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Encapsulating method of flexible OLED device

A packaging method and device technology, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., can solve problems such as difficult processes, and achieve the effects of good water and oxygen isolation, short cycle time, and easy operation

Inactive Publication Date: 2018-01-09
FUZHOU UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This packaging method requires expensive vacuum process equipment, such as PECVD or ALD equipment, and the manufacturing process is very difficult

Method used

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  • Encapsulating method of flexible OLED device
  • Encapsulating method of flexible OLED device
  • Encapsulating method of flexible OLED device

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Embodiment Construction

[0016] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the drawings, and detailed descriptions are made as follows.

[0017] Such as Figure 1~2 As shown, a method for packaging a flexible OLED device, the packaging method is: (1) placing a pre-prepared OLED sample between two good barrier films; (2) stacking or stacking on top of the OLED sample Fabrication of getter layer 4; (3) Barrier film packaging is performed by hot-press bonding or adhesion, with fewer packaging procedures, reducing costs, avoiding the problem of low yield caused by the complexity of the packaging structure, and can effectively solve the problem at the same time The problem of water vapor and oxygen permeation can obtain efficient, stable and long-life devices under the guarantee of flexible OLED devices.

[0018] In the embodiment of the present invention, the barrier film is composed o...

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PUM

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Abstract

The invention relates to an encapsulating method of a flexible OLED device. The encapsulating method comprises: (1), placing an OLED sample prepared in advance between two good barrier films; (2), stacking or manufacturing an air suction laser above the OLED sample; and (3), carrying out barrier film encapsulation by means of hot-pressing contact or adhesion. The encapsulating method has advantages of great simpleness, great easiness in operation, low cost, short period, good sealing performance, and good water and oxygen insulation effect.

Description

Technical field [0001] The invention relates to a packaging method of a flexible OLED device. Background technique [0002] In recent years, OLED (Organic Light Emitting Diode) display technology has been widely used worldwide. OLED displays have the advantages of simple structure, self-luminescence, low energy consumption, fast corresponding speed, high definition, high contrast, no viewing angle limitation, wide operating temperature range and very suitable for flexible panels. It has been recognized as the next-generation display. Mainstream. However, the stability and lifetime of OLED devices have long been one of the bottlenecks hindering the development of the OLED industry. This is mainly because organic materials and cathode metal materials are particularly sensitive to oxygen and water vapor. The contact of small areas (such as pinholes in the film) may cause chemical or electrochemical reactions with water and oxygen and damage the performance of the device. And this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
Inventor 郭太良唐谦叶芸周雄图张永爱吕珊红
Owner FUZHOU UNIV
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