MEMS pressure sensor device and packaging method thereof

A pressure sensor and pressure-sensitive film technology, applied in the direction of measuring devices, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as the inability to use MEMS pressure sensors

Active Publication Date: 2015-08-26
苏州曼普拉斯传感科技有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0008] Another object of the present invention is to provide a MEMS pressure sensor device and a packaging method. By providing a vent hole at the bottom of the packaging substrate, the external atmosphere is in contact with the pressure-sensitive film to sense pressure, so that the MEMS pressure sensor realizes back pressure. Detects pressure, which solves the problem that users cannot use MEMS pressure sensors that sense pressure through the upper part

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  • MEMS pressure sensor device and packaging method thereof
  • MEMS pressure sensor device and packaging method thereof
  • MEMS pressure sensor device and packaging method thereof

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Embodiment Construction

[0045] The following description serves to disclose the present invention to enable those skilled in the art to carry out the present invention. The preferred embodiments described below are only examples, and those skilled in the art can devise other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present invention.

[0046] figure 2 It is the first preferred embodiment of a MEMS pressure sensor device provided by the present invention. Such as figure 2 As shown, a MEMS pressure sensor device includes a MEMS pressure sensor 10, a package assembly 20 and an integrated circuit (such as an ASIC chip) 30, wherein the MEMS pressure sensor 10 is connected to the ASIC chip 30, and is installed on The packaging component 20 is used to sense changes in air pressure.

[00...

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Abstract

The invention provides an MEMS pressure sensor device and a packaging method thereof. The MEMS pressure sensor device comprises the components of an integrated circuit, an MEMS pressure sensor which is connected with the integrated circuit, and a packaging assembly. The packaging assembly comprises a substrate and a cover plate. The cover plate is connected with the substrate and an accommodating space is formed, wherein the MEMS pressure sensor and the integrated circuit are connected with the substrate and are arranged in the accommodating space. The substrate is provided with a ventilation hole. Outside atmosphere contacts with the MEMS pressure sensor through the ventilation hole, so that the MEMS pressure sensor is suitable for sensing the outside air pressure through the back part of the MEMS pressure sensor.

Description

technical field [0001] The invention belongs to the field of micro-electro-mechanical systems (MEMS), and in particular relates to a MEMS pressure sensor device and a packaging method. Background technique [0002] Microelectromechanical Systems (MEMS) refers to a micro-electromechanical system that integrates micro-sensors, actuators, signal processing and control circuits, communications, and power supplies. At present, MEMS as a pressure detection system has been widely used in various industries such as water conservancy, chemical industry, medical treatment, automotive electronics, consumer electronics, industrial electronics, etc. Pressure sensors for monitoring systems, automobile engine intake manifold pressure sensors, common rail pressure sensors for diesel engines, fuel distribution pipe sensors, seat comfort sensors, side impact sensors; tire pressure gauges, sphygmomanometers, health scales in the consumer electronics field, Pressure sensors for vacuum cleaners...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/06B81B7/00B81C1/00
Inventor 谢勇
Owner 苏州曼普拉斯传感科技有限公司
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