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Method for preparing ceramic copper-clad plate by hot-pressing active brazing method

A ceramic copper clad laminate and active brazing technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low pulling force, multi-solder, high welding void rate, and achieve high pulling force and high production efficiency. , the effect of low voiding rate

Inactive Publication Date: 2019-07-30
WUXI TIANYANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, ceramic copper-clad laminates are generally prepared by vacuum pressure-free brazing, but ceramic copper-clad laminates prepared by vacuum pressure-free brazing have a high welding void rate, low pull-out force, and require more solder.

Method used

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  • Method for preparing ceramic copper-clad plate by hot-pressing active brazing method
  • Method for preparing ceramic copper-clad plate by hot-pressing active brazing method
  • Method for preparing ceramic copper-clad plate by hot-pressing active brazing method

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Embodiment 1

[0023] Embodiment 1, see Figure 1-3 , the present invention provides a technical solution: a method for preparing a ceramic copper-clad laminate by hot-pressing active brazing, comprising the following steps;

[0024] Step 1: Clean the tiles with pure water at 70°C for 8 minutes and then dry them in an oven at 100°C;

[0025] The tiles include: aluminum nitride, silicon nitride, aluminum oxide, ZTA and other ceramic tiles commonly used in copper clad laminates;

[0026] Step 2. Evenly coat both sides of the dried tiles with silver-copper solder containing active metal components, and dry them in an oven at 85°C;

[0027] The active metal components of the silver-copper solder include: one or more combinations of nickel, titanium, chromium, vanadium, zirconium and hafnium;

[0028] In the active solder, silver accounts for 50%, copper accounts for 48%, and active metal accounts for 2%;

[0029] Step 3. Set the copper sheet on both sides of the ceramic sheet coated with sold...

Embodiment 2

[0034] Example 2, see Figure 1-3 , the present invention provides a technical solution: a method for preparing a ceramic copper-clad laminate by hot-pressing active brazing, comprising the following steps;

[0035] Step 1: Clean the tiles with pure water at 70°C for 9 minutes and then dry them in an oven at 100°C;

[0036] The tiles include: aluminum nitride, silicon nitride, aluminum oxide, ZTA and other ceramic tiles commonly used in copper clad laminates;

[0037] Step 2: Evenly coat both sides of the dried tiles with silver-copper solder containing active metal components, and dry them in an oven at 75°C;

[0038] The active metal components of the silver-copper solder include: one or more combinations of nickel, titanium, chromium, vanadium, zirconium and hafnium;

[0039] In the active solder, silver accounts for 48%, copper accounts for 49.5%, and active metal accounts for 2.5%;

[0040] Step 3. Set the copper sheet on both sides of the ceramic sheet coated with sol...

Embodiment 3

[0045] Example 3, see Figure 1-3 , the present invention provides a technical solution: a method for preparing a ceramic copper-clad laminate by hot-pressing active brazing, comprising the following steps;

[0046] Step 1: Clean the tiles with pure water at 70°C for 10 minutes and then dry them in an oven at 100°C;

[0047] The tiles include: aluminum nitride, silicon nitride, aluminum oxide, ZTA and other ceramic tiles commonly used in copper clad laminates;

[0048] Step 2. Evenly coat both sides of the dried tiles with silver-copper solder containing active metal components, and dry them in an oven at 85°C;

[0049] The active metal components of the silver-copper solder include: one or more combinations of nickel, titanium, chromium, vanadium, zirconium and hafnium;

[0050] In the active solder, silver accounts for 53%, copper accounts for 44%, and active metal accounts for 3%;

[0051] Step 3. Set the copper sheet on both sides of the ceramic sheet coated with solder...

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Abstract

The invention discloses a method for preparing a ceramic copper-clad plate by a hot-pressing active brazing method. The method comprises the following steps that 1, a ceramic chip is ultrasonically cleaned with pure water under the condition of 70 DEG C for 1-10min and then dried in a drying oven at the temperature of 100 DEG C; 2, the two faces of the dried ceramic chip are evenly coated with silver-copper welding flux containing active metal ingredients and dried in the drying oven at the temperature of 60-90 DEG C; 3, the two faces, coated with the welding flux, of the ceramic chip are in fit with copper sheets to form a set A; 4, multiple sets A are stacked, and every two adjacent sets A are isolated through an isolation sheet; 5, the structure of the multiple stacked sets A is placedinto a hot pressing furnace, and 0-30 MPa pressure is applied to the two ends of the structure; 6, heating along with the furnace is started when vacuum is pumped to 10<-3>Pa, heat preservation is carried out for 30-90min at the temperature of 400-500 DEG C, then, glue discharge is carried out, and heat preservation is carried out for 10-60min at the temperature of 800-950 DEG C for brazing. By adopting vacuum hot-pressing active brazing, the prepared ceramic copper-clad plate has the characteristics of extremely low void ratio, high drawing force, solder saving, high production efficiency, simple operation in the preparation process and the like.

Description

technical field [0001] The invention relates to the technical field of ceramic copper-clad laminates, in particular to a method for preparing ceramic copper-clad laminates by hot-pressing active brazing. Background technique [0002] Copper-clad laminate, also known as base material, is a plate-like material formed by impregnating the reinforcing material with resin, covering one or both sides with copper foil, and hot pressing, called copper-clad laminate, which is the basic material for PCB. , often called the base material, when it is used in the production of multi-layer boards, it is also called the core board; [0003] At present, ceramic copper-clad laminates are generally prepared by vacuum pressure-free brazing. However, ceramic copper-clad laminates prepared by vacuum pressure-free brazing have a high welding void rate, low pull-out force, and require more solder. Contents of the invention [0004] The object of the present invention is to provide a method for p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K35/30
CPCB23K1/008B23K35/3006
Inventor 王晓刚陆聪郑彬
Owner WUXI TIANYANG ELECTRONICS
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