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Organic light-emitting device packaging cover plate, organic light-emitting device and displayer

A technology of electroluminescent devices and packaging cover plates, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of difficult control of the height of the packaging ring, poor uniformity of the glass gap, and high cost of OLEDs. Depth is easy to control, low cost, and easy to produce

Inactive Publication Date: 2013-09-25
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This structure is easy to manufacture, but the disadvantage is that glass glue is a high unit price material, and the cost of OLEDs using this structure is relatively high. In addition, the height of the raised packaging ring is not easy to control, especially when the height is less than 10 microns, the glass will Gap uniformity will be poor

Method used

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  • Organic light-emitting device packaging cover plate, organic light-emitting device and displayer
  • Organic light-emitting device packaging cover plate, organic light-emitting device and displayer
  • Organic light-emitting device packaging cover plate, organic light-emitting device and displayer

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Embodiment Construction

[0025] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0026] figure 2 Shown is a cross-sectional view of the packaging cover plate of the organic electroluminescent device provided by the present invention. Such as figure 2 As shown, the present invention provides a packaging cover plate 100 for an organic electroluminescent device. The packaging cover plate 100 has a packaging surface 101 for bonding with a substrate through packaging glue, and the surroundings of the packaging surface 101 form useful The groove structure 102 for accommodating the encapsulant.

[0027] Wherein, an accommodating cavity 103 for accommodating the anode layer, the organic light-emitting layer and the cathode layer in the OLED device may also be provided in the middle of the packaging ...

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Abstract

The invention provides an organic light-emitting device packaging cover plate, an organic light-emitting device and a displayer. The packaging cover plate of the organic light-emitting device has a packaging surface bonded with a substrate through packaging glue, and the periphery of the packaging surface of the packaging cover plate forms a groove structure used for accommodating the packaging glue. Because the groove structure is formed in the packaging surface of the packaging cover plate, when an OLED device is packaged through the packaging cover plate, the packaging glue used for bonding the packaging cover plate and the substrate can be filled into the groove structure of the packaging cover plate, and therefore gaps between the packaging cover plate and the substrate can be substantially reduced, water vapor penetrating paths are reduced, packaging effect of the OLED device is improved, and service life of the OLED device is prolonged.

Description

technical field [0001] The invention relates to the technical field of organic electroluminescence display, in particular to a packaging cover plate of an organic electroluminescence device, an organic electroluminescence device and a display with the organic electroluminescence device. Background technique [0002] In recent years, organic light-emitting devices (Organic Light-Emitting Device, OLED) have been widely used in the field of Full-color display, backlight and lighting have become research hotspots. [0003] Organic electroluminescent devices are very sensitive to water and oxygen content, and the presence of water and oxygen will cause the device to fail. The failure process is often that water and oxygen react with the metal through the pinholes in the metal cathode (usually Al) of the device, causing the metal cathode to peel off, and the pinholes gradually develop into black spots. The black spots follow the metal cathode and water, Oxygen reacts and peels o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/50
CPCY10T428/24488H10K59/871H10K59/8722H10K50/841H10K50/8426
Inventor 张家豪
Owner BOE TECH GRP CO LTD
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