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Packaging structure for microphone with embedded substrate

A packaging structure and microphone technology, applied in the field of microphones, can solve problems such as low efficiency and difficulty in realizing automatic production, and achieve the effects of simple packaging structure, cost reduction, and space saving

Inactive Publication Date: 2010-02-17
INST OF ACOUSTICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of package has a small volume, but it needs a large grounding conductive layer to shield external signals. Due to the small size of each chip, it is difficult to accurately connect the circuits of each component in this package, and this package It is difficult to realize automatic production and the efficiency is low

Method used

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  • Packaging structure for microphone with embedded substrate
  • Packaging structure for microphone with embedded substrate
  • Packaging structure for microphone with embedded substrate

Examples

Experimental program
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Effect test

Embodiment 1

[0044] figure 2A cross-sectional view of the substrate-embedded silicon micro-microphone package of the present invention is shown. The present invention provides a substrate-embedded silicon micro-microphone package, which includes a substrate 10, a top cover 20 with a limiting structure 21, and chips and components 30 mounted on the substrate. The substrate 10 is embedded into the top cover 20 with the chip carrying surface upward, and its embedded depth is adjusted by the position of the limiting structure 21 on the top cover. At the same time, the top cover is connected to the ground electrode on the substrate 10 through the limiting structure 21 to achieve good electromagnetic shielding.

[0045] The top view and bottom view of the substrate 10, such as image 3 (a) and 3(b). A sound hole 11 is formed on the substrate 10. The sound hole 11 is a through hole, generally close to the middle of the substrate, and its size is similar to that of the vibrating membrane of th...

Embodiment 2

[0052] Figure 4 An embodiment of the substrate-embedded silicon micro-microphone package of the present invention is shown, especially the detailed structure of the top cover 20 .

[0053] Such as Figure 4 (a), the top cover 20 is generally rectangular in plan view, with four inwardly recessed rectangular structures on its four corners. The rectangular flange part at the bottom of the rectangular metal top cover formed by the inwardly recessed rectangular structure at the four corners of the upper part is the position-limiting structure 21 of the top cover. Such as Figure 4 (b), the bottom surfaces of the four limiting structures 21 are located on a plane and parallel to the plane where the bottom edge of the top cover 20 is located. The distance between the bottom surface of the limiting structure 21 and the plane where the bottom edge of the top cover 20 is located can be adjusted freely, but generally not greater than the thickness of the substrate 10 . Such as Fig...

Embodiment 3

[0057] Image 6 An embodiment of the substrate-embedded silicon micro-microphone package of the present invention is shown, especially the detailed structure of the top cover 20 .

[0058] Such as Image 6 (a), the top cover 20 is generally rectangular in plan view, and three rectangular concave structures are distributed on two opposite sides of the top cover 20 . The side wall of the bottom of the metal top cover is radially and vertically inwardly recessed, which is the position-limiting structure 21 of the top cover. Image 6 (b) for Image 6 (a) The cross-sectional view of section A-A in (a), it can be seen that the limiting structure 21 in this embodiment is formed by making some parts of the side wall of the top cover inwardly recessed. The bottom surfaces of the three limiting structures 21 are on a plane, and the plane is parallel to the plane where the bottom edge of the top cover 20 is located. The distance between the bottom surface of the limiting structure 21...

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Abstract

The invention relates to a packaging structure for a microphone with an embedded substrate, comprising a metal top cover, a substrate, a microphone chip, a circuit chip and a passive element. The upper surface of the substrate is used for carrying and fixing the microphone chip, the circuit chip and the passive element; grounding electrodes communicated electrically are arranged on the upper and lower surfaces of the substrate and used for being connected with the metal top cover to ground; an acoustic cavity of the microphone is formed hermetically between the inner surface of the metal top cover and the substrate. A limit structure is arranged on the metal top cover. The plane limited by the limit structure is higher than and parallel to the plane on which the bottom edge of the metal top cover is located, the plane is used for embedding the substrate to the metal top cover horizontally in a direction where the chip carrying surface faces upwards, the embedding depth thereof is adjusted via a height difference of the bottom edge of the limited structure and the bottom edge of the metal top cover, and the height difference is not greater than thickness of the substrate. The invention has a simple structure and high space utilization rate.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a substrate-embedded microphone packaging structure, which can reduce the volume of the microphone. Background technique [0002] Silicon micro-microphones, also known as MEMS microphones, have the advantages of small size, good performance, and suitable for surface mount, and have strong growth potential in the field of portable and consumer electronics industries. To obtain a silicon micro-microphone with better sound quality, a high-quality microphone package is necessary. Generally speaking, silicon micro-microphone packaging needs to protect the internal chip from physical damage while transmitting external sound waves, avoid moisture and dust contamination in the surrounding environment, and effectively shield the electromagnetic interference in the environment. [0003] There are two main structures of current silicon micro-microphone packages. One structure consists...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04B81B7/00
Inventor 乔东海何庆索智群邓英
Owner INST OF ACOUSTICS CHINESE ACAD OF SCI
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