Encapsulating method of flexible OLED device

A packaging method and device technology, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., can solve problems such as difficult processes, and achieve the effects of good water and oxygen isolation, short cycle time, and easy operation

CN107565047AInactive Publication Date: 2018-01-09FUZHOU UNIV
8 Cites 4 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2018-01-09
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to an encapsulating method of a flexible OLED device. The encapsulating method comprises: (1), placing an OLED sample prepared in advance between two good barrier films; (2), stacking or manufacturing an air suction laser above the OLED sample; and (3), carrying out barrier film encapsulation by means of hot-pressing contact or adhesion. The encapsulating method has advantages of great simpleness, great easiness in operation, low cost, short period, good sealing performance, and good water and oxygen insulation effect.
Need to check novelty before this filing date? Find Prior Art

Description

Technical field

[0001] The invention relates to a packaging method of a flexible OLED device. Background technique

[0002] In recent years, OLED (Organic Light Emitting Diode) display technology has been widely used worldwide. OLED displays have the advantages of simple structure, self-luminescence, low energy consumption, fast corresponding speed, high definition, high contrast, no viewing angle limitation, wide operating temperature range and very suitable for flexible panels. It has been recognized as the next-generation display. Mainstream. However, the stability and lifetime of OLED devices have long been one of the bottlenecks hindering the development of the OLED industry. This is mainly because organic materials and cathode metal materials are particularly sensitive to oxygen and water vapor. The contact of small areas (such as pinholes in the film) may cause chemical or electrochemical reactions with water and oxygen and damage the performance of the device. And this...

Examples

Embodiment Construction

[0016] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the drawings, and detailed descriptions are made as follows.

[0017] Such as Figure 1~2 As shown, a method for packaging a flexible OLED device, the packaging method is: (1) placing a pre-prepared OLED sample between two good barrier films; (2) stacking or stacking on top of the OLED sample Fabrication of getter layer 4; (3) Barrier film packaging is performed by hot-press bonding or adhesion, with fewer packaging procedures, reducing costs, avoiding the problem of low yield caused by the complexity of the packaging structure, and can effectively solve the problem at the same time The problem of water vapor and oxygen permeation can obtain efficient, stable and long-life devices under the guarantee of flexible OLED devices.

[0018] In the embodiment of the present invention, the barrier film is composed o...