LED packaging structure and manufacturing method

Abstract

The invention discloses an LED packaging structure and a manufacturing method. The manufacturing method comprises the steps of providing an adhesive carrying device and a carrier plate, laying a first isolation film and a second isolation film, injecting adhesive, curing, cutting, and separating. The LED packaging structure comprises a flip chip, the bottom of the flip chip is provided with electrodes, the sides and the top of the flip chip are coated with packaging adhesive, and the lower surface of the packaging adhesive is higher than the lower surfaces of the electrodes. An LED packaging structure with a step between the electrodes and the packaging adhesive can be manufactured by the manufacturing method. The hole rate of connection between the LED packaging structure and a substrate is reduced, the fixing reliability of the LED packaging structure is improved, and the reliability of electrical connection between the LED packaging structure and the substrate is improved.

Description

technical field [0001] The invention relates to an LED packaging structure and a manufacturing method. Background technique [0002] The traditional packaging of LED is to fix the chip on the substrate first, and then implement the packaging process on the chip on the substrate. The LED device formed by this packaging process, on the one hand, the chip may move during the packaging process, causing The position accuracy of the chip package is not high, and it will also affect the conductivity of the chip and the substrate. On the other hand, the thickness uniformity of the package glue is difficult to control, resulting in a larger volume and weight of the LED device, which also has a certain effect on light output. influences. For LED devices with multiple chips packaged on the same substrate, such as COB light sources, etc., once the package is completed and the packaged chips are determined, if the chip consistency is not good or some chips are damaged, it will affect T...

AI Technical Summary

Problems solved by technology

In this way, during the heating process, the fluorescent adhesive layer will expand due to heat, which will cause unevenness between the fluorescent adhesive layer and the bottom of the chip, which will lead to poor contact, voids or even non-contact phenomena when the chip and the pad on the substrate are bonded, affecting the connection between the chip and the substrate. Reliability of substrate electrical connection

[0007] In view of the above technical problems, the inventor utilizes the special structure of the flip chip, and the inventor believes that if the electrodes of the flip chip and the encapsulant form a step, the above technical problem may be solved. It is fluid before curing, so it is difficult to form a step between the electrode and the encapsulant during the encapsulation process, causing a large bottleneck in manufacturing

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