Encapsulation method of dual base board electronic module for the radio communication

Abstract

The encapsulated method is apply printed stannous oilment congruence assemble upper and nether substrate, and bring to bear preconcerted press decrease total thickness of upper and nether substrate, at one time, synchronously position Scheduled setting one upper and nether substrate, and after hood the shell of protected the element, then can through once welding course simultaneous fix up each other upper and nether substrate and Electrical Connectors, multi-electronic component and filter component difference set on tip of upper and nether substrate, and shell fix up on the face of the upper substrat, and that can predigest all process of encapsulation, and gain the electromodule which have been cutted dimension.

Description

technical field [0001] The invention relates to a packaging method of an electronic module, in particular to a packaging method of a double-substrate electronic module for wireless communication. Background technique [0002] Referring to Fig. 1, the packaging process of the dual-substrate electronic module used for wireless communication is to apply surface mount technology (SMT, surface mount technique), and print the solder paste 100 (solder paste) on the predetermined settings in sequence - including at least A resistor / capacitor chip (Resistor / Capacitor chip, R / C chip), at least one transceiver (Transceiver IC), at least one balanced / unbalanced converter (Balun), at least one switching switch (switch) and other electronic components The second element group 400, and a plurality of component pads (component pads) on the upper substrate 21 (main board) top surface of a filter element 500 (Filter); then each element of the second element group 400 and the The filter compo...

AI Technical Summary

Problems solved by technology

[0006] From the above-mentioned packaging process of the double-substrate electronic module for wireless communication, it can be seen that the current packaging process is relatively lengthy and complicated, and must go through at least four times of reflow, and each reflow means that each component, substrate, etc. must be subjected to one The process of heating and cooling will increase the probability of failure of a single component due to rapid temperature rise and fall, which will lead to a decline in the overall double-substrate electronic module packaging production yield

[0007] In addition, the particle size of a single solder ball 200 is about 0.3-0.5 mm, and the height of the filter element 500 arranged on the top surface of the upper substrate 21 is relatively high, so the overall height of the packaged double-substrate electronic module is also small. Above 1.6 mm and cannot further break through miniaturization

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