Microelectromechanical system micromirror package

A system of micro-mirror and micro-electromechanical technology, applied in circuits, electrical components, electrical solid-state devices, etc., can solve problems such as large structure and inapplicability, and achieve the effect of improving production efficiency, saving costs, and facilitating miniaturization and integration.

Active Publication Date: 2011-12-28
无锡微文半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its structure is bulky and unsuitable for in vivo imaging

Method used

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  • Microelectromechanical system micromirror package
  • Microelectromechanical system micromirror package
  • Microelectromechanical system micromirror package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Such as Figure 4 As shown, the microelectromechanical system micromirror is packaged in an airtight cavity formed by the top transparent cover sheet 40, the silicon frame 44 around the micromirror, and the bottom substrate 45. The top transparent cover sheet and the bottom substrate 45 do not have electrical connections. The plate 47 faces the same direction as the micromirror mirror surface 43, and a through hole 46 is opened on the top transparent cover sheet, and the through hole is facing the pad 46 on the micromirror chip. The upper surface of the top transparent cover sheet has an optical coating 41 and a coating window 42, and the coating window 42 is facing the micromirror mirror surface 43; the lower surface has an inwardly recessed cavity.

[0037] Figure 5 Shown is a bulk micromirror with a different orientation between the pad and the micromirror mirror surface. The microelectromechanical system micromirror is packaged in a closed cavity composed of a top...

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PUM

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Abstract

The invention discloses a packaging structure of a micromirror with a micro electro mechanical system, which is used for carrying out wafer level lamination seal packaging on a micromirror with the micro electro mechanical system by utilizing the self peripheral frame of system micromirror with the micro electro mechanical system, which is characterized by comprising a top layer transparent cover plate, a middle layer micro electro mechanical system micromirror and a bottom layer substrate, wherein the micro electro mechanical system micromirror comprises a micromirror body and a micromirror surrounding silicon frame; the lower surface of the top layer transparent cover plate and the micromirror surrounding silicon frame form a cavity body capable of accommodating the micromirror body to move; the bottom layer substrate is used for supporting the micromirror with the micro electro mechanical system, and the micromirror with the micro electro mechanical system, the top layer transparent cover plate, the micromirror surrounding silicon frame and the bottom layer substrate form a closed cavity body; and the micromirror body is arranged in the closed cavity body. The packaging structure is the smallest packaging structure of the micromirror with the micro electro mechanical system, and has high production efficiency and lower cost. By adopting the packaging structure, the micromirror has strong anti-jamming capability and long service life.

Description

technical field [0001] The invention relates to a micro-electromechanical system micromirror packaging, which belongs to the field of semiconductor electronic packaging, in particular to the field of MEMS device packaging. Background technique [0002] Micro-electro-mechanical systems (MEMS for short) is a three-dimensional device manufactured by micro-machining technology, including at least one movable structure to satisfy a certain mechanical action. MEMS devices have a very broad application background in many fields. This is because MEMS has vigorously borrowed from the mature process technology of integrated circuits, so that the manufactured devices can integrate micro sensors, micro actuators, signal processing and control integrated circuits. In this century, more and more sensors and actuators tend to adopt MEMS technology, among which microelectromechanical system micromirrors are an excellent example. This is because although the force generated by the MEMS actu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B26/08
CPCH01L2924/16195
Inventor 周亮谢会开
Owner 无锡微文半导体科技有限公司
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