Packaging method of semiconductor device and semiconductor device

Abstract

The invention provides a packaging method of a semiconductor device and a semiconductor device, and relates to the technical field of semiconductor device packaging. A mask plate with a plurality of first holes is used for evaporating solder on a to-be-welded surface of a first structure, therefore, a plurality of solder protrusions with the heights gradually reduced from the middle of the first structure to the two sides of the first structure are formed on the surface of the solder; in the welding process, the high solder protrusions located in the middle contact with a second structure and are subjected to fusion welding, the low solder protrusions contact with the second structure and achieve welding, and sequential welding is achieved in the direction from the middle to the two sides; gas generated in the welding process and air between the first structure and the second structure can be exhausted from the gaps (a solder groove structures) between two adjacent solder protrusions or the second structure and the top areas of the solder protrusions with the smaller height, so that the probability that holes appear in a solder layer after welding is reduced, the thermal resistance of an interface is reduced, and the heat dissipation effect is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor device packaging, in particular to a semiconductor device packaging method and the semiconductor device. Background technique [0002] At present, in the packaging process of semiconductor devices, two structural parts are usually welded together by heating the solder. Usually, due to the influence of the viscosity, humidity, wettability and other material properties of the solder and the soldering process method, it will cause A large number of bubbles are generated in the solder layer (on the one hand, the bubbles are formed when the air cannot be discharged during soldering, and on the other hand, the solder flux generates gas when heated), forming voids. For high-power semiconductor devices, when the void rate is large When the temperature is high, it will lead to uneven heat conduction, seriously affect the heat dissipation effect, lead to low heat transfer efficiency, increase thermal ...

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Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor device packaging method and a semiconductor device, so as to alleviate the existing high-power semiconductor device packaging process that will form a large number of cavities in the solder layer, seriously affecting the heat dissipation effect, resulting in low heat transfer efficiency, Increased thermal resistance, even leading to technical problems of semiconductor devices failing due to thermal fatigue

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