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Encapsulating structure of MEMS chip and ASIC and encapsulating method

A packaging structure and chip packaging technology, which is applied in the directions of assembling microstructure devices, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of high production cost, complex packaging structure of MEMS chips and ASIC chips, etc. Simple package structure

Pending Publication Date: 2017-09-19
CHINA WAFER LEVEL CSP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the packaging structure of general MEMS chips and ASIC chips is relatively complicated, and the production cost is relatively high

Method used

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  • Encapsulating structure of MEMS chip and ASIC and encapsulating method
  • Encapsulating structure of MEMS chip and ASIC and encapsulating method
  • Encapsulating structure of MEMS chip and ASIC and encapsulating method

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Embodiment Construction

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0065] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0066] refer to figure 1 , figure 1 A schematic structural diagram of a packaging structure of a MEMS chip and an ASIC chip provided by an embodiment of the present invention, the packaging structure includes a M...

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Abstract

The invention discloses an encapsulating structure and an encapsulating structure of integrally encapsulating an MEMS chip and an ASIC chip. The encapsulating structure comprises the MEMS chip which is provided with opposite front face and back face and the ASIC chip which is provided with opposite front face and back face; the front face of the ASIC chip and the back face of the MEMS chip are attached and fixed, and the ASIC chip is electrically connected to the MEMS chip; a first welding bump is formed in one side, deviated from the MEMS chip, of the ASIC chip, and the first welding bump is connected to an external circuit; the encapsulating structure also comprises a cover plate which is provided with an accommodating cavity. The cover plate is arranged on the ASIC chip, the MEMS chip is located in the accommodating cavity, and the cover plate is hermetically connected to the ASIC chip. The encapsulating structure of the MEMS chip and the ASIC chip provided by the technical scheme is simple and low in manufacturing cost.

Description

technical field [0001] The present invention relates to the technical field of semiconductor devices, and more specifically, to a packaging structure and a chip packaging method. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS for short) is an industrial technology that integrates microelectronics technology and mechanical engineering, and its operating range is in the micron range. MEMS is a brand-new research and development field that must consider the mixing of multiple physical fields at the same time. Compared with traditional machinery, their size is smaller, the largest is no more than one centimeter, or even only a few microns, and their thickness is even smaller. . Application Specific Integrated Circuit (ASIC for short) is considered in the integrated circuit industry as an integrated circuit designed for a special purpose. The characteristic of ASIC is that it is oriented to the needs of specific users. Compared with general-purpose integra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81C1/00261B81C2203/01B81C2203/075
Inventor 王之奇
Owner CHINA WAFER LEVEL CSP
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