Wafer defect detection system and method

A defect detection and wafer technology, applied in optical testing flaws/defects, measuring devices, material analysis by optical means, etc., can solve problems such as difficult rotation control, difficulty in debugging, inability to meet detection speed, detection accuracy, etc.

CN112505064APending Publication Date: 2021-03-16ZHEJIANG LAB +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2021-03-16

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Abstract

The invention relates to a wafer defect detection system and method. The system comprises a processing unit, a control assembly, a displacement assembly, a detection assembly, and a signal acquisitionunit, the displacement assembly and the detection assembly are cooperatively arranged, and the displacement assembly controls the detection signal acquisition and movement of the detection assembly through displacement. The control assembly controls movement of the displacement assembly through an instruction and indirectly controls detection signal acquisition of the detection assembly, a signalacquired by the detection assembly and instruction information of the control assembly are transmitted to the signal acquisition unit, and the signal acquisition unit transmits the acquired signal tothe processing unit for processing to obtain defect information; the sensitivity requirement of an area array detector is reduced, and the detector cost can be effectively reduced; compared with a traditional scanning mode, the detection speed of the whole system can be greatly increased; and as the area array detector does not move in the area area exposure process, the problem of dithering andblurring of a traditional scanning mode can be solved, and the defect detection and recognition rate is increased.
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Description

technical field

[0001] The invention belongs to the field of wafer detection, in particular to a wafer defect detection system and method. Background technique

[0002] Wafer defect detection refers to detecting whether there are grooves, particles, scratches and other defects in the wafer and recording the defect position and quantity. Wafer defect detection is widely used and is a key link in semiconductor processing. Manual detection is the product surface defect detection However, with the development and progress of society, the traditional detection methods can no longer meet the requirements of detection speed and detection accuracy. With the development of industrial automation, defect detection equipment based on machine vision technology can be used, and defect detection equipment detection High consistency and high accuracy can greatly reduce the cost of employment, which is the trend of wafer defect detection in the future;

[0003] Conventionally, there is a ro...

Examples

Embodiment 2

[0031] Another feature different from Embodiment 1 in Embodiment 2 is the addition of a laser focusing module 420, which can monitor the relative position between the detection system and the wafer in real time during the wafer detection process, and drive the detection system to move to ensure that the objective lens is on the sample. It is the focus state, and its working principle is that the beam emitted by the laser focus module 420 is incident on the dichroic mirror 407, and the dichroic mirror 407 is designed to reflect the beam of this wavelength. The beam passes through the normaski prism 408 and is converged on the wafer 410 by the objective lens 409. The focused beam reflected by the wafer returns to the original path and is received by the focusing module 420 after passing through the objective lens 409, the normaski prism 408, and the dichroic mirror 407. At this time, it can be judged whether the objective lens is in focus according to the characteristics of the r...