LED automobile lamp packaging method

A technology of LED car lights and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of high cost, and achieve the effects of saving costs, ensuring consistency, and simple and easy packaging methods

Active Publication Date: 2018-02-09
JIANGXI LATTICEBRIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among many automotive LEDs, automotive headlights have the highest quality requirements. At present, only three major LED manufacturers in the United States, Europe, and Japan, such as Philips, Osram, and Nichia, can produce them, and the cost is relatively high.

Method used

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Embodiment Construction

[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments.

[0024] Such as figure 1 Shown is a schematic flow chart of the LED car lamp packaging method provided by this method. It can be seen from the figure that the LED car lamp packaging method includes: S1 mixing silica gel and phosphor powder in a preset ratio to obtain a fluorescent film; The surface of the film is coated with a layer of silica gel to obtain a silica gel fluorescent diaphragm; S3 cuts the silica gel fluorescent diaphragm to a size that matches at least one LED chip; S4 pastes the cut silica gel fluorescent diaphragm on the surface of the LED chip on the ceramic substrate ; S5 covers the entire ceramic bottom plate with white glue; S6 thins the white glue on the surface of the LED chip until the silicone layer or fluorescent film wit...

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Abstract

The invention provides an LED automobile lamp packaging method. The LED automobile lamp packaging method includes the steps of: S1. mixing silica gel and fluorescent powder according to a preset proportion to obtain a fluorescent film; S2. coating the surface of the fluorescent film with a silica gel layer to obtain a silica gel fluorescent diaphragm; S3. cutting the silica gel fluorescent diaphragm into a size matched with at least one LED chip; S4. pasting the cut silica gel fluorescent diaphragm on the surface of the LED chip on a ceramic bottom plate; S5. covering the whole ceramic bottomplate with white glue; S6. thinning the white glue on the surface of the LED chip till the silica gel layer of a preset thickness in the silica gel fluorescent diaphragm is kept or the fluorescent film is exposed; and S7. cutting the ceramic bottom plate to obtain an LED automobile lamp. The LED automobile lamp packaging method provided by the invention is simple and practicable, and does not needto be additionally equipped with special equipment, thereby saving cost.

Description

technical field [0001] The invention belongs to the field of semiconductors, and specifically relates to one. Background technique [0002] At present, the automotive lamp market is still dominated by halogen lamps and xenon lamps. However, with the vigorous promotion of energy-saving markets, the market scope of LED lamps in automotive lighting is gradually expanding. It can be seen that the market potential of automotive LEDs is extremely huge. [0003] Automotive LEDs, like other LED products, must meet the quality and quality requirements of consumer electronics. On top of this, because of the unique industry regulations of the automotive industry, it is necessary to meet the strict requirements of the automotive industry on quality such as performance, reliability, and yield. [0004] Among the many automotive LEDs, automotive headlights have the highest quality requirements. At present, only three major LED manufacturers in the United States, Europe and Japan, such as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50
CPCH01L33/501
Inventor 江柳杨
Owner JIANGXI LATTICEBRIGHT
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