20results about How to "Strong bond" patented technology

The invention relates to the technical field of semiconductors, in particular to a low-temperature bonding method of a chip, which comprises the following steps of: preparing an upper chip with a micro bump which comprises a low-temperature material containing Sn; preparing a lower chip with a copper column, and reducing the roughness of the bonding surface of the copper column; and enabling the bonding surfaces of the micro bumps and the copper columns to be opposite, and carrying out bonding in a vacuum environment under the conditions that the temperature is 50-150 DEG C, the pressure is 10-40MPa and the pulse voltage is 2-6V. According to the low-temperature bonding method of the chip, low-temperature bonding can be realized, the bonding stability is improved, thermal damage caused by bonding is reduced, and the problem of warping of substrates of the upper chip and the lower chip after bonding is solved.

The utility model discloses a bonding clamp for vacuum low-temperature bonding, which belongs to the technical field of bonding clamps, can ensure that an upper clamp can stably cover the top of a lower clamp, can ensure that the upper clamp is stably covered together during working, and can ensure that the lower clamp and the upper clamp can be stably tensioned after the lower clamp and the upper clamp are covered. And the subsequent bonding work can be smoothly carried out. The bonding clamp for vacuum low-temperature bonding comprises a mounting frame, a vertical plate is vertically fixed to one end of the top of the mounting frame, a clamp body is mounted at the top of the mounting frame and comprises a lower clamp, a containing cavity is formed in the lower clamp, and a supporting disc is slidably arranged in the containing cavity; an upper clamp is hinged to the end, close to the vertical plate, of the lower clamp through a hinge, a lifting cavity is vertically formed in the side edge, facing the upper clamp, of the vertical plate, and a supporting assembly is installed in the lifting cavity; the supporting assembly comprises a lead screw, the lead screw is sleeved with a sliding block, and a supporting rod is hinged between the sliding block and the upper clamp.

The invention belongs to the technical field of artware preparation, and particularly relates to a paint line forming artware and a preparation method. The preparation method provided by the invention comprises the following steps: S01, preparing lacquer and talcum powder, and mixing to obtain a lacquer ash crude product; s02, adding flowing grease into the paint ash crude product, and fully stirring to obtain a paint line material; s03, preparing a handheld extrusion tool, wherein the handheld extrusion tool comprises a discharge end and an extrusion end; the hardness of the discharge end is higher than that of the extrusion end; an opening is formed in the top end of the discharging end, and the opening is circular; s04, setting a high-temperature and high-humidity environment condition, and drawing a pre-designed pattern by utilizing the paint line extruded by the handheld extrusion tool; repeatedly drawing to obtain a multi-layer paint line pattern; and S05, after drawing is completed, cooling is conducted firstly, then the humidity is reduced, and the artware drawn through the paint lines is fully dried. According to the method, a model and a green body are not needed, the formed paint lines are directly used for manufacturing the artware with the preset shape or pattern, a stable multi-layer structure is formed, and the finally-formed whole three-dimensional artware does not collapse or crack.

The utility model provides an improved semiconductor bonding device, comprising a pedestal, the upper end of which is respectively provided with a bonding heating plate and an engineering support; the lifting assembly is arranged on the engineering support and comprises a lifting table, a pressure head connecting piece and a driving mechanism for driving the pressure head connecting piece to ascend and descend along the lifting table; the metal pressure head is detachably connected to the lower end of the pressure head connecting piece and is arranged opposite to the bonding heating plate, different metal pressure heads can be replaced according to the size of a device by designing the replaceable metal pressure head, and the pressure applied to the device by the metal pressure head is controlled through the lifting assembly, so that a stable bonding process is realized; the problem of area mismatching caused by a fixed-size pressing interface of traditional equipment is solved, and waste of materials and time is avoided.

The utility model relates to the technical field of laminated boards, in particular to a circulating cooling device for thermoplastic laminated board molding, which comprises an object placing board arranged on a base and a hot pressing board slidably arranged on the base, a water cooling board is arranged on the object placing board, and a main pipeline and an auxiliary pipeline are arranged on the water cooling board. The main pipeline is used for cooling the laminated plate on the storage plate; the main pipeline is connected with an external water storage tank and a water suction pump arranged on the base, the auxiliary pipeline is connected with the main pipeline through the conversion assembly, the conversion assembly comprises a trigger structure and a switching structure, the trigger structure is arranged on the hot pressing plate and the base, and the trigger structure can drive the switching structure to act during hot pressing in the descending process of the hot pressing plate. And the main pipeline and the auxiliary pipeline are plugged, so that water in the main pipeline is pumped out by the water suction pump firstly, and then water in the water storage tank is pumped out through the auxiliary pipeline, so that a laminated board is formed.

The invention relates to the technical field of data integration analysis, and provides an intelligent copper wire bonding data integration analysis method and system based on the Internet of Things, and the method comprises the steps: S1, collecting parameters of bonding copper wire equipment through a sensor, and obtaining original data; s2, selecting an RFID communication protocol as a gallery road for copper wire bonding data transmission; s3, preprocessing the original data to obtain preprocessed data; s4, merging the preprocessed data together and providing a unified view to obtain integrated data; s5, analyzing the integrated data by using grey correlation analysis, analyzing the relation between the copper wire bonding data, and describing the relation between the bonding copper wire data; and S6, calculating a bonding process capability index, judging whether the bonding process capability index is within a preset bonding quality standard range or not, if so, determining that the bonding process is stable, and otherwise, adjusting the process. And the comprehensive influence of the copper wire bonding data comprehensive evaluation factors on the bonding effect is analyzed by using the grey correlation, the grey correlation analysis result speed is high, and the working efficiency is improved.

The embodiment of the present application provides a composite film and a preparation method thereof, wherein the composite film comprises a substrate, a first isolation layer, a second isolation layer and a functional film layer, wherein the first isolation layer, the second isolation layer and the functional film layer are sequentially stacked from bottom to top on the surface of the substrate, and the first isolation layer and the second isolation layer are made of the same material, and the diameter of the second isolation layer is smaller than the diameter of the first isolation layer. The present application will make the bonding force between the first isolation layer and the second isolation layer stronger, so that the bonding body formed by the substrate and the functional substrate has a better bonding effect, and thus the composite film formed by peeling off the bonding body has better structural strength and stability.

The present invention provides a receiving electrode for active demisting and water saving, comprising an electrode frame; a plurality of receiving electrode plates arranged vertically and in parallel are fixedly connected to the electrode frame at equal intervals; and a strengthening coating is provided on the outer surface of the receiving electrode plate. The present invention also provides a method for preparing the receiving electrode for active demisting and water saving, wherein the method for preparing the receiving electrode plate comprises: substrate pretreatment, intermediate layer treatment, outer coating agent preparation, and outer coating spraying. The receiving electrode for active demisting and water saving of the present invention effectively reduces airflow resistance, increases the contact area between the electrode and the mist, and improves the water collection efficiency of the active demisting and water saving device; reduces the friction between water droplets on its surface and the receiving electrode plate; the strengthening coating provided on the outer surface of the receiving electrode plate, the substrate-intermediate layer-outer coating of the receiving electrode plate are tightly combined, can resist the influence of adverse working conditions such as acid and alkali, and can effectively adapt to the working environment of high temperature, high humidity, and corona electric field.

The invention discloses wafer bonding equipment and a wafer bonding method. The wafer bonding equipment comprises an air bag device for pressing a wafer, the airbag device comprises a mounting frame, a floating mechanism, a fixing frame and an airbag which are sequentially arranged up and down; the air bag is installed below the fixing frame, and the fixing frame is rotationally connected with the installation frame through a floating mechanism. The floating mechanism comprises a ball bearing and a plurality of supporting rods, two ends of the ball bearing are connected to the middle of the fixing frame and the middle of the mounting frame respectively, the supporting rods are circumferentially distributed on the periphery of the ball bearing at intervals, the lower ends of the supporting rods are fixedly connected to the fixing frame, and the upper ends of the supporting rods movably penetrate through movable holes formed in the mounting frame. Therefore, through the arrangement of the floating mechanism, when the air bag presses the wafers downwards in the wafer bonding process, the air bag can swing freely within a certain range through the rotary connection of the ball bearing and the limiting of the supporting rods, the effect of removing bubbles in the two wafers from the middle to the outside can be achieved, it is ensured that the two wafers are bonded tightly, and the bonding quality of the wafers is improved. And the bonding strength and precision are improved.

The utility model discloses a self-leveling mortar surface layer, which belongs to the technical field of mortar, aims at solving the problem that a thermal insulation material in a mortar layer is easy to fall off to cause poor thermal insulation effect, and comprises a foundation layer, a plurality of reinforcing frames which are uniformly distributed are arranged on the surface of the foundation layer, and first expansion screws are connected between the reinforcing frames and the surface of the foundation layer. Rhombic grids are arranged on the surface of the foundation layer; the rhombic grids can be stably fixed with the foundation layer through the inclined second expansion screws, and the reinforcing frame can be covered by the foundation mortar layer when the foundation mortar layer is injected into the rhombic grids through the reinforcing frame, so that the adhesion between the foundation mortar layer and the foundation layer is more stable, and the service life of the foundation mortar layer is prolonged. By arranging the contact columns, the rubber powder polyphenyl granule slurry layer is more stably connected with the rhombic grids, so that the rubber powder polyphenyl granule slurry layer can be stably connected with the foundation layer, and the situation that the rubber powder polyphenyl granule slurry layer falls off, and the heat preservation effect becomes poor is avoided.

The present application relates to the technical field of electrode material, in particular to Co3S4 / MnCo-LDH / MnCo2S4 nanocomposite material and its preparation method and application. The present application takes soluble manganese salt and soluble cobalt salt as raw materials, takes foam nickel as carrier, carries out hydrothermal reaction under alkaline environment to obtain MnCo-LDH / NF, then immerses MnCo-LDH / NF in a precursor solution composed of soluble cobalt salt and 2-methyl imidazole, and carries out coordination reaction to obtain MnCo-LDH@ZIF-67 / NF, finally adopts thioacetamide to incompletely sulfide MnCo-LDH@ZIF-67 / NF to obtain Co3S4 / MnCo-LDH / MnCo2S4 nanocomposite material. Through Co3S4 and MnCo-LDH, the technical defects existing in MnCo2S4 are overcome.

The utility model discloses a bamboo shaving board film covering device which comprises an installation frame, a push plate is fixedly installed in the installation frame and located at the upper end of a conveying belt, a bamboo shaving board film covering assembly is fixedly installed on the upper surface of the installation frame, and the bamboo shaving board film covering assembly is perpendicularly opposite to the conveying belt. And a gluing assembly and a jacking assembly are fixedly installed on the lower surface in the mounting frame, a linear sliding table is fixedly installed on the lower surface of the mounting frame, and a scratching knife is fixedly installed on the lower surface of a movable block of the linear sliding table and located in the middle of the jacking assembly. By the adoption of the bamboo shaving board gluing device, in the bamboo shaving board film coating process, film bonding is firmer, generated bubbles are rolled, pushed and squeezed out, the gluing amount of each set of bamboo shaving boards is uniform in the gluing process, the gluing amount is increased along with the length of the bamboo shaving boards, and therefore the bamboo shaving boards have stability and deviation prevention performance in the bamboo shaving board conveying process.

The invention provides a micro-fluidic chip in-mold fusion bonding method based on a microelectrode. The method comprises the following steps: closing a first mold and a second mold; mold injection molding; maintaining the pressure of the mold and cooling; the mold is opened, and the injection molding runner is ejected out through an ejection mechanism; the first mold moves to enable the cover plate or the substrate to be aligned with the substrate or the cover plate on the second mold; the microelectrode clamping mechanism grabs the microelectrode and moves the microelectrode into the mold, and the microelectrode is aligned with the surface of the substrate in a high-precision mode; the first mold and the second mold are closed, and the bonding power supply is in contact communication with the microelectrode through the switch for fusion bonding; cutting off the bonding power supply, and cooling the mold; and the first mold is separated from the second mold, and the ejection mechanism ejects the finally formed and bonded micro-fluidic chip out of the mold. According to the invention, additional steps generated by a plurality of molds or external operation are simplified, so that the production process of the microfluidic chip is simplified; and meanwhile, the bonding efficiency is high, the bonding is reliable, and the processing efficiency and quality of the micro-fluidic chip are remarkably improved.

The utility model provides a device for a metal middle-pasting roll material, which relates to the technical field of middle-pasting processing, and comprises a pasting roll frame, the right side of the pasting roll frame is connected with a pasting roll shaft, the upper side of the pasting roll shaft is connected with a middle-pasting shaft, the inner side of the pasting roll frame is provided with a roll coating assembly, the roll coating assembly comprises a dust pasting rolling shaft arranged on the upper side of the pasting roll frame, and the dust pasting rolling shaft is connected with the middle-pasting shaft. A supporting rolling shaft is arranged on the left side of the dust sticking rolling shaft, a glue supply machine is arranged on the left side of the supporting rolling shaft, gluing sponge is arranged on the lower side of the glue supply machine, and a rolling frame is welded to the left side of the roll sticking frame. The material pasting film passes through the lower side of the supporting rolling shaft, the supporting rolling shaft can rotate along with movement of the material pasting film, so that dust on the surface of the material pasting film is adsorbed, a clean working face is provided for follow-up gluing sponge, and the supporting rolling shaft provides stable support for operation of the gluing sponge and the dust sticking rolling shaft; and it is ensured that the material sticking film can be in a tight state when passing through the gluing sponge and the dust sticking rolling shaft, and a better operation state is provided.

The present invention discloses a fully automatic printing system, which relates to the field of automatic printing technology and solves the problem that the ink on the surface of printed products is easily scratched, stained or even worn. At the same time, the problem of low product printing efficiency is solved. The fully automatic printing system includes a chassis, an upper frame, an automatic printing component and an integrated conveying and shaping mechanism. The top of the chassis is equipped with an upper frame, and the inner side of the upper frame is provided with an automatic printing component installed at the top edge of the chassis. The automatic printing component performs automatic printing operations on the product, and an integrated conveying and shaping mechanism is installed at the center of the top of the chassis. In the present invention, the products that have been printed and are being moved are subjected to automatic air-drying and shaping pretreatment to ensure that the ink printed on the surface of the product can be more firmly bonded to the product, and the printed ink will not be scratched, stained or even worn due to the vibration force and friction force of the above-mentioned operation, thereby effectively improving the quality of the product after printing.

The present invention belongs to the technical field of polymerization catalysts, and specifically relates to a three-center chromium metal catalyst and a preparation method and application thereof. The three-center chromium metal catalyst is composed of 1,3,5-triaminobenzene, substituted chlorophosphine and CrCl 3 (THF) 3 The preparation method comprises firstly adding 1,3,5-triaminobenzene, substituted chlorophosphine and an acid-binding agent to an anhydrous solvent for reaction to obtain an intermediate ligand; then reacting the intermediate ligand with CrCl 3 (THF) 3 The reaction obtains a three-center chromium metal catalyst. The application is to add the three-center chromium metal catalyst and the co-catalyst to a solvent to catalyze the polymerization reaction of ethylene. The present invention solves the problem that the existing catalysts are insufficient in the selectivity of 1-octene. The three-center chromium metal catalyst is simple to synthesize, the raw materials are easily available, and the use cost is low; at the same time, it has relatively stable selectivity and catalytic activity, and is suitable for industrial production.

The invention relates to the technical field of cell sorting and detection, in particular to a manufacturing method of a micro-fluidic chip. The manufacturing method of the micro-fluidic chip comprises the following steps: providing a substrate; forming a metal film layer on the surface of one side of the substrate; providing a cover plate, wherein the cover plate is at least provided with a micro-channel; forming an intermediate bonding layer on the substrate, wherein the intermediate bonding layer covers the surface of one side, on which the metal film layer is formed, of the substrate; performing surface activation treatment on the intermediate bonding layer; buckling a cover plate to the intermediate bonding layer, and bonding the cover plate with the substrate through the intermediate bonding layer; wherein the cover plate is a PDMS (Polydimethylsiloxane) prepolymer cover plate; the intermediate bonding layer is a silicon dioxide layer. According to the invention, the problem that the PDMS prepolymer cover plate and the metal film layer substrate are difficult to directly bond can be solved.

The application provides a device for manufacturing anti-burst corrugated paperboard and a method for producing the anti-burst corrugated paperboard, which comprises multiple line dispensing devices, a glue dipping device, a compaction roller, and a steam device arranged in sequence; a first surface paper conveying assembly is arranged above the compaction roller and is used for conveying first surface paper; the first surface paper passes through the compaction roller; a second surface paper conveying assembly is arranged below the compaction roller and is used for conveying second surface paper; the second surface paper passes through the compaction roller; the cotton thread dispensed by the multiple line dispensing devices passes through the glue dipping device and the compaction roller in sequence, and the cotton thread is located between the first surface paper and the second surface paper; the steam device is arranged around the compaction roller and is used for spraying steam to the first surface paper or the second surface paper. The cotton thread is first subjected to glue dipping treatment, and then the glued cotton thread is compacted and bonded with the surface paper, so that large-area coating of the glue layer on the surface of the surface paper is avoided, the amount of glue is saved, and the production cost is reduced.

This invention discloses a method for preparing a copolymer ultrafiltration membrane. This method combines in-situ suspension polymerization, polyaddition reaction, sol-gel method, and non-solvent-induced phase separation to prepare a copolymer ultrafiltration membrane. Excellent hydrophilicity and component stability of the ultrafiltration membrane are achieved through stable covalent bonding between tannic acid and the copolymer. Furthermore, the in-situ polyaddition reaction and sol-gel reaction are combined to stably introduce high-performance tannic acid into the polymer membrane. Stable bonding of each component is achieved through co-hydrolysis and condensation polymerization of the copolymer and the siloxane on the modified tannic acid during the film formation process. The polymerization process of this invention is simple and the structure is tunable. The prepared material not only has excellent hydrophilicity and antifouling ability but also a stable structure, making it a cross-linked copolymer ultrafiltration membrane with antifouling and antibacterial adhesion properties.

The invention discloses a full-automatic printing system, relates to the technical field of automatic printing, and solves the problem that ink on the surface of a printed matter is easily scratched, smeared and even worn. And meanwhile, the problem of low product printing efficiency is solved. The full-automatic printing system comprises a machine box, an upper frame, an automatic printing assembly and an integrated conveying and shaping mechanism, the upper frame is installed at the top of the machine box, the automatic printing assembly installed at the edge of the top of the machine box is arranged on the inner side of the upper frame, and the automatic printing assembly conducts automatic printing operation on products; and an integrated conveying and shaping mechanism is mounted in the center of the top of the case. According to the printing device, the printed and moved product is subjected to automatic air-drying and shaping pretreatment, it is guaranteed that printing ink printed to the surface of the product can be more stably bonded with the product, and the problems that the printing ink is scratched, smeared, even abraded and the like due to vibration force and friction force of the operation are solved; and the quality of the printed product is effectively improved.