The application belongs to the technical field of
semiconductor, and provides a power device resistant to single event
burnout and a preparation method thereof. The power device resistant to single event
burnout comprises a
semiconductor substrate, an N-type buffer layer, an N-type drift layer, an
electron transport layer, a P-type base layer, a first gate insulating layer, a second gate insulating layer, a first gate material layer, a second gate material layer, a source doped region, a source
metal layer, a P-type heavily doped region and a drain
metal layer. The P-type heavily doped region and the
electron transport layer are arranged, so that a high-concentration body
diode can be formed at the position where the P-type heavily doped region and the
electron transport layer are in contact, more holes flow to the P-type heavily doped region rather than the P-type well region, the parasitic NPN
triode of the power device is prevented from being turned on, the
current density in the power device is reduced, and the single event
burnout resistance of the power device can be significantly improved without sacrificing the basic electrical characteristics.