133results about How to "The packaging method is simple" patented technology

The invention provides a base plate packaging method which includes the following steps: 1 providing a base plate (1) and a packaging plate (3); 2 arranging a ring of inorganic insulation film (5) is arranged on the packaging plate (3); 3 arranging a ring of ultraviolet glue (7) on the outside of the inorganic insulation film (5) on the packaging plate (3); 4 bonding the packaging plate (3) and the base plate (1) relatively; 5 utilizing a UV light source to irradiate the UV glue (7) to enable the UV glue to be solidified to achieve package of the base plate (1) by the packaging plate (3). By means of the packaging method, the packaging effect is improved, the steam and oxygen blocking capability is improved, the service life of an organic light emitting diode (OLED) device is prolonged, and the method is simple, feasible and good in operability.

The invention discloses a packing box and method for thin film solar cells. The packing box comprises a tray, an external fence plate, a box cover, corner protectors, limiting slots and protecting slots, wherein the external fence plate is arranged on the outer side of the periphery of the tray; the rear side of the external fence plate comprises a first limiting plate and a first side panel whichare arranged vertically; the first limiting plate is arranged on the lower portion of the first side panel; the right side of the external fence plate comprises a second limiting plate and a second side panel which are arranged vertically; the second limiting plate is arranged on the lower portion of the second side panel; the left side of the external fence plate comprises a third side panel which is arranged vertically; the front side of the external fence plate comprises a fourth side panel which is arranged vertically; the limiting slots are formed in the upper portion of the tray and theleft side of the second limiting plate; and the protecting slots are formed in the lower portion of the box cover, the left side of the second side panel and the right side of the third side panel. By the packing box and method, the circumstance that the thin film solar cells are jolted and shake in a transportation process and are extruded to one another and in contact with one another can be avoided effectively.

The present invention provides a packaging structure. The package structure includes a carrier, at least one electronic component, a first insulation layer, a heat spreading layer, a second insulationlayer, plural re-distribution blocks, a passivation layer, and a heat dissipation device. The electronic component is disposed in a recess of the carrier and has plural conducting terminals. The first insulation layer is formed on a second surface of the carrier. The heat spreading layer is formed on the first insulation layer. The second insulation layer is formed on a first surface of the carrier. The re-distribution blocks are formed on the second insulation layer. Each re-distribution block includes at least one conductive via disposed in the second insulation layer and in contact with corresponding one of the conductive terminals. The passivation layer is formed on the re-distribution blocks and covers portions of the re-distribution blocks. The heat dissipation device is disposed onthe heat spreading layer.

The invention discloses an encapsulation structure and method of a micro electro mechanical system device. The encapsulation structure of the micro electro mechanical system device comprises a first wafer and a second wafer; the first wafer is provided with a first central region and a first marginal region surrounding the first central region; the second wafer is provided with a second central region and a second marginal region surrounding the second central region; a first closed space is formed between the first central region and the second central region by correspondingly binding the first binding structure of the first marginal region and the second binding structure of the second marginal region together, namely, the micro electro mechanical system device in the first wafer is located in the closed space; the encapsulation structure of the formed micro electro mechanical system device is excellent in sealing; and the manufacturing procedure of the second wafer is simple and easy and free from additional processing. Therefore, the encapsulation structure of the micro electro mechanical system device disclosed by the invention is good in air tightness, simple and easy in encapsulation method, and low in production cost.