The invention relates to a method for synthesizing polyimide precursor polymer resin and a method for manufacturing single-sided flexible copper-clad plates, which are applied to the technical field of microelectronics. An adhesive-free single-sided flexible copper-clad plate is obtained by the steps of: dissolving a monomer aromatic diamine in a non-proton polar solvent, stirring for dissolution, adding a silane coupling agent, stirring, adding an aromatic dianhydride monomer for polymerization to generate a polyimide precursor polymer resin solution, reacting and standing for defoaming; andcoating resin on a copper foil, pre-baking in an oven, removing the solvent, and heating in a gradient way in the high-temperature non-oxidation over (importing with nitrogen) so as to carry out complete imidization. The single-sided flexible copper-clad plate has the advantages that the heat resistance is good, the dimensional stability is strong, a substrate is thin, the peel strength is not less than 1.1kgf/cm, the polyimide resin is smooth and level after total etching, the elongation percentage is not less than 35%, the tensile strength is not less than 250MPa, the heat resistant temperature Tg of a polyimide insulation layer is not less than 328DEG C, and meanwhile, the plate has lower heat expansion coefficient, dielectric constant and water absorption rate.