhance the gluing effect of the phenolic resol, so that the prepared ramming material has very good erosion resistance and erosion resistance.

The utility model relates to a bonding chopper. The bonding chopper comprises a main body, and the main body is provided with a through hole penetrating through the main body in the axis direction of the main body. The head portion of the body is provided with an end face intersecting with the inner circumferential surface of the through hole, the end face is composed of protruding parts and concave parts which are distributed alternately, and the cross section of each concave part formed between every two adjacent protruding parts is in a V shape.