24results about How to "Reduce void rate" patented technology

The present application relates to the technical field of lead-free solder paste, and more specifically, to a lead-free solder paste with low voiding rate and precision welding and a preparation method thereof, which is prepared from the following raw materials in parts by weight: 70-90 parts of tin, 1-2 parts of silver, 3-6 parts of copper, 2-5 parts of magnesium fluorosilicate, 3-6 parts of nano-carbon powder, 4-5 parts of rare earth oxide and 20-30 parts of flux. The above formula can reduce the voiding rate in the welding process, improve the wettability of the lead-free solder paste, and improve the quality and reliability of the welding points.

The invention relates to the technical field of circuit substrate manufacturing, and particularly discloses a preparation method of a composite solder sheet and an AMB ceramic copper-clad plate. The composite solder sheet is composed of an active metal foil and a copper-containing layer modified on the surface of the active metal foil, and the preparation method of the copper-clad plate comprises the following steps: after the surface of the active metal foil is pretreated, the copper-containing layer is deposited to prepare the composite solder sheet, and the composite solder sheet is placed between a copper substrate and a ceramic sheet to be pressed and assembled. And performing vacuum brazing on the assembly to complete the preparation of the ceramic copper-clad plate. A composite solder sheet containing active metal is adopted, high-temperature element diffusion during vacuum brazing is utilized at the diffusion temperature to achieve alloying of a composite solder layer, and then heat preservation is conducted at the brazing temperature to achieve uniform melting of solder and wetting metallurgical reaction between the solder and copper and between the solder and a ceramic substrate. By means of the preparation method, low-cost and high-reliability preparation of the AMB ceramic copper-clad plate can be achieved, and the prepared AMB ceramic copper-clad plate also has high peel strength and lower weld porosity.

The invention discloses soldering paste added with iodine and capable of reducing voidage and a preparation method of the soldering paste. The soldering paste is prepared from the following raw materials in percentage by mass: 85-90% of lead-free soldering powder; 9%-14% of a soldering flux; 0.1%-2% of an iodine element additive; the soldering flux is composed of the following raw materials in percentage by mass: 35%-45% of rosin; 8%-12% of a thixotropic agent; 8%-10% of an active agent; 2%-4% of an antioxidant; 2%-3% of a corrosion inhibitor; and the balance solvent. By adding the iodine additive with a specific content, the iodine additive can effectively reduce the surface tension of the soldering paste, improve the wetting effect and accelerate the diffusion and escape speed of gas, so that the purpose of reducing voidage is achieved, a special vacuum furnace is not needed, the equipment cost is effectively reduced, and the production efficiency is improved. And meanwhile, the product does not contain bromine or chlorine, so that harmful gas is not generated during welding, and the product is very environment-friendly.

The invention provides a light emitting diode and a light emitting device. The light emitting diode comprises a semiconductor lamination layer, at least one conductive hole arranged in the semiconductor lamination layer, and an insulating layer and a first bonding layer which are sequentially arranged on the inner side wall of the conductive hole, the semiconductor lamination layer and a substrate are bonded through the first bonding layer and a second bonding layer, a hole is arranged in the first bonding layer corresponding to the lower area of the conductive hole, and the second bonding layer is arranged in the hole corresponding to the lower area of the conductive hole. The repairing layer is arranged in the hole, so that the voidage in the first bonding layer is effectively improved, and the reliability of the light-emitting diode is improved; the thermal conductivity of the repairing layer is greater than that of the first bonding layer, so that the efficiency of conducting heat from the first bonding layer to the surrounding environment is improved, the risk of local hot spots is effectively reduced, and the performance of the light-emitting diode is improved; the hardness of the repairing layer is greater than that of the first bonding layer, so that the mechanical strength of the first bonding layer is improved, and the durability and reliability of the light-emitting diode are improved.

The application provides a precision preformed soldering piece and a preparation method thereof. By arranging a graphene layer between the preformed soldering piece and a flux layer, the welding quality and efficiency can be improved, the energy consumption and environmental pollution in the welding process can be reduced, the welding strength and corrosion resistance can be improved, the oxidation and thermal stress in the welding process can be reduced, the cavity rate can be reduced, the precision can be improved, fullerene is added in the alloy raw material, the fullerene has high chemical stability and strong mechanical properties, can form strong bonding with rare earth metals, has high heat conduction performance, can effectively dissipate heat, avoids overheating of the welding part to cause failure, significantly reduces the cavity rate, improves the precision of the welding, reduces the welding temperature required by the preformed soldering piece, and has excellent oxidation resistance, which can effectively prevent the oxidation of the metal surface.

The invention discloses a black vehicle-oriented real-time point cloud fusion detection method, system and device, and a medium. The method comprises the following steps: step 1, obtaining point cloud data through a laser radar; 2, scanning the point cloud data, marking the continuous point cloud blocks with the reflection intensity of 0 as unlicensed car identifiers, and storing the unlicensed car identifiers in point cloud attribute positions; step 3, performing dual-thread compensation, performing clustering operation on the point cloud data set with the unlicensed car identifier by using DBSCAN, and performing imaging processing on a clustering operation result by using Point Pill to obtain a three-dimensional image model; forcibly outputting an unlicensed vehicle detection frame image according to an image processing result or improving the confidence coefficient as an unlicensed vehicle compensation confidence coefficient, and preferentially adopting a model result; when the two conditions do not belong to the above two conditions, performing weighted fusion on the operation result; and step 4, fusing operation results in the step 3 into a complete three-dimensional frame image. Therefore, the problem of missing detection is solved, and the detection rate and detection efficiency are improved.

This invention relates to the field of advanced semiconductor packaging and chiplet integration technology, specifically disclosing a heterogeneous die system-on-a-chip and its fabrication method. The method includes: S1: providing an adapter board, the top surface of which is provided with a first I / O pad, and forming a first metal interconnect region above the first I / O pad, or using the first I / O pad as the first metal interconnect region; S2: providing a chiplet, the top surface of which is provided with a second I / O pad, and fabricating a second metal interconnect region on the top surface of the chiplet. This invention achieves self-aligned interconnection of the metal interconnect regions between the chiplet and the adapter board by combining an open area on the top surface of the adapter board with selective deposition, eliminating the need for high-precision photolithography alignment and significantly reducing process complexity. Simultaneously, this method supports multi-layer PAD expansion, multi-array parallel interconnection, wafer-level batch integration, and various layout methods, achieving high-density, low-latency, and high-reliability chiplet interconnection.

The invention belongs to the technical field of semiconductor TO series packaging, specifically a packaging structure of a reverse-bend inner insulation product, and its technical solution is: including a heat sink, an epoxy colloid, a chip, an alumina substrate, and a frame pin. A welding strip three is arranged above the heat sink, the alumina substrate is arranged above the welding strip three, a welding strip two is arranged above the alumina substrate, the frame pin is arranged on the welding strip two, and a welding strip one is arranged above the frame pin. The beneficial effects of the invention are: the arrangement of the alumina substrate insulates the chip and the heat sink, so that the chip and the heat sink can be completely insulated, the heat of the chip can be effectively dissipated through the heat sink, and the insulation of the chip can be achieved. The arrangement of the first stress release groove, the second stress release groove and the third stress release groove enables the chip to be assembled and sintered on the frame pin to achieve complete melting, thereby reducing the void rate on the back of the chip.

A method for forming a semiconductor structure, the method comprising: providing a substrate, the substrate having gate structures formed thereon, source / drain doped layers formed in the substrate on both sides of the gate structures, source / drain interconnect lines formed between adjacent gate structures, the source / drain interconnect lines covering the top of the source / drain doped layers and electrically connected to the source / drain doped layers, and an interlayer dielectric layer formed on the substrate, the interlayer dielectric layer covering the gate structures and the source / drain interconnect lines; forming a first interconnect plug through the interlayer dielectric layer, the first interconnect plug being on top of a gate structure and electrically connected to the gate structure, or the first interconnect plug being on top of a source / drain interconnect line and electrically connected to the source / drain interconnect line; forming a growth inhibition layer on top of the first interconnect plug; forming a first opening through the interlayer dielectric layer; and forming a second interconnect plug in the first opening, the second interconnect plug being electrically connected to a structure to be interconnected. The probability of the first interconnect plug contacting an adjacent second interconnect plug is reduced, thereby affecting the performance of the semiconductor structure.

The invention provides a brazing method for a low-void-ratio uncooled infrared detector tube shell, and relates to the technical field of brazing, and the brazing method comprises the steps that the side edge of a sealing ring is plated with gold to limit solder climbing, the solder is fixed in situ after being completely molten, and the void ratio is reduced. And meanwhile, the brazing temperature is adjusted, so that the welding flux is completely melted in a welding area, the viscosity of the welding flux is reduced, bubbles in the welding flux are discharged under the pressurization action of the clamp, and the void rate of ceramic welding conducted through a chain type brazing furnace is effectively reduced to be within 5%.

The present invention discloses a flip-chip LED chip with low void ratio and a preparation method thereof. The flip-chip LED chip comprises a substrate, a light-emitting structure arranged on the substrate, an electrode arranged on the light-emitting structure, a welding layer arranged on the electrode, and a point-measurement contact layer arranged on the welding layer; the welding layer is made of Au and Sn, and the mass percentage of Au and Sn is (15% to 30%): (70% to 85%); wherein the welding layer is a laminated structure, including a multi-layer Sn / Au laminate; or, the welding layer is a laminated structure, including a multi-layer Sn / AuSn laminate; or, the welding layer is a laminated structure, including a multi-layer Au x Sn 1‑x Layer, each layer of Au x Sn 1‑x The ratio of Au to Sn is different. The flip-chip LED chip of the present invention has low void rate and high yield.

The invention relates to the technical field of pole piece welding, in particular to a composite current collector pole piece welding method of a laminated battery. The method specifically comprises the following steps: (1) coating pole piece paste on the surfaces of a plurality of composite current collectors, and reserving a tab blank area to obtain a composite current collector pole piece; (2) welding an adapter foil in a tab blank area of the composite current collector pole piece; (3) sequentially laminating the composite current collector pole pieces welded in the step (2), and after lamination is completed, welding the composite current collector pole pieces which are laminated up and down to obtain a semi-finished product of the laminated current collector pole piece; and (4) carrying out pressure fusion welding treatment on the welding part on the semi-finished product of the laminated current collector pole piece, and completing welding to obtain the laminated current collector pole piece. According to the invention, before welding, the tab blank area of the composite current collector pole piece is coated with the cleaning-free soldering flux, and under the synergistic effect of the welding process and the soldering flux, the quality of the welding part is greatly improved, and the defects such as cavities at the welding part are reduced.

The invention relates to the technical field of automatic driving, in particular to an open set 3D occupancy prediction framework suitable for an automatic driving scene, which comprises a multi-source data processing module, an occupancy prediction processing module, a model training optimization module and a post-processing and visualization module. According to the open set 3D occupancy prediction framework suitable for the automatic driving scene and the implementation method, through a dynamic-static separation fusion-Poisson reconstruction technology, high-quality dense 3D occupancy representation is generated, holes are filled, semantic differences between a dynamic target and a static scene are reserved, the void rate of a voxel grid after densification is reduced in a nuScenes data set test, and the performance of the open set 3D occupancy prediction framework suitable for the automatic driving scene is improved. The method has the advantages that the accuracy of semantic tags is improved, the problem of sparsity of 3D data is solved, 2D visual features, 3D voxel features and CLIP text features are aligned through knowledge distillation loss, and high-precision prediction of known categories and effective recognition of unknown categories are realized at the same time through double prediction heads and an unknown category decision-making mechanism.

The application relates to a formic acid tin paste with ultra-low porosity, a preparation method and application thereof, the tin paste is prepared from the following raw materials in percentage by mass: 85-90% of alloy welding powder and 10-15% of a fluxing agent; the fluxing agent comprises the following raw materials in parts by weight: 5-10 parts of an activator, 1-5 parts of a rheological agent, 30-40 parts of an organic solvent, 20-30 parts of a paste forming agent, 3-5 parts of a surfactant and 0.1-0.5 parts of a corrosion inhibitor, the surfactant is a composition of lauryl amphoteric imidazoline surfactant, isomeric tridecanol polyoxyethylene ether and N-vinyl caprolactam, and the activator is a composition of castor oil acid, ethylenediaminetetraacetic acid and succinic acid amine salt. The surfactant and the activator in the fluxing agent of the application synergistically act, ensure the welding surface and the solder cleanliness, improve the wettability and the flowability, reduce the porosity, make the solder uniformly spread and fill, form a high-quality welding spot, and significantly reduce the tin paste porosity.

The utility model relates to concrete sleeper preparation technical field, concretely is a reinforced concrete sleeper mould vibration forming device, including fixed base, the upper end of fixed base is connected with mould body with sliding, the middle part fixed mounting of mould body lower extreme has the support, one side fixed mounting of support has the gyro wheel, the one side of fixed base upper end middle part is provided with the guide rail, the other side of fixed base upper end middle part is provided with the installation groove, the both sides of middle part one end inner wall of installation groove all are fixedly installed with strong spring, one end of two strong springs all are fixedly installed with the baffle, the both sides of fixed base one end middle part all are provided with the moving groove, the middle part of two moving grooves all are connected with sliding block with sliding, the middle part rotation of two sliding blocks is installed with the pivot, the utility model solves the traditional reinforced concrete sleeper mould usually and the vibration structure between through rigid connection, there are many problems of many insufficiencies in actual use.

The invention relates to the technical field of printed circuit board sintering, and discloses a PCB (printed circuit board) sintering tool, which comprises a pressing plate and a plurality of spring needles, the pressing plate is fixed on the base and comprises a plurality of first limiting through holes, and the first limiting through holes are in one-to-one correspondence with the spring needles; the spring needle comprises a main body, a spring, a pressure head and a flange; the spring is arranged at the head part of the main body, one end of the spring is fixed, and the other end of the spring is connected with the tail part of the pressure head; the flange is fixedly connected to the outer surface of the main body, and the diameter of the flange is larger than that of the first limiting through hole; the main body penetrates through the first limiting through hole, the head portion of the pressing head makes contact with the PCB, the flange makes contact with the lower surface of the pressing plate, and the spring is in a compressed state. According to the invention, the probability of voids after sintering caused by gaps generated by height reduction after tin sheet melting can be reduced.

This invention relates to the field of semiconductor materials and discloses a method for preparing a ceramic copper-clad substrate. First, silicon nitride ceramic and oxygen-free copper sheets are encapsulated to isolate them from oxygen. The encapsulated sample is then placed in a spark plasma sintering furnace and evacuated to a vacuum of 1.0 x 10⁻⁶. ‑3 The sample was heated to 700-750℃ to obtain a sealed enclosure with a high internal vacuum. Finally, it was placed in a hot isostatic pressing furnace under a uniform pressure of 150-200 MPa and a temperature of 700-750℃ to ensure a uniform and tightly bonded internal structure within the silicon nitride ceramic substrate. A transition layer of approximately 2 μm thick was formed between the ceramic and the copper sheet through interdiffusion, resulting in a tight bond between the silicon nitride ceramic and copper with low porosity.

The utility model discloses a semiconductor laser packaging device, which comprises a tube socket, a tube pin arranged below the tube socket, and a tube tongue arranged on the tube socket, a heat sink and a laser chip are mounted on the tube tongue; a first connecting layer is arranged between the laser chip and the heat sink; a second connecting layer is arranged between the heat sink and the tube tongue; the change angles of the thermal resistance calculus curves of the first connecting layer, the heat sink, the second connecting layer and the tube base are designed, the interface heat conduction channel and the interface thermal resistance steepness are improved, the multi-interface heat conduction channel and the inclined interface thermal resistance steepness are formed, the voidage of the first connecting layer and the second connecting layer is reduced from 25-50% to 0-25%, and the thermal resistance steepness of the interface is improved. And the heating value of the emergent end surface, the thermal density and the cavity surface load of the cavity surface, the hole burning effect and the burning proportion of the laser are reduced, and the service life of the laser is prolonged from 10,000 hours to 50,000 hours (the luminous decay is less than 50%).

The invention relates to the technical field of photoelectric device processing, in particular to a pair of tweezers for eutectic sintering of small photoelectric device chips, which comprises a clamping structure, a high-temperature-resistant adapter and a tip structure, the clamping structure comprises a first clamping arm and a second clamping arm, and each of the first clamping arm and the second clamping arm comprises a connecting end, a handheld end and a fixed end; the upper end face and the lower end face of the handheld end are connected with the connecting ends and the fixing end respectively, and the two connecting ends are attached and fixed to each other. The tip structure comprises a first tweezers head and a second tweezers head; the fixed end of the first clamping arm is fixedly connected with a first tweezers head through a high-temperature-resistant adapter, and the fixed end of the second clamping arm is fixedly connected with a second tweezers head; the first tweezers head and the second tweezers head are of the same structure and each comprise a tip part and a flat part connected with one end of the tip part. The tool can effectively prevent a chip and a tube shell gold layer from being scratched.

The invention discloses flux paste for low-voidage solder paste and a preparation method of the flux paste. The flux paste comprises the following components in percentage by mass: 0.1-0.5% of a chelating agent, 0.01-0.2% of a flatting agent, 2.0-10.0% of a nonionic low-foaming surfactant, 3-10% of an active agent, 2-5% of a thickening agent and the balance of a mixture of rosin resin, a solvent and a thixotropic agent. The active agent is a mixture compounded by trimethyl butenediol and 2-dimethylolpropionic acid (DMPA) according to the mass ratio of (3-7): (2-5), and the nonionic low-foaming surfactant is a mixture compounded by TRITON CF-32 and alkyl alcohol polyoxyethylene (25) ether according to the mass ratio of 2: 1. Solder paste prepared from the flux paste prepared by the method is extremely low in BGA welding spot void rate, high in activity and good in stability, can effectively improve the reliability of welding spots of electronic products, and is particularly suitable for high-precision welding with the reliability requirement.

The invention relates to anti-fatigue high-reliability solder paste and a preparation method thereof. The solder paste is mainly prepared from the following raw materials in percentage by mass: 85-90% of alloy welding powder and 10-15% of paste flux, wherein the alloy welding powder comprises main body welding powder, alloy powder A and alloy powder B; the paste flux comprises the following raw materials in parts by weight: 5-10 parts of an activating agent, 1-5 parts of a rheological agent, 20-30 parts of an organic solvent, 20-30 parts of a paste forming agent, 0.1-0.5 part of a modified filler and 0.1-0.5 part of a corrosion inhibitor. The solder paste has the advantages of being good in welding strength, resistant to fatigue, low in cavity and high in insulation resistance.

The application discloses an active metal brazing ceramic copper-clad plate and a preparation method thereof. The active metal brazing ceramic copper-clad plate has a structure from top to bottom as follows: an oxygen-free copper foil (201) with a thickness of 0.2mm-2mm; an active metal brazing paste (301) with a thickness of 10um-40um; a ceramic substrate (10) with a thickness of 0.25mm-1mm; an active metal brazing paste (302) with a thickness of 10um-40um; and an oxygen-free copper foil (202) with a thickness of 0.2mm-2mm. The active metal brazing paste comprises active metal brazing filler powder and active metal brazing filler organic carrier, and the mass percentage of the active metal brazing filler organic carrier is 10wt%-20wt%. Compared with the prior art, the application has the following beneficial effects: the active metal brazing ceramic copper-clad plate realizes low-stress and high-strength brazing combination of the ceramic substrate and the oxygen-free copper foil, and has the advantages of high peeling strength, low cavity rate, low surface warping degree, high heat cycle reliability and the like.

The utility model discloses a kind of chip vacuum welding tool, including the bottom plate of interval arrangement, middle plate and top plate, and the bottom plate is connected between middle plate by positioning pin, and the middle plate is connected between top plate by pillar;Multiple pressing blocks for fixing chip are opened in top plate, and pressing block includes countersunk cap and pressing rod, and countersunk cap diameter is greater than pressing rod diameter, and positioning hole matched with countersunk cap is opened in top plate, and through hole matched with pressing rod is equipped on middle plate, and tool acupoint is equipped on bottom plate with through hole one to one corresponding.The utility model chip is placed in the acupoint of bottom plate, and middle plate and top plate are connected by pillar, and pressing block successively passes through top plate and middle plate, and chip is pressed by the gravity of pressing block itself downwards.

The embodiment of the invention provides a welding method and a welding system. The method comprises the steps that a heat dissipation bonding pad is drawn based on bonding pad layout parameters so that the heat dissipation bonding pad composed of a plurality of sub bonding pads can be printed on a circuit board of the data transmission module, the bonding pad layout parameters at least comprise shape parameters and size parameters, and the interval between every two adjacent sub bonding pads in the multiple sub bonding pads is larger than a preset interval; a printing steel mesh corresponding to the heat dissipation bonding pad is manufactured based on steel mesh design parameters, the steel mesh design parameters at least comprise shape parameters and size parameters, the shape parameters in the steel mesh design parameters are the same as the shape parameters in the bonding pad layout parameters, and the size parameters in the steel mesh design parameters are the same as the size parameters in the bonding pad layout parameters; before the reflow soldering stage, a welding agent is printed on the heat dissipation bonding pad through the printing steel mesh, and welding of the data transmission module is achieved. In this way, the voidage after welding is reduced, and the influence on the use performance of the vehicle machine and the use experience of a user is avoided.