Wafer-level fingerprint recognition chip packaging structure and method

Abstract

Disclosed is a wafer-level fingerprint recognition chip packaging structure and method. The method includes: providing a substrate which comprises a plurality of induction chip areas and is provided with a first surface and a second surface opposite to the first surface, wherein a first surface of each induction chip area comprises an induction area; forming a covering layer on the first surface of the substrate; forming a plug structure in each induction chip area of the substrate, wherein one end of each plug structure is electrically connected with the corresponding induction area, and the other end of each plug structure is exposed out of the second surface of the substrate. By the forming method, the packaging process of a fingerprint recognition chip can be simplified, the requirement on sensitivity of the induction chip is lowered, and the packaging method is wider in application.

Description

technical field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer-level fingerprint identification chip packaging structure and a packaging method thereof. Background technique

[0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, making fingerprint identification technology widely used in various fields to protect personal information security. With the continuous development of science and technology, the information security of various electronic products has always been one of the key points of technological development. Especially for mobile terminals, such as mobile phones, notebook computers, tablet computers, dig...

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