Chopper for improving bonding strength of lead

A technology of wire bonding and riving, which is applied in the field of riving, can solve the problems of insufficient bonding strength of wire and wire, insufficient surface roughness, easy wear, etc., and achieve reduced gold retention at the tip, good bonding effect, and smoothness high effect

Active Publication Date: 2018-08-10
CHAOZHOU THREE CIRCLE GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are common disadvantages such as easy wear, short life, insufficient surface roughness

Method used

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  • Chopper for improving bonding strength of lead
  • Chopper for improving bonding strength of lead
  • Chopper for improving bonding strength of lead

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] Example 1

[0033] An embodiment of the wedge for improving the wire bonding strength of the present invention. The scanning electron micrograph of the end surface of the wedge for improving the wire bonding strength of this embodiment is as follows: figure 1 As shown, the 3D laser microscope photo of the end face of the wedge is shown as figure 2 As shown, the partial drawing of the tip surface structure of the wedge tip is as image 3 As shown, a structural diagram of the wedge is as Figure 4 Shown:

[0034] The riving knife is a welding ceramic riving knife. The riving knife includes a body 41, a welding tip 42 at one end of the body, and a hole 43. The hole 43 extends along the longitudinal axis of the body 41 and the welding tip 42. The tip surface of the welding tip 42 is formed by The convex parts 1 and the concave parts 2 are alternately distributed; the convex parts 1 and the concave parts 2 are evenly and alternately distributed; the highest point of the convex pa...

Example Embodiment

[0035] Example 2

[0036] An embodiment of the wedge for improving the wire bonding strength of the present invention. The scanning electron micrograph of the end surface of the wedge for improving the wire bonding strength of this embodiment is as follows: figure 1 As shown, the 3D laser microscope photo of the end face of the wedge is shown as figure 2 As shown, the partial drawing of the tip surface structure of the wedge tip is as image 3 As shown, a structural diagram of the wedge is as Figure 4 Shown:

[0037] The riving knife is a welding ceramic riving knife. The riving knife includes a body 41, a welding tip 42 at one end of the body, and a hole 43. The hole 43 extends along the longitudinal axis of the body 41 and the welding tip 42. The tip surface of the welding tip 42 is formed by The convex parts 1 and the concave parts 2 are alternately distributed; the convex parts 1 and the concave parts 2 are evenly and alternately distributed; the highest point of the convex pa...

Example Embodiment

[0038] Example 3

[0039] An embodiment of the wedge for improving the wire bonding strength of the present invention. The scanning electron micrograph of the end surface of the wedge for improving the wire bonding strength of this embodiment is as follows: figure 1 As shown, the 3D laser microscope photo of the end face of the wedge is shown as figure 2 As shown, the partial drawing of the tip surface structure of the wedge tip is as image 3 As shown, a structural diagram of the wedge is as Figure 4 Shown:

[0040] The riving knife is a welding ceramic riving knife. The riving knife includes a body 41, a welding tip 42 at one end of the body, and a hole 43. The hole 43 extends along the longitudinal axis of the body 41 and the welding tip 42. The tip surface of the welding tip 42 is formed by The convex parts 1 and the concave parts 2 are alternately distributed; the convex parts 1 and the concave parts 2 are evenly and alternately distributed; the highest point of the convex pa...

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Abstract

The invention discloses a chopper for improving bonding strength of a lead. The chopper is a welding ceramic chopper and comprises a body, a welding nozzle and a hole, wherein the welding nozzle is arranged at one end of the body, the hole extends along a longitudinal axis of the body and the welding nozzle, and a tip surface of the welding nozzle comprises convex parts and concave parts which arealternatively distributed. By the design of a chopper surface structure, the wear-resistant region of the surface can be expanded, the hardness of the tip surface is improved, the roughness of the surface is improved, and the service lifetime is prolonged; compared with a traditional polishing and thermal processing chopper, the chopper has the advantages of better bonding effect and higher stability; on one hand, the gold reservation degree of a tip is effectively reduced by the design; and on the other hand, the wear-resistant degree of a porcelain nozzle is improved, and thus, the servicelifetime of the porcelain nozzle is prolonged.

Description

technical field [0001] The invention relates to a rivet, in particular to a rivet for improving wire bonding strength. Background technique [0002] In the production and packaging of semiconductor devices, wire bonding has been the primary method of providing electrical interconnection between two locations within a package (eg, between a die pad of a semiconductor die and the wires of a lead frame). To form the wire loops to provide this interconnection, a bonding tip or a rivet is typically used, using a bonding tool with effective ultrasonic energy transmission characteristics between the wire and the semiconductor device. [0003] Conventional horns or riving knives typically have ground surfaces. This ground surface includes the tip portion of the horn. However, there are ubiquitous shortcomings such as easy wear, short life, insufficient surface roughness, scratches on the inner hole of the riving knife, and insufficient bonding strength of the welding wire. Theref...

Claims

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Application Information

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IPC IPC(8): H01L21/607
CPCH01L2224/78301H01L2224/78303H01L24/85H01L2224/85205
Inventor 黄雪云
Owner CHAOZHOU THREE CIRCLE GRP
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