12results about How to "Package structure is simple" patented technology

The invention relates to a packaging electrode, a manufacturing method thereof and a semiconductor packaging device. The manufacturing method comprises the steps that a diamond composite metal base layer is prepared, a first alloy layer and a second alloy layer are formed on the upper side surface and the lower side surface of the diamond composite metal base layer respectively, and a conductive flange is formed on the side wall of the diamond composite metal base layer; the diamond composite metal base layer, the first alloy layer, the second alloy layer and the conductive flange are of an integrated structure. The surfaces, deviating from the diamond composite metal base layer, of the first alloy layer and the second alloy layer are machining surfaces and are used for being in direct contact with a chip; the flange welding surface of the conductive flange is free of diamond composition. According to the invention, the forming quality and performance of the large-size packaging electrode can be improved, so that the packaging reliability of the semiconductor packaging device can be effectively improved.

The invention provides a packaging structure, an optical module and optical communication equipment, the packaging structure is a transistor-shaped packaging structure, and the packaging structure comprises a tube cap which is provided with a transparent window; the tube seat is matched with the tube cap to form a cavity structure; the HCSEL chip is arranged in the cavity structure, the plane where the HCSEL chip is located is parallel to the bearing surface of the tube seat, and an optical signal emitted by the HCSEL chip faces the transparent window; wherein a detection unit is arranged in the HCSEL chip, and the detection unit is used for detecting the power of an optical signal emitted by the HCSEL chip. The horizontal cavity surface laser chip integrated with the detection unit is arranged in the packaging structure, so that the most simplified packaging form is realized, the packaging process is simplified, and the packaging volume is reduced.

The invention relates to the technical field of video monitoring, in particular to a multi-channel video recording data processing method, electronic equipment and a storage medium, and the method comprises the steps: responding to the received video recording data of each channel, creating a video recording file, and storing the received video recording data in the created video recording file; writing file header information into the beginning part of the video file; writing the received video recording data of each channel into the middle part of the video recording file according to a sequence of writing the frame header information and then writing the frame data; and recording key frame information of the video recording data of each channel at the end part of the video recording file to form a key frame information set. The file header information comprises file verification information and video file information; the frame header information comprises frame header verification information and frame data information, so that the defects of an existing multi-channel video recording data processing method in the aspects of storage, packaging, resource consumption, file management and the like are effectively overcome.

The utility model relates to IPM packaging technical field especially a kind of double-sided heat dissipation high-power IPM packaging structure of circular symmetry distribution, including upper copper ceramic substrate and lower copper ceramic substrate, the upper copper ceramic substrate is connected with lower copper ceramic substrate by IPM module, the material quality of upper copper ceramic substrate ceramic layer and lower copper ceramic substrate ceramic layer is all aluminium nitride ceramic or aluminium oxide ceramic, the upper copper layer of upper copper ceramic substrate is connected with upper radiator by upper heat-conducting silicone grease layer, the lower copper layer of lower copper ceramic substrate is connected with lower radiator by lower heat-conducting silicone grease layer.The utility model's double-sided heat dissipation high-power IPM packaging structure of circular symmetry distribution, by upper and lower two copper ceramic substrates, buffer layer, copper column realize the electrical connection of each part in module, so that module overall packaging structure is simplified, and realizes double-sided heat dissipation, can substantially improve module heat dissipation performance, to enhance the service life of module.

The utility model discloses a phase-change material packaging structure, which is characterized in that a core material is used as a supporting carrier of a phase-change material, and a large amount of energy generated during thermal runaway of a battery is absorbed by the phase-change material in a phase-change process, so that heat spreading is avoided; the core material absorbing the phase change material is wrapped in the packaging film, and the heat sealing area on the periphery of the packaging film is bent after being subjected to hot pressing, so that the space occupied by the heat sealing area is reduced, the volume utilization rate of the packaging structure is improved, and the volume and the phase change enthalpy value of the phase change material can be increased in the space with the same size; and secondly, the packaging structure of the phase change material is simple, and compared with a packaging plate, no complex plate or grid structure exists, so that the cost and the weight of the part are reduced.

The utility model discloses an end plate assembly of a fuel cell stack and the fuel cell stack, an insulating plate of the end plate assembly is provided with a plurality of pipe bodies, and the pipe bodies protrude out of the surface of one side of the insulating plate; the pipe body penetrates through the end plate in the thickness direction of the end plate; a first groove is formed in the surface of the other side of the insulating plate, and the collector plate is embedded in the first groove; and the end plate, the insulating plate and the collector plate are of an integrated packaging structure. By adopting the scheme, the integral end plate assembly is formed, the packaging structure of the galvanic pile is simplified, the number of assemblies is reduced, and the packaging efficiency of the galvanic pile is improved. Moreover, the redundant space between the assemblies is reduced, the volume and the weight of the fuel cell stack are reduced, and the requirements of portability and transportation are met. And moreover, the connection strength between the assemblies is enhanced, potential fault points are reduced, and the performance stability of the fuel cell is improved. And moreover, batch production is facilitated, so that the production cost of the fuel cell is reduced.

The utility model provides a kind of solid-state battery packaging structure, including metal lower shell and metal upper shell, the top of the metal lower shell is open structure, and middle part is provided with battery core groove, the top of the metal lower shell is installed with multiple bending pieces in open place, the bottom of the metal upper shell is equipped with multiple sealing grooves, the bottom of the metal upper shell is installed with sealing gasket, the sealing groove is circumferentially arranged along sealing gasket, bending anastomosis piece is respectively set in the sealing groove, locking piece is installed in the side of bending anastomosis piece;The utility model is provided with sealing gasket between metal upper shell and metal lower shell, increase in metal lower shell, the sealing property of battery core groove, better protection internal battery core, by setting bending piece and bending anastomosis piece, it can be according to the bending angle of bending anastomosis piece, when packaging, the bending angle of bending piece is automatically pressed and closed, more matching anastomosis metal lower shell and metal upper shell, the sealing connection between the two is more fastened.

According to the intelligent power module provided by the invention, the first heat dissipation plate and the second heat dissipation plate are arranged on the two surfaces of the packaging body respectively, and the heat dissipation plates are also provided with related circuits, so that the chips in the intelligent power module can be electrically connected directly based on the circuits on the heat dissipation plates, and an internal lead does not need to be additionally arranged; the packaging structure is simplified, and the difficulty of the packaging process is reduced; meanwhile, the first heat dissipation plate and the second heat dissipation plate are arranged on the two faces of the packaging body respectively, and the heat dissipation capacity of the intelligent power module can be improved.

The embodiment of the utility model discloses a packaging structure of a soft package battery pack, and relates to the technical field of packaging, and the packaging structure comprises a supporting structure which comprises a cavity; wherein the cavity is used for containing the soft package battery pack, and under the condition that the soft package battery pack is placed in the cavity, the first end face of the soft package battery pack is opposite to the bottom face of the supporting structure; the at least one glue injection hole is formed in the side wall of the supporting structure so as to communicate the cavity with the outside; wherein the lower edge of the glue injection hole is located in a preset area of the side wall of the supporting structure, the preset area is an area limited by the orthographic projection of the first end face on the side wall and the orthographic projection of the plane where the interface of the sealing edge and the tab is located on the side wall, the sealing edge is arranged on the first end face, and the tab is arranged on the sealing edge; and the pouring sealant is filled in a gap between the plane where the lower edge of the glue injection hole is located and the bottom surface of the supporting structure through the at least one glue injection hole. The packaging structure of the soft package battery pack provided by the embodiment of the utility model can improve the waterproof performance.

The invention relates to a method for connecting a memory chip and a substrate, which comprises a substrate, a chip mounted on the substrate, and a Pad position at the center of the chip, and comprises the following steps of: firstly, arranging and preparing an adapter plate according to the arrangement and the number of the Pad positions at the center of the chip, and arranging a conductive position I corresponding to the Pad positions on the adapter plate; attaching the adapter plate to the chip close to the side edge of the chip, wherein the conductive position I on the adapter plate is aligned with the position of the Pad; then the adjacent Pad positions on the chip are connected with the first conductive positions on the different adapter plates through routing, so that the routing directions of the adjacent Pad positions on the chip are opposite; and then, connecting the adapter plate with the substrate to form connection between the chip and the substrate. According to the invention, the length of a single wire is shortened, windowing of the substrate and packaging of a WLP copper layer on the surface of the chip are avoided, the operation space and the adjustment angle of the single wire on the chip are increased, the wire bonding reliability is improved, and the risk wire bonding probability is reduced. The invention further provides a packaging structure of the storage chip and the substrate.

The present application discloses a fan-out packaging method and a fan-out packaging device, the fan-out packaging method comprising: providing a chip, the chip comprising a first surface and a second surface disposed opposite to each other, wherein the first surface comprises a functional area and a non-functional area, the non-functional area is disposed around the periphery of the functional area, and the non-functional area is provided with an annular retaining wall, the retaining wall is disposed around the periphery of the functional area; the first surface of the chip is fixed on a carrier having an adhesive layer, and the retaining wall is embedded in the adhesive layer; a plastic sealing layer is formed on one side of the chip provided with the adhesive layer, the plastic sealing layer covers the second surface and side of the chip; and the adhesive layer and the carrier are removed. In the above manner, the present application can reduce the risk of glue overflow in the chip and effectively improve the yield of the chip.