Silicon-based photonic integrated structure and preparation method

Abstract

The present invention belongs to the semiconductor optoelectronic technological field and relates to a silicon-based photonic integrated structure and a preparation method. The integrated structure comprises a laser driving circuit, at least one laser, monitoring detectors, an optical waveguide, and a silicon-based substrate, wherein the number of the at least one laser is corresponding to the number of the monitoring detectors; the laser driving circuit is electrically connected with the lasers; the lasers, the monitoring detectors, and the optical waveguides are optically connected with oneanother; and the laser driving circuit, the lasers, the monitoring detectors, and the optical waveguide are all disposed on the same silicon-based substrate. According to the silicon-based photonic integrated structure of the invention, the laser driving circuit, a multi-wavelength chip and a multi-optical path composite chip are integrated on the same substrate, and therefore, the silicon-based photonic integrated structure has the advantages of high integration, high performance, low cost and easiness in packaging. With the silicon-based photonic integrated structure adopted, the further development of a communication module in the corresponding industry in high integration and miniaturization can be benefitted.

Description

【Technical field】 [0001] The invention relates to the technical field of semiconductor optoelectronics, in particular to a silicon-based photonic integrated structure and a preparation method. 【Background technique】 [0002] With the rapid development of modern scientific information technology and communication networks, people have higher and higher demands for communication, and produce high-speed, large-bandwidth, high-integration, low-power, low-cost, and easy-to-package devices that meet the needs of use. All kinds of communication equipment modules have become the core development direction of this industry. [0003] In the currently used optical devices, the materials used for hybrid integration are usually multiple isolated semiconductor substrates, and often contain materials of different systems, such as III-V semiconductor materials, ferroelectric materials, organic polymers, liquid crystals, etc. These chips with different functions and different materials are ...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: with the increasing demand for communication in modern life, in the existing optical components, the internal components are built using discrete components, resulting in low transmission efficiency of communication signals and high cost of optical components , large volume, high power consumption, and complex assembly process are becoming more and more serious

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