Brazing device and method capable of reducing solder overflow

A brazing method and solder technology are applied in the field of microwave hybrid integrated circuit generation equipment, which can solve the problems of inability to guarantee a low void rate and a large amount of solder overflow, and achieve the effects of improving reliability, reducing overflow and reducing void rate.

Active Publication Date: 2021-12-21
BEIJING INST OF RADIO MEASUREMENT
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The brazing tooling in the prior art cannot guarantee a low void rate, and the solder overflows more

Method used

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  • Brazing device and method capable of reducing solder overflow
  • Brazing device and method capable of reducing solder overflow
  • Brazing device and method capable of reducing solder overflow

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Embodiment Construction

[0045] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0046] Such as Figure 1 to Figure 9 As shown, the embodiment of the present invention provides a soldering device for reducing solder overflow, which includes: a base 1 for loading parts to be soldered and a box body, a pressing plate 2, and at least one pressing pin for pressing parts to be soldered 3. The pressing plate 2 is detachably installed on the top of the base 1 , and the pressing pin 3 is slidably installed on the pressing plate 2 .

[0047] The beneficial effects of the present invention are: by designing a brazing device with a base, a pressing plate and a pressing needle to reduce the overflow of solder, the pressure of the parts to be welded is adapted to avoid the welding of the solder due to high p...

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Abstract

The invention provides a brazing device and method capable of reducing solder overflow. The brazing device capable of reducing solder overflow comprises a base used for loading a to-be-welded part and a box body, a pressing plate and at least one pressing needle used for extruding the to-be-welded part, the pressing plate is detachably installed at the top end of the base, and the pressing needle is installed on the pressing plate in a sliding manner. By designing the brazing device capable of reducing the solder overflow, the brazing device is provided with the base, the pressing plate and the pressing needle, the pressure borne by the to-be-welded part during welding is adapted, the situation that the solder overflows too much due to large or uneven pressure after melting is avoided, the overflow amount of the solder is effectively reduced, the voidage of low-temperature brazing is reduced, and the reliability of low-temperature brazing is improved.

Description

technical field [0001] The invention relates to the technical field of microwave hybrid integrated circuit production equipment, in particular to a brazing device and a brazing method for reducing solder overflow. Background technique [0002] With the development of microwave modules towards miniaturization, light weight, and high-frequency bands, the degree of module integration is getting higher and higher, and the heat dissipation efficiency and high-reliability grounding of module components have increasingly become the focus of module assembly. Low-temperature brazing is a highly reliable grounding method between the module components and the box body. The welding effect is very important. It is necessary to ensure the low void rate after the module is welded, and to avoid the impact of solder overflow on the subsequent micro-assembly process as much as possible. . Therefore, the quality of the tooling used in low-temperature brazing has become a direct and effective ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K3/00B23K3/08
CPCB23K1/0008B23K3/00B23K3/08Y02P70/50
Inventor 王曙光张鑫刘公林刘晶
Owner BEIJING INST OF RADIO MEASUREMENT
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