Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chopper for improving bonding strength of lead

A technology of wire bonding and riving, which is applied in the field of riving, can solve the problems of insufficient bonding strength of wire and wire, insufficient surface roughness, easy wear, etc., and achieve reduced gold retention at the tip, good bonding effect, and smoothness high effect

Active Publication Date: 2018-08-10
CHAOZHOU THREE CIRCLE GRP
View PDF3 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are common disadvantages such as easy wear, short life, insufficient surface roughness, scratches on the inner hole of the chopper, and insufficient bonding strength of the wire and lead.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chopper for improving bonding strength of lead
  • Chopper for improving bonding strength of lead
  • Chopper for improving bonding strength of lead

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A kind of embodiment of the capillary that improves wire bonding strength described in the present invention, the scanning electron microscope photo of the end face surface of the capillary that improves wire bonding strength described in this embodiment is as follows figure 1 As shown, the 3D laser microscope photo of the end face of the chopper is as follows figure 2 As shown, the local structure of the tip surface of the chopper tip is shown in image 3 As shown, a structural diagram of the chopper is shown in Figure 4 Shown:

[0034] The rivet is a welding ceramic rivet, and the rivet includes a body 41, a welding nozzle 42 at one end of the body and a hole 43, the hole 43 extends along the longitudinal axis of the body 41 and the welding nozzle 42, and the tip surface of the welding nozzle 42 is formed by Composed of alternately distributed convex parts 1 and concave parts 2; the convex parts 1 and the concave parts 2 are uniformly and alternately distributed; ...

Embodiment 2

[0036] A kind of embodiment of the capillary that improves wire bonding strength described in the present invention, the scanning electron microscope photo of the end face surface of the capillary that improves wire bonding strength described in this embodiment is as follows figure 1 As shown, the 3D laser microscope photo of the end face of the chopper is as follows figure 2 As shown, the local structure of the tip surface of the chopper tip is shown in image 3 As shown, a structural diagram of the chopper is shown in Figure 4 Shown:

[0037] The rivet is a welding ceramic rivet, and the rivet includes a body 41, a welding nozzle 42 at one end of the body and a hole 43, the hole 43 extends along the longitudinal axis of the body 41 and the welding nozzle 42, and the tip surface of the welding nozzle 42 is formed by Composed of alternately distributed convex parts 1 and concave parts 2; the convex parts 1 and the concave parts 2 are uniformly and alternately distributed; ...

Embodiment 3

[0039] A kind of embodiment of the capillary that improves wire bonding strength described in the present invention, the scanning electron microscope photo of the end face surface of the capillary that improves wire bonding strength described in this embodiment is as follows figure 1 As shown, the 3D laser microscope photo of the end face of the chopper is as follows figure 2 As shown, the local structure of the tip surface of the chopper tip is shown in image 3 As shown, a structural diagram of the chopper is shown in Figure 4 Shown:

[0040] The rivet is a welding ceramic rivet, and the rivet includes a body 41, a welding nozzle 42 at one end of the body and a hole 43, the hole 43 extends along the longitudinal axis of the body 41 and the welding nozzle 42, and the tip surface of the welding nozzle 42 is formed by Composed of alternately distributed convex parts 1 and concave parts 2; the convex parts 1 and the concave parts 2 are uniformly and alternately distributed; ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Heightaaaaaaaaaa
Lateral distanceaaaaaaaaaa
Roughnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a chopper for improving bonding strength of a lead. The chopper is a welding ceramic chopper and comprises a body, a welding nozzle and a hole, wherein the welding nozzle is arranged at one end of the body, the hole extends along a longitudinal axis of the body and the welding nozzle, and a tip surface of the welding nozzle comprises convex parts and concave parts which arealternatively distributed. By the design of a chopper surface structure, the wear-resistant region of the surface can be expanded, the hardness of the tip surface is improved, the roughness of the surface is improved, and the service lifetime is prolonged; compared with a traditional polishing and thermal processing chopper, the chopper has the advantages of better bonding effect and higher stability; on one hand, the gold reservation degree of a tip is effectively reduced by the design; and on the other hand, the wear-resistant degree of a porcelain nozzle is improved, and thus, the servicelifetime of the porcelain nozzle is prolonged.

Description

technical field [0001] The invention relates to a rivet, in particular to a rivet for improving wire bonding strength. Background technique [0002] In the production and packaging of semiconductor devices, wire bonding has been the primary method of providing electrical interconnection between two locations within a package (eg, between a die pad of a semiconductor die and the wires of a lead frame). To form the wire loops to provide this interconnection, a bonding tip or a rivet is typically used, using a bonding tool with effective ultrasonic energy transmission characteristics between the wire and the semiconductor device. [0003] Conventional horns or riving knives typically have ground surfaces. This ground surface includes the tip portion of the horn. However, there are ubiquitous shortcomings such as easy wear, short life, insufficient surface roughness, scratches on the inner hole of the riving knife, and insufficient bonding strength of the welding wire. Theref...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/607
CPCH01L2224/78301H01L2224/78303H01L24/85H01L2224/85205
Inventor 黄雪云
Owner CHAOZHOU THREE CIRCLE GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com