A kind of led vacuum encapsulation device and vacuum encapsulation method

Abstract

The invention relates to an LED (Light-Emitting Diode) encapsulating technology. An LED vacuum encapsulating device comprises a substrate and a forming die, wherein the substrate is arranged above the forming die, the substrate is matched with the forming die; and the vacuum encapsulating device is also provided with an upper die and a lower die which are mutually matched to form a sealed die cavity, the substrate and the forming die are arranged in the die cavity, and the die cavity is communicated with a vacuum air extractor. The LED vacuum encapsulating method comprises the following stepsof: injecting glue, namely injecting the required encapsulating glue into the forming die; closing the dies comprising the upper die and the lower die, vacuumizing the die cavity by virtue of a vacuum tube, and pressing the injected encapsulating glue by the substrate; extruding the encapsulating glue by the substrate, thus the encapsulating glue flows into a die hole of the forming die; and after the encapsulating glue is hardened, opening the upper die, thus LED encapsulating and forming are completed. In a pressing process of the substrate and the forming die, the die cavity is in a vacuumenvironment, the substrate presses silica gel without generating bubbles, thus the LED vacuum encapsulating device has high yield and good encapsulating effect.

Description

technical field [0001] The invention relates to LED packaging technology, in particular to an LED vacuum packaging device and a vacuum packaging method. Background technique [0002] The basic components of a current light-emitting diode (LED) include a substrate, an LED chip, a lens formed of encapsulant, and an inner lead. The inner lead connects the motor on the LED chip to the electrode on the substrate to ensure that the external electrode on the substrate transmits current to the LED chip; LED chip is a semiconductor material, and because it can emit visible light, it is generally used in signal indication, display lighting and other fields. The main function of the encapsulating colloid is to protect the LED chip and export the light emitted by the LED chip to act as an optical lens. Therefore, it is generally a transparent material, such as epoxy resin, silicone rubber, etc. [0003] In the prior art, the Chinese invention patent with the patent number "ZL2007100316...

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Problems solved by technology

[0004] The problem existing in the above-mentioned prior art is that there is air in the cavity of the combination of the mold and the substrate, that is, the molding cavity of the encapsulated lens. If there are bubbles in the lens, the light will be refracted, the light distribution curve of the lens will be deformed, and the light output effect of the LED will be affected, thereby reducing the light efficiency of the LED.

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