5results about How to "Improve bonding performance" patented technology

The invention relates to the technical field of phenolic resin, in particular to dialdehyde cellulose-based phenolic resin and a preparation method thereof. The dialdehyde cellulose-based phenolic resin is prepared from dialdehyde cellulose, phenol, formaldehyde and a basic catalyst. According to the invention, the dialdehyde cellulose prepared from renewable biomass resource cellulose is used for replacing part of formaldehyde to prepare the dialdehyde cellulose-based phenolic resin, so that the use amount of formaldehyde can be reduced by 20%, and the production cost and material toxicity of the phenolic resin are reduced. Meanwhile, the dialdehyde cellulose-based phenolic resin prepared by the method disclosed by the invention has excellent bonding performance and thermal stability. Technical support is provided for solving the problems that biomass components are difficult to utilize, phenolic resin raw materials excessively depend on non-renewable resources, the bonding performance is not ideal and the like, and great application and popularization value is achieved.

The utility model belongs to semiconductor top high heat dissipation chip packaging technical field discloses a kind of pinless top heat dissipation product frame design structure, through the frame pin front half-etching structure is set and cooperate back face shallow etching design, pin heat dissipation efficiency and mechanical strength are significantly improved;Frame base island back half-etching U type glue tank of preventing overflow effectively prevents plastic encapsulation material overflow, front plum blossom Dimple substantially increases heat dissipation area and strengthens plastic encapsulation material binding force, base island edge locking step further enhances interface reliability;Silver plating layer in welding area optimizes current transmission and bonding performance.The above structure synergistic effect realizes efficient heat dissipation path optimization in limited space, completely solves the problems, such as traditional packaging heat dissipation capacity deficiency, interface delamination and overflow risk, especially suitable for the stable operation of high power density semiconductor device.

This invention discloses a high-strength, flame-retardant, and moisture-proof furniture board and its preparation method, relating to the field of furniture board technology. The board produced by this invention uses bamboo as raw material, which is processed into wood shavings. Urea-formaldehyde resin, nanocellulose made from waste materials during bamboo shavings processing, a waterproofing agent, and a flame retardant are added, and the board is then hot-pressed and laid together. Hydroxymethylated sodium lignosulfonate and melamine are added to the urea-formaldehyde resin to improve its performance. The board is laid by horizontally laying the core layer of wood shavings and vertically laying the surface layer of wood shavings, followed by a surface-core-surface layer arrangement to obtain a furniture board.

The invention relates to an auxiliary device for testing the bonding performance of a micro-fluidic chip, belongs to the technical field of chip testing, and solves the problem that the bonding performance of the micro-fluidic chip is difficult to test in the prior art. The auxiliary device comprises an air pressure generation module, an air pressure branching and control module, a chip interface module and an air pressure detection module. The air pressure branching and control module can divide the air pressure generated by the air pressure generation module into multiple paths, and meanwhile pressure control is conducted on multiple paths of air pressure branches. The chip interface module is communicated with the air pressure branch and control module and the air pressure detection module through a plurality of air pressure inlets and a plurality of air pressure outlets, and an internal flow channel of the micro-fluidic chip is connected between the air pressure inlet and the air pressure outlet of the chip interface module. The bonding performance of the micro-fluidic chip can be judged by detecting the pressure before and after the gas flows through the micro-fluidic chip.

The application belongs to the technical field of semiconductor packaging, and particularly relates to a device and method for shaping and bonding of a carrier tape flip solder metal electrode; the method comprises the following steps: positioning and sleeving an integrated device of a metal electrode and PI into a lower mold according to a positioning pin; sequentially sleeving springs on all guide pins of the lower mold; placing an upper mold on the lower mold so that guide pin through holes of the upper mold are aligned with the guide pins; vertically applying pressure to a middle position of the upper mold, and alternately tightening the pressure screws; when the gap between the upper mold and the lower mold is 2mm, stop tightening the pressure screws; placing a shaping clamp in the center of a pressure test table, and tightly pressing the upper and lower molds with a pressure of 150N; alternately tightening two fixing screws, and taking the shaping clamp off the test table when the feedback force is within the range of 150N+5N; the application has the characteristics of high efficiency, reliability, simplicity, practicality, good alignment, and effective reduction of welding stress.