133results about How to "The packaging method is simple" patented technology

Disclosed is a wafer-level fingerprint recognition chip packaging structure and method. The method includes: providing a substrate which comprises a plurality of induction chip areas and is provided with a first surface and a second surface opposite to the first surface, wherein a first surface of each induction chip area comprises an induction area; forming a covering layer on the first surface of the substrate; forming a plug structure in each induction chip area of the substrate, wherein one end of each plug structure is electrically connected with the corresponding induction area, and the other end of each plug structure is exposed out of the second surface of the substrate. By the forming method, the packaging process of a fingerprint recognition chip can be simplified, the requirement on sensitivity of the induction chip is lowered, and the packaging method is wider in application.

The invention provides an organic light emitting diode device and a packaging method and device thereof. The packaging method comprises the steps that a first substrate is provided, wherein a closed cofferdam adhesive and a filling adhesive located in the filling area defined by the cofferdam adhesive are formed on the first substrate, and the filling adhesive is doped with magnetic particles; a substrate is provided, and the organic light emitting diode device is formed on the second substrate; a magnetic field moving module is provided; the first substrate and the second substrate are pressed, the magnetic field moving module is controlled to move in the designated direction on the outer side of the first substrate and/or the second substrate so as to drive the magnetic particles in the filling adhesive to move in the designated direction, the filling adhesive is forced to be dispersed all around in the filling area, air bubbles can be extruded from the inside of the filling adhesive, and the packaging effect of the organic light emitting diode device is improved.

The invention provides a packaging method of a fan-out type chip, and a packaging structure. The packaging structure comprises chips with projections, wherein a dielectric layer is formed on the surfaces of the chips, and the projections are exposed from the surfaces; a plastic packaging material filled among the chips with the projections, wherein the height of the plastic packaging material is not higher than that of each projection so as to enable the projections to be exposed from the surface of the plastic packaging material; a rewiring layer formed on the chips with the projections and realizing interconnection among the chips; and projection lower metal layers and dimpling points. According to the invention, the dielectric layer exposing the projections is formed on the surfaces of the chips with the projections, the projections are protected, the subsequent interconnection among the chips is realized, and damaged or broken conditions of the projections caused by thermal expansion in the subsequent processes for manufacturing the rewiring layer of solder dimpling points are avoided, so that the packaging performance is substantially improved, and the yield is simultaneously improved.

The invention discloses a method for semiconductor packaging through metallic bonding, which is characterized in that the method includes the steps of firstly, providing a lead frame which comprises a chip substrate and pins, wherein the upper surface of the chip substrate is provided with at least one substrate groove which divides the whole chip substrate into a plurality of chip mounting areas, secondly, providing a plurality of chips which are all mounted in the corresponding chip mounting areas of the chip substrate through bonding, thirdly, providing at least one metallic sheet for connecting the chips, fourthly, providing leads for connecting the chips with the pins, fifthly, providing a plastic package body for packaging the structure, and sixthly, cutting off bottoms of the substrate grooves after packaging, so that the chip mounting areas in mutual connection are divided into disconnected chip mounting areas. The packaging method is capable of effectively preventing contamination caused by bonding overflowing during mounting of the chips to chip mounting equipment, the utilization ratio of the chips inside the package body is increased, and packaging cost is reduced.

The invention discloses a surface mount microwave device. Copper foil layers (4) and copper foil circuit layers (5) are symmetrically arranged between cover plates and a central medium material layer (3). Medium material layers (6) are arranged between the copper foil layers (4) and the copper foil circuit layers (5). Press-fitting glue film layers (7) for press-fitting are arranged between the copper foil circuit layers (5) and the medium material layers (6). A packaging process comprises the following steps of: tin paste printing, automatic mounting, curing, reflow soldering and cleaning to complete packaging. Since a strip line structure is used instead of a microstrip line and a copper foil circuit line in the strip line is in a folded and multilayer structure, the effective dielectric constant of the circuit is improved and the size of the microwave device is greatly reduced; and since a surface mount packaging method is adopted, slots for installation are not needed to be excavated in a printed circuit board and a chamber body, the printed circuit board is directly installed, the surface mounting is realized, the design and the realization of a microstrip circuit and a microstrip system are facilitated and optimized, the applicability is greatly increased and the application scope is wider.

The invention relates to a packaging method of an Ni@ZSM-5 bifunctional catalyst. The packaging method comprises the following step: with an FAU structure molecular sieve as an aluminum source and a metal Ni precursor as a Ni source, packaging metal nickel in the preparation process of a ZSM-5 molecular sieve through crystal transformation so as to obtain the Ni@ZSM-5 bifunctional catalyst. The Ni@ZSM-5 packaged catalyst obtained by using the packaging method has the double functions of metal hydrogenation and molecular sieve acid catalysis, so the application range of the packaged catalyst isremarkably widened; the packaged metal Ni nanoparticles are uniform in distribution and uniform in particle size; and in addition, the Ni@ZSM-5 bifunctional catalyst is packaged in a sodium-free system, a subsequent ion exchange step does not exist, and the packaging method is rapid, simple and convenient in process, short in flow, low in cost and easy for industrial operation.

The invention discloses a packaging structure of a micromirror with a micro electro mechanical system, which is used for carrying out wafer level lamination seal packaging on a micromirror with the micro electro mechanical system by utilizing the self peripheral frame of system micromirror with the micro electro mechanical system, which is characterized by comprising a top layer transparent cover plate, a middle layer micro electro mechanical system micromirror and a bottom layer substrate, wherein the micro electro mechanical system micromirror comprises a micromirror body and a micromirror surrounding silicon frame; the lower surface of the top layer transparent cover plate and the micromirror surrounding silicon frame form a cavity body capable of accommodating the micromirror body to move; the bottom layer substrate is used for supporting the micromirror with the micro electro mechanical system, and the micromirror with the micro electro mechanical system, the top layer transparent cover plate, the micromirror surrounding silicon frame and the bottom layer substrate form a closed cavity body; and the micromirror body is arranged in the closed cavity body. The packaging structure is the smallest packaging structure of the micromirror with the micro electro mechanical system, and has high production efficiency and lower cost. By adopting the packaging structure, the micromirror has strong anti-jamming capability and long service life.

The invention is suitable for the field of illumination, and provides a method for encapsulating a light-emitting diode (LED), an LED and an LED illumination device. The method for encapsulating the LED comprises the following steps of: dissolving a fluorescent material into a transparent material to prepare a mixed fluorescent material; and dividing the mixed fluorescent material into an upper layer serving as a transparent layer and a lower layer serving as a fluorescent layer, and covering an LED chip through the transparent layer and bonding the LED chip to a substrate, wherein the LED chip is subjected to die bonding and wire bonding on the substrate. In the method, the fluorescent material is dissolved into the transparent material to prepare the mixed fluorescent material, the mixed fluorescent material is divided into the upper layer serving as the transparent layer and the lower layer serving as the fluorescent layer, and the LED chip is covered by the transparent layer and is bonded to the substrate; and the fluorescent layer is far away from the LED chip, and an interface is not reserved between the fluorescent layer and the transparent layer, so that the light-emitting efficiency of the LED is improved greatly, and the encapsulating method is simple and easy to control, has a small number of steps and can realize high-efficiency encapsulation.

The invention provides a method for preparing a sensor by using a polyurethane package fiber grating and belongs to the technical field of optical fiber communication and light sensing. According to the method, polyurethane is used as a packaging material. The method comprises a step of fixing a package mold on a fiber platform, peeling a coating of a grating region and allowing the grating regionto enter a capillary steel pipe, fixing a bare fiber on the fiber platform with a clamp to ensure that the fiber is placed at an axis center of the mold, a step of sleeving two ends of the bare fiberwith protective sleeves in order, and a step of pouring the polyurethane into the mold which is coated with a release agent in advance, placing the mold into a vacuum box to be dried and solidified.The fiber grating and a fiber core with the removal of a coating are packaged with polyurethane elastomers to avoid the incompatibility of different materials. The package method of the invention is simple, reliable and portable, the prepared sensor can be monitored by changing the stress, temperature and the like of equipment, the method can be suitable for various industrial applications, and the stability, reliability and sensitivity of the packaged fiber grating are significantly improved.

The invention provides a fingerprint identification chip packaging structure and a packaging method. The packaging method comprises the steps that a substrate is provided; an induction chip is coupled at the surface of the substrate, the induction chip is provided with a first surface and a second surface which is opposite to the first surface, the first surface of the induction chip comprises induction areas, and the second surface of the induction chip is arranged at the surface of the substrate; and a plastic packaging layer is formed at the surfaces of the substrate and the partial induction chip, and the plastic packaging layer is exposed out of the induction areas. Sensitivity of the packaging structure of a fingerprint identification chip is enhanced, the packaging technology is simplified and manufacturing cost is reduced.

The invention provides an organic electroluminescent device. The organic electroluminescent device comprises an anode conductive substrate, a cavity implantation layer, a cavity transmission layer, a luminescent layer, an electron transmission layer, an electron injecting layer, a cathode layer and a packaging layer which are successively stacked. The anode conductive substrate and the packaging layer form an enclosed space, and the cavity implantation layer, the cavity transmission layer, the luminescent layer, the electron transmission layer and the electron injecting layer and the cathode layer are accommodated in the enclosed space. The packaging layer comprises a protective layer, a fluoride layer, an organic silicon layer and a poly(ethylene terephthalate) membrane which are successively stacked. The invention further provides a preparation method of the organic electroluminescent device. According to the invention, the method can effectively reduce corrosion caused by oxygen and steam to the organic electroluminescent device, forms effective protection of the organic function material of the device and electrodes, and can substantially prolong the life of the organic electroluminescent device. The method is especially suitable for packaging a flexible organic electroluminescent device.

The invention discloses a flip LED chip packaging method. The method comprises steps: an epitaxial slice of the flip LED chip is firstly made; a thin film is fixed at the top part of the epitaxial slice; electrodes are made on the epitaxial slice so as to form a flip LED chip; a solder paste is arranged on a substrate to enable two electrodes of the LED chip to be contacted with the solder paste respectively, reflow soldering is then carried out on the substrate and the LED chip on the substrate, and thus the electrodes of the LED chip are soldered on the substrate; and the thin film is heated and melted during the reflow soldering process and coats the LED chip, and then the thin film is cooled and cured to form a packaging layer. In addition, the invention also provides a flip LED chip using the packaging method. The flip LED chip packaging method and the flip LED chip using the packaging method have the advantages of a simple production process.

The encapsulated method is apply printed stannous oilment congruence assemble upper and nether substrate, and bring to bear preconcerted press decrease total thickness of upper and nether substrate, at one time, synchronously position Scheduled setting one upper and nether substrate, and after hood the shell of protected the element, then can through once welding course simultaneous fix up each other upper and nether substrate and Electrical Connectors, multi-electronic component and filter component difference set on tip of upper and nether substrate, and shell fix up on the face of the upper substrat, and that can predigest all process of encapsulation, and gain the electromodule which have been cutted dimension.

Provided in the invention is an organic light-emitting device comprising a substrate, an anode, a functional layer, a cathode, a packaging layer, and a packaging cover. The substrate, the anode, the functional layer, the cathode, the packaging layer, and the packaging cover are successively laminated. The substrate and the packaging cover form an enclosed space; and the anode, the functional layer, the cathode, and the packaging layer are accommodated into the enclosed space. The packaging layer successively includes a protection layer, an oxygen-nitrogen compound film, an organic blocking layer, a moisture absorbing layer, and a cooling layer; and the oxygen-nitrogen compound film is an oxide film doped with nitride. In addition, the invention also provides a preparation method of the organic light-emitting device. With the method, erosion on the organic light-emitting device by moisture and oxygen can be effectively reduced, so that the device organic functional material and the electrode can be effectively protected and thus the service life of the organic light-emitting device can be obviously prolonged. The method is especially suitable for packaging of a flexible organic light-emitting device.

The invention provides an organic light emitting diode device. The organic light emitting diode device includes an anode electric conduction substrate, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, a cathode layer and an encapsulation layer which are stacked to one another sequentially; the anode electric conduction substrate and the encapsulation layer form a closed space; the hole injection layer, the hole transport layer, the light-emitting layer, the electron transport layer, the electron injection layer and the cathode layer are accommodated in the closed space; and the encapsulation layer includes hybrid barrier layers and inorganic barrier layers which are stacked sequentially, wherein the hybrid barrier layers are made of a mixture of phthalocyanine, fluoride, an organic material and an oxide, and the inorganic barrier layers are made of titanium dioxide, zirconium dioxide or hafnium dioxide. The method provided by the invention is especially suitable for the encapsulation of flexible organic light emitting diode devices.

The invention discloses a carbon nanometer tube cement based composite material sensor encapsulating method. A protecting cover is covered on a carbon nanometer tube cement based composite material sensor metal binding post. A thin layer of coating or adhesive substances is evenly painted on each surface of a sensor prismoid, wherein the coating or the adhesive substances are corrosion-resistant, heat-insulating, humid-preventing, insulating, and capable of being hardened. Before the coating or the adhesive substances are completely hardened, roughening is conducted on the surfaces so as to enable the surfaces to be rough enough. The protecting cover is removed from the carbon nanometer tube cement based composite material sensor metal binding post, and a sensor is encapsulated after the coating is completely hardened. After encapsulated through the method, the carbon nanometer tube cement based composite material sensor has the advantages of being corrosion-resistant, heat-insulating, humid-preventing, insulating, and the like, is not influenced by outside environments in project structure health monitoring, is reliable in detected data, and reduces detection errors. Moreover, the sensor can be firmly adhered to concrete environment media.

The invention provides an organic light emitting diode device. The organic light emitting diode device includes an anode electric conduction substrate, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, a cathode layer and an encapsulation layer which are stacked to one another sequentially; the anode electric conduction substrate and the encapsulation layer form a closed space; the hole injection layer, the hole transport layer, the light-emitting layer, the electron transport layer, the electron injection layer and the cathode layer are accommodated in the closed space; and the encapsulation layer includes silicon carbonitride layers and inorganic barrier layers which are stacked sequentially, wherein the inorganic barrier layers are made of boric oxide, aluminum oxide, gallium oxide, indium oxide or thallium oxide. The method provided by the invention is especially suitable for the encapsulation of flexible organic light emitting diode devices.