Organic light emitting diode device and packaging method and device thereof

Abstract

The invention provides an organic light emitting diode device and a packaging method and device thereof. The packaging method comprises the steps that a first substrate is provided, wherein a closed cofferdam adhesive and a filling adhesive located in the filling area defined by the cofferdam adhesive are formed on the first substrate, and the filling adhesive is doped with magnetic particles; a substrate is provided, and the organic light emitting diode device is formed on the second substrate; a magnetic field moving module is provided; the first substrate and the second substrate are pressed, the magnetic field moving module is controlled to move in the designated direction on the outer side of the first substrate and/or the second substrate so as to drive the magnetic particles in the filling adhesive to move in the designated direction, the filling adhesive is forced to be dispersed all around in the filling area, air bubbles can be extruded from the inside of the filling adhesive, and the packaging effect of the organic light emitting diode device is improved.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to an organic light emitting diode device, a packaging method and packaging equipment thereof. Background technique [0002] Active-matrix organic light-emitting diodes (AMOLEDs) have gradually received widespread attention due to their high color gamut, ultra-thin, and flexible displays. However, water vapor and oxygen will cause corrosion to OLED and affect the service life, so strict packaging is required for protection. Dam&Fill packaging is a commonly used packaging method for large-size OLEDs, that is, a cofferdam is formed by using a glue with a high viscosity, and then a filling glue with a low viscosity is coated in the cofferdam, and when the upper and lower substrates are pressed together , resulting in the diffusion of the filling glue, so that the filling glue fills the inner space of the cofferdam, and the packaging is completed after the glue material i...

AI Technical Summary

Problems solved by technology

[0003] However, although the upper and lower substrates are pressed together in a vacuum environment, a small amount of gas remains in the adhesive material, forming bubbles, which are concentrated in the inner wall and corner of the cofferdam, which is difficult to remove

Residual bubbles not only affect the appearance (especially for top-emitting devices, the residual bubbles in the middle directly affect the display effect), but also the bubbles at the edge have no barrier effect, cannot prevent water and oxygen, and affect the packaging effect

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