The invention discloses a method for preparing a ceramic copper-clad plate by a hot-pressing active brazing method. The method comprises the following steps that 1, a ceramic chip is ultrasonically cleaned with pure water under the condition of 70 DEG C for 1-10min and then dried in a drying oven at the temperature of 100 DEG C; 2, the two faces of the dried ceramic chip are evenly coated with silver-copper welding flux containing active metal ingredients and dried in the drying oven at the temperature of 60-90 DEG C; 3, the two faces, coated with the welding flux, of the ceramic chip are in fit with copper sheets to form a set A; 4, multiple sets A are stacked, and every two adjacent sets A are isolated through an isolation sheet; 5, the structure of the multiple stacked sets A is placedinto a hot pressing furnace, and 0-30 MPa pressure is applied to the two ends of the structure; 6, heating along with the furnace is started when vacuum is pumped to 10<-3>Pa, heat preservation is carried out for 30-90min at the temperature of 400-500 DEG C, then, glue discharge is carried out, and heat preservation is carried out for 10-60min at the temperature of 800-950 DEG C for brazing. By adopting vacuum hot-pressing active brazing, the prepared ceramic copper-clad plate has the characteristics of extremely low void ratio, high drawing force, solder saving, high production efficiency, simple operation in the preparation process and the like.