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81results about How to "Reduced Sensitivity Requirements" patented technology

Packaging structure and packaging method for fingerprint recognition chip

The invention discloses a packaging structure and a packaging method for a fingerprint recognition chip. The packaging structure comprises a substrate, a sensing chip, a plurality of wires and a plastic package layer. The substrate is provided with a first surface, and the first surface of the substrate is provided with a first welding pad layer. The sensing chip is located on the first surface of the substrate and provided with a first surface and a second surface, the second surface of the sensing chip is located on the first surface of the substrate, the first surface of the sensing chip is provided with a sensing area and a peripheral area, and the surface of the portion, in the peripheral area, of the sensing chip is provided with a second welding pad layer. The two ends of the wires are electrically connected with the first welding pad layer and the second welding pad layer respectively, the wires have top points with the maximum distance to the surface of the substrate, and a first distance is reserved between the top points and the first surface of the sensing chip. The plastic package layer is located on the surface of the substrate and the surface of the sensing chip and surrounds the wires and the sensing chip, and a second distance is reserved between the surface of the plastic package layer and the first surface of the sensing chip and is larger than the first distance. According to the packaging structure, the requirement for the sensitivity of the sensing chip is lowered, and application is wider.
Owner:CHINA WAFER LEVEL CSP

Fingerprint identification chip packaging method and fingerprint identification chip packaging structure

Disclosed are a fingerprint identification chip packaging method and a fingerprint identification chip packaging structure. The fingerprint identification chip packaging method includes: providing a substrate; coupling a sensing chip on the surface of the substrate, wherein the sensing chip is provided with a first surface comprising a sensing area and a second surface opposite to the first surface and positioned on the surface of the substrate; forming a plastic packaging layer on the surface of the substrate, wherein the plastic packaging layer encloses the sensing chip, and the surface of the plastic packaging layer is flush to the first surface of the sensing chip; forming a covering layer with the thickness smaller than 100 micrometers on the plastic packaging layer and the first surface of the sensing chip. The fingerprint identification chip packaging method has the advantages that the fingerprint identification chip packaging structure formed by the fingerprint identification chip packaging method is simplified, and the requirement on sensitivity of the sensing chip can be lowered, so that the fingerprint identification chip packaging method and the fingerprint identification chip packaging structure are wider in application range.
Owner:CHINA WAFER LEVEL CSP

Five-port nonblocking optical router based on micro-ring resonators

InactiveCN102645706AReduced average loss and crosstalkImprove scalabilityOptical light guidesSplit-ring resonatorMicro ring resonator
The invention discloses a five-port nonblocking optical router based on micro-ring resonators. The five-port nonblocking optical router comprises a first micro-ring resonator, a second micro-ring resonator, a third micro-ring resonator, a fourth micro-ring resonator, a fifth micro-ring resonator, a sixth micro-ring resonator, a seventh micro-ring resonator, an eighth micro-ring resonator, a ninth micro-ring resonator, a tenth micro-ring resonator, an eleventh micro-ring resonator, a twelfth micro-ring resonator, a thirteenth micro-ring resonator, a fourteenth micro-ring resonator, a fifteenth micro-ring resonator, a first optical waveguide, a second optical waveguide, a third optical waveguide, a fourth optical waveguide and a fifth optical waveguide, wherein one end of the first optical waveguide is a first input end and the other end of the first optical waveguide is a fifth output end; one end of the second optical waveguide is a second input end and the other end of the second optical waveguide is a first output end; one end of the third optical waveguide is a third input end and the other end of the third optical waveguide is a second output end; one end of the fourth optical waveguide is a fourth input end and the other end of the fourth optical waveguide is a third output end; and one end of the fifth optical waveguide is a fifth input end and the other end of the fifth optical waveguide is a fourth output end. By using the five-port nonblocking optical router based on the micro-ring resonators, eastern, southern, western, northern and local nonblocking free communication is realized, the average losses and crosstalk of links are reduced and an optical network-on-chip is enabled to have better extensibility.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Wafer defect detection system and method

The invention relates to a wafer defect detection system and method. The system comprises a processing unit, a control assembly, a displacement assembly, a detection assembly, and a signal acquisitionunit, the displacement assembly and the detection assembly are cooperatively arranged, and the displacement assembly controls the detection signal acquisition and movement of the detection assembly through displacement. The control assembly controls movement of the displacement assembly through an instruction and indirectly controls detection signal acquisition of the detection assembly, a signalacquired by the detection assembly and instruction information of the control assembly are transmitted to the signal acquisition unit, and the signal acquisition unit transmits the acquired signal tothe processing unit for processing to obtain defect information; the sensitivity requirement of an area array detector is reduced, and the detector cost can be effectively reduced; compared with a traditional scanning mode, the detection speed of the whole system can be greatly increased; and as the area array detector does not move in the area area exposure process, the problem of dithering andblurring of a traditional scanning mode can be solved, and the defect detection and recognition rate is increased.
Owner:ZHEJIANG LAB +2

Improved SVM equalization method and system for NG-PON

The invention discloses an improved SVM equalization method and system for an NG-PON. The method in the invention comprises the steps of: (1), inserting training sequences into digital signals needingto be transmitted every the set length, generating electrical NRZ signals through high-rate NRZ modulation, and converting the high-rate electrical NRZ signals including the training sequences into optical NRZ signals; (2), transmitting the optical NRZ signals to a receiving end, and converting the received optical NRZ signals into the electrical NRZ signals; (3), performing up-sampling on the electrical NRZ signals, and performing down-sampling after time synchronization; (4), extracting the training sequences, constructing a characteristic value vector for each training sequence, and calculating an optimal hyperplane; (5), judging information sequences by utilizing the optimal hyperplane, so that equalization is realized; and (6), returning to the step (4) after equalization of the information sequences is completed every the set length. According to the improved SVM equalization method and system for the NG-PON disclosed by the invention, the problem that the receiving sensitivityof the system is decreased due to signal distortion, intersymbol interference and the like introduced by bandwidth limitation when high-rate signals are transmitted by a low-bandwidth device can be solved.
Owner:HANGZHOU DIANZI UNIV

Combined type interconnected air suspension and interconnection mode control method thereof

InactiveCN105857007AEase handling stabilityAlleviate the contradiction of ride comfortInterconnection systemsResilient suspensionsControl systemMode control
The invention discloses a combined type interconnected air suspension in a vehicle air suspension system and an interconnection mode control method thereof. On the basis of a traditional interconnected air suspension, transverse interconnected pipelines, longitudinal interconnected pipelines and diagonal interconnected pipelines are added, interconnection states are achieved through air springs without absorbers, an electromagnetic valve is added into each interconnected pipeline, and five modes of non-interconnection, transverse interconnection, longitudinal interconnection, four-corner interconnection and diagonal interconnection are achieved. On the one hand, contradiction of control stability and ride comfort of a vehicle is further relieved through the four interconnection modes of non-interconnection, transverse interconnection, longitudinal interconnection and four-corner interconnection and the capacity for adjusting the roll stiffness and the pitching stiffness of the air suspension, and on the other hand, by means of the diagonal interconnection mode, the ride comfort can be improved to a certain extent and certain control stability is ensured when the vehicle runs at a high speed, so that the sensitivity requirement of a control system is lowered, and the ride safety is ensured.
Owner:JIANGSU UNIV

Monitoring structure and monitoring method for emission leakage of hydrocarbons of internal combustion engine

The invention provides a monitoring structure and a monitoring method for emission leakage of hydrocarbons of an internal combustion engine, which can monitor the emission leakage of the hydrocarbonsof an evaporation system of the internal combustion engine and / or the ventilation system of a crankshaft box of the internal combustion engine. According to the monitoring structure for emission leakage of hydrocarbons of the internal combustion engine, the pollutant gas of the crankshaft box firstly passes by a high pressure flushing pipeline, then flows by a high load pipeline of the evaporationsystem and finally enters an air inlet pipeline in front of a compressor by a Venturi tube. Compared with the prior art, due to the action of the Venturi tube, the faults of the high load desorptionof the evaporation system and the disconnection of the high load pipeline of the ventilation system of the crankshaft box can be monitored simultaneously by newly adding a pressure sensor, the pollutant gas of the crankshaft box will obtain greater degree of vacuum, the change amplitude of the pressure in the pipeline is improved by the Venturi effect, the purpose of covering most diagnostic working conditions by using the pressure sensor of lower sensitivity is realized, the fault recognition is improved, the requirement on the sensitivity of the pressure sensor is reduced, and the productioncost is reduced.
Owner:UNITED AUTOMOTIVE ELECTRONICS SYST

Channel equalization method based on SHAP feature optimization

The invention relates to a channel equalization method based on SHAP feature optimization, and the method comprises the steps: (1) enabling a transmitting end to transmit data containing a training sequence to a receiving end through an optical fiber, and enabling the receiving end to input the sampled data containing the training sequence to an equalizer module based on machine learning; (2) extracting a received training sequence by an equalizer module based on machine learning, and constructing a feature vector for the training sequence; (3) obtaining the SHAP value of each feature of each sample through calculation, and measuring the feature weight importance of each feature and the influence on the prediction result based on the index; (4) selecting features based on the feature weights, and constructing feature vectors for the training set and the test set according to a feature selection result; and (5) inputting the constructed feature vector into an equalizer based on a DSP algorithm to equalize subsequent effective data. According to the invention, the system performance is maintained, the influence of clock jitter on the system performance is reduced, and the calculation complexity of channel equalization is reduced.
Owner:HANGZHOU DIANZI UNIV

Wearable intraocular pressure detection device and detection method based on corneal contact lens grating

InactiveCN111345777AOvercome the problem of not fully reflecting corneal deformationReduce complexityTonometersBeam angleGrating
The invention discloses a wearable intraocular pressure detection device and detection method based on a corneal contact lens grating. The wearable intraocular pressure detection device comprises a wearable bracket and a corneal contact lens, wherein the wearable bracket is used for arranging a light source, a photoelectric detector and a processing circuit, and the light source is used for emitting a light beam; the corneal contact lens is used for reflecting the light beam emitted by the light source, and comprises a transparent grating-free area located in a central area and a grating arealocated in a fringe area of the ; the photoelectric detector is used for receiving a diffraction light beam reflected by the corneal contact lens and converts an acquired light signal into an electricsignal and transmitting the electric signal to the processing circuit; and the processing circuit is used for processing and calibrating data transmitted by the photoelectric detector. The wearable intraocular pressure detection device is based on an optical principle and has the characteristics of small size, simple process, high comfort, internal device passiveness and the like, and can be wornfor a long term to realize continuous measurement.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Temperature sensor capable of improving thermistor sensitivity

The invention provides a temperature sensor capable of improving thermistor sensitivity. The temperature sensor comprises a snap-action thermostat with hooks, a thermistor, an inner support, a heat conducting cover, an inner cup, an outer cup and a spring. The heat conducting cover is pivoted to an upper opening of the inner cup, a lower opening of the inner cup is downwardly provided with a vertical supporting leg which is vertically and movably clamped at a limiting gap in the bottom of the outer cup, and the spring is arranged between the pivot position of the heat conducting cover and the bottom of the outer cup. The temperature sensor further comprises a heat insulating spacer which is arranged between the inner top surface of the heat conducting cover and the top surface of the snap-action thermostat with the hooks, the snap-action thermostat with the hooks is fixed through the inner support, and the thermistor is closely attached to the inner top surface of the heat conducting cover. By additional arrangement of the heat insulating spacer between the heat conducting cover and the snap-action thermostat with the hooks, influences on the thermistor in measurement of internal bottom temperature of an electric cooker are reduced, and thermistor sensitivity is improved.
Owner:梁炜畅 +1
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