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Wafer vacuum bonding machine and bonding method

A vacuum bonding machine and wafer technology, applied in the field of microelectronics, can solve the problems of complex structure and high cost

Active Publication Date: 2015-02-18
ZHEJIANG MICROTECH MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the material requirements of the wafer itself, the requirements for wafer bonding are very high. It is required that the two wafers can be perfectly bonded together without bubbles. If there is no bubble during wafer bonding, then it must be bonded in a vacuum The bonding is completed in a vacuum environment, but the two wafers are required to be perfectly aligned during the wafer bonding process. The existing wafer bonding system generally uses a manipulator in a vacuum environment to achieve the position correspondence of the two wafers. The structure complex and expensive

Method used

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  • Wafer vacuum bonding machine and bonding method
  • Wafer vacuum bonding machine and bonding method

Examples

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Embodiment

[0048] Embodiment: In this embodiment, two wafers with a thickness of more than 0.3 mm and a diameter of 200 mm are used, and the bonding steps are as follows:

[0049] S1. Put the first wafer coated with bonding glue on the tray;

[0050] S2. Control multiple positioning blocks to advance toward the pallet through the cylinder, and position the first wafer at the center;

[0051] S3. Place the second wafer on the positioning block support, then close the cover to close the press, and evacuate;

[0052] S4, when the vacuum degree reaches 10 Pa, control multiple positioning blocks to retreat, and the second wafer falls from the positioning block support to the first wafer;

[0053] S5, the multiple positioning blocks are controlled by the cylinder to advance toward the tray again, and the two wafers are positioned to completely overlap the edges of the two wafers;

[0054] S6. The pressing plate is controlled downward by the press, so that the first wafer and the second wafer...

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Abstract

The invention discloses a wafer vacuum bonding machine and a wafer vacuum bonding method. The wafer vacuum bonding method includes: limiting the position of a first wafer after a positioning block moves forwards for the first time, and then placing a second wafer, performing vacuum pumping, enabling the second wafer to fall onto the first wafer under vacuum status when the positioning block is retreated, and afterwards, simultaneously limiting the position of the second wafer and the first wafer by moving the positioning block forwards, pressing the first wafer and the second wafer together, and finally retreating the positioning block after pressing the first wafer and the second wafer together. Accordingly, the wafer vacuum bonding machine and the wafer vacuum bonding method can guarantee that the positions of the two wafers are perfectly corresponding when the two wafers are pressed together. The wafer vacuum bonding machine is simple in structure, convenient to operate, low in cost, and capable of achieving perfect bonding for the wafers.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a wafer vacuum bonding machine and a bonding method. Background technique [0002] Wafer bonding refers to bringing two wafers into close enough contact so that they can be firmly bonded together. The current wafer bonding technology requires a special wafer bonding system to achieve. Due to the material requirements of the wafer itself, the requirements for wafer bonding are very high. It is required that the two wafers can be perfectly bonded together without bubbles. If no bubbles are required during wafer bonding, then it must be bonded in a vacuum The bonding is completed in a vacuum environment, but the two wafers are required to be perfectly aligned during the wafer bonding process. The existing wafer bonding system generally uses a manipulator in a vacuum environment to achieve the position correspondence of the two wafers. The structure Complicated and expensiv...

Claims

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Application Information

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IPC IPC(8): H01L21/603
CPCH01L24/741H01L24/80H01L21/68
Inventor 尹明唐昊
Owner ZHEJIANG MICROTECH MATERIAL CO LTD
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