Fingerprint identification chip packaging method and fingerprint identification chip packaging structure
A technology of chip packaging and fingerprint recognition, which is applied in character and pattern recognition, acquisition/organization of fingerprints/palmprints, electrical components, etc., can solve the problems of high sensitivity of fingerprint recognition chips, manufacturing and application limitations of fingerprint recognition devices, etc. Achieve the requirements of reducing sensitivity, wide application, and process simplification
Active Publication Date: 2014-12-10
CHINA WAFER LEVEL CSP
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[0005] However, in the existing fingerprint identification devices, the sensitivity of the fingerprint identificati
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[0065] As mentioned in the background, in the existing fingerprint identification devices, the sensitivity of the fingerprint identification chip is required to be high, so that the manufacture and application of the fingerprint identification devices are limited.
[0066] After research, please continue to refer to figure 1 , the surface of the fingerprint identification chip 101 is covered with a glass substrate 102, the glass substrate 102 is used to protect the fingerprint identification chip 101, and the user's finger 103 is directly in contact with the glass substrate 102, therefore, in order to ensure that the glass substrate 102 has For sufficient protection capability, the thickness of the glass substrate 102 is relatively thick. However, since the glass substrate 102 is relatively thick, the fingerprint recognition chip 101 is required to have high sensitivity to ensure that the user's fingerprint can be accurately extracted. However, it is difficult to manufacture ...
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Abstract
Disclosed are a fingerprint identification chip packaging method and a fingerprint identification chip packaging structure. The fingerprint identification chip packaging method includes: providing a substrate; coupling a sensing chip on the surface of the substrate, wherein the sensing chip is provided with a first surface comprising a sensing area and a second surface opposite to the first surface and positioned on the surface of the substrate; forming a plastic packaging layer on the surface of the substrate, wherein the plastic packaging layer encloses the sensing chip, and the surface of the plastic packaging layer is flush to the first surface of the sensing chip; forming a covering layer with the thickness smaller than 100 micrometers on the plastic packaging layer and the first surface of the sensing chip. The fingerprint identification chip packaging method has the advantages that the fingerprint identification chip packaging structure formed by the fingerprint identification chip packaging method is simplified, and the requirement on sensitivity of the sensing chip can be lowered, so that the fingerprint identification chip packaging method and the fingerprint identification chip packaging structure are wider in application range.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a fingerprint identification chip packaging method and packaging structure. Background technique [0002] With the progress of modern society, the importance of personal identification and personal information security has gradually attracted people's attention. Due to the uniqueness and invariance of human fingerprints, fingerprint identification technology has the characteristics of good security, high reliability, and simple and convenient use, making fingerprint identification technology widely used in various fields to protect personal information security. With the continuous development of science and technology, the information security of various electronic products has always been one of the key points of technological development. Especially for mobile terminals, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., th...
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Patent Timeline
Login to view more IPC IPC(8): H01L21/56H01L21/60H01L23/31H01L23/498
CPCH01L21/56H01L23/293H01L23/3121H01L23/49811H01L2224/73265H01L2224/48091H01L2924/00014H01L23/498H01L2924/181H01L2924/10155H01L23/32H01L23/60H01L24/32H01L24/48H01L24/73H01L2224/04042H01L2224/32225H01L2224/32245H01L2224/48227H01L2224/48247H01L24/45H01L2224/24227H01L2224/24246H01L24/24H01L2224/45147H01L2224/45139H01L2224/45144H01L2224/45184H01L2224/45124G06V40/1306H01L2924/00012H01L23/31H01L23/04H01L23/08H01L23/3128H01L23/585H01L24/19H01L2924/00
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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