Epoxy adhesive integrated potting system and method satisfying anti-hard target requirement

Abstract

The invention discloses an epoxy adhesive integrated potting system satisfying an anti-hard target requirement. The integrated potting system comprises a perfusion system, a vacuum system, a temperature control system and a vibration system. The epoxy adhesive integrated potting system, by using a potting way integrating vibration, temperature control and vacuumizing, solves the problem that a closed cavity built-in printed board component is complex in structure and still has void defects after vacuum potting, further improves the fluidity of the epoxy adhesive, improves the wetting ability of the printed board component and other structural parts, basically realizes the non-hole potting of the epoxy adhesive, and satisfies the anti-impact and anti-vibration abilities of aerospace products under a large-overload condition.

Description

technical field [0001] The invention belongs to the field of encapsulation of printed boards of aviation products, and in particular relates to an epoxy glue integrated encapsulation system and method meeting the requirements of anti-hardness targets, which are used to improve the reliable wetting and void-free filling of epoxy glue of fuze printed board parts Sealed to ensure the reliability of printed board work under high overload, shock and vibration conditions. Background technique [0002] Existing aerospace and military enterprises generally use vacuum potting equipment for epoxy glue potting of printed board components. [0003] The feature of the existing equipment is to vacuumize and defoam after the epoxy glue is potted. [0004] Vacuum potting equipment is used for the complex structure of printed board components in closed cavities. Because there are a large number of tiny gaps at the bottom of resistors and capacitors, between components, at the root of wires,...

AI Technical Summary

Problems solved by technology

[0007] Aiming at at least one of the above defects or improvement needs of the prior art, combined with the special requirements of anti-large overload and anti-hardness target products, the present invention provides an epoxy glue integrated potting system that meets the anti-hardness target requirements, using vibration, The three-in-one potting method of temperature control and vacuum pumping solves the problem of void defects after vacuum potting of the complex structure of the printed board parts in the closed cavity, further improves the fluidity of the epoxy glue, and improves the quality of the printed board parts. The wettability of epoxy glue and other structural parts has been basically realized, and the epoxy glue has no void potting, which meets the ability of aerospace products to resist shock and vibration under large overload conditions

Images