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Method for encapsulating light-emitting diode (LED), LED and LED illumination device

A LED packaging and LED chip technology, applied in the field of lighting, can solve the problems of difficult process control, easy interface, and many steps, and achieve the effect of easy control, simple packaging method, and few steps

Inactive Publication Date: 2011-02-23
宁波市瑞康光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide an LED packaging method, aiming to solve the problems that the existing fluorescent powder needs to be coated with fluorescent powder when it is far away from the chip package, the steps are numerous, the process is difficult to control, and the interface is prone to appear.

Method used

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  • Method for encapsulating light-emitting diode (LED), LED and LED illumination device
  • Method for encapsulating light-emitting diode (LED), LED and LED illumination device
  • Method for encapsulating light-emitting diode (LED), LED and LED illumination device

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Embodiment 1

[0031] figure 1 The implementation flow of the LED packaging method provided by the first embodiment of the present invention is shown, and the details are as follows:

[0032] In step S101, the fluorescent material is dissolved in a transparent material to obtain a mixed fluorescent material;

[0033] In the embodiment of the present invention, the transparent material is a polymer transparent material, and the polymer transparent material is a thermosetting polymer material, such as silica gel, epoxy resin or modified silica gel or epoxy resin. The fluorescent material is fluorescent powder such as yellow fluorescent powder, green fluorescent powder, and red fluorescent powder.

[0034] Such as figure 2 As shown, after mixing components A and B of the thermosetting polymer material, according to market demands, an appropriate amount of fluorescent powder is added and stirred evenly to obtain the first mixed fluorescent material 201 .

[0035] For example, the A / B compone...

Embodiment 2

[0043] Figure 6 The implementation process of the LED packaging method provided by the second embodiment of the present invention is shown, and the details are as follows:

[0044] In step S601, dissolving the fluorescent material in a transparent material to obtain a second mixed fluorescent material;

[0045] In the embodiment of the present invention, the transparent material is a polymer transparent material, and the polymer transparent material is a thermoplastic polymer material, such as PS (Polystyrene, polystyrene), PMMA (Polymethyl Methacrylate, polymethyl methacrylate), TPX ( 4-methylpentene-1, poly 4-methylpentene-1) or PC (Polycarbonate, polycarbonate). The fluorescent material is fluorescent powder such as yellow fluorescent powder, green fluorescent powder, and red fluorescent powder.

[0046] First, dissolve the thermoplastic polymer material with anhydrous organic solvent (such as absolute ethanol, xylene, etc.). Then, according to the market demand, add an...

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Abstract

The invention is suitable for the field of illumination, and provides a method for encapsulating a light-emitting diode (LED), an LED and an LED illumination device. The method for encapsulating the LED comprises the following steps of: dissolving a fluorescent material into a transparent material to prepare a mixed fluorescent material; and dividing the mixed fluorescent material into an upper layer serving as a transparent layer and a lower layer serving as a fluorescent layer, and covering an LED chip through the transparent layer and bonding the LED chip to a substrate, wherein the LED chip is subjected to die bonding and wire bonding on the substrate. In the method, the fluorescent material is dissolved into the transparent material to prepare the mixed fluorescent material, the mixed fluorescent material is divided into the upper layer serving as the transparent layer and the lower layer serving as the fluorescent layer, and the LED chip is covered by the transparent layer and is bonded to the substrate; and the fluorescent layer is far away from the LED chip, and an interface is not reserved between the fluorescent layer and the transparent layer, so that the light-emitting efficiency of the LED is improved greatly, and the encapsulating method is simple and easy to control, has a small number of steps and can realize high-efficiency encapsulation.

Description

technical field [0001] The invention belongs to the lighting field, and in particular relates to an LED packaging method, an LED and an LED lighting device. Background technique [0002] As we all know, LED, as a new generation of green lighting source, has many advantages such as high luminous efficiency, long life, bright colors, energy saving, and environmental protection. plant growth etc. [0003] The light emitted by the existing LED chip is mixed with the light generated by exciting the phosphor powder to form the required light. The coating method of the phosphor powder is one of the important factors affecting the light extraction efficiency of the LED. At present, there are mainly three methods of phosphor coating: phosphor close to the surface of the chip, uniform phosphor coating, and phosphor coating away from the chip. The first two coating methods have low light extraction efficiency and are less and less used. However, the packaging method in which the pho...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21Y101/02H01L33/54H01L33/48
Inventor 肖兆新
Owner 宁波市瑞康光电有限公司
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