Process method for vacuum reflow eutectic welding

A vacuum reflow and eutectic welding technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid state devices, etc., can solve the problems of uneven temperature distribution, slow heating speed, etc., to achieve versatility, increase absorption, reduce The effect of pollution

Inactive Publication Date: 2020-11-27
SHANGHAI INST OF TECH
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Problems solved by technology

[0006] Due to the problems of uneven temperature distribution and slow temperature rise in the welding equipment of the prior art, the present invention combines the heating methods of hot air heating and radiation heating, and adopts the method of combining the two heating methods to solve the problem of slow temperature rise and uneven temperature distribution. problem, which can improve welding quality

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  • Process method for vacuum reflow eutectic welding
  • Process method for vacuum reflow eutectic welding
  • Process method for vacuum reflow eutectic welding

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Embodiment 1

[0060] Select the LED chip as the welding sample chip, and use the above-mentioned vacuum reflow furnace and welding process to carry out four sets of welding experiments. The welding process flow chart can be found in figure 1 and figure 2 , the heating curves of the four sets of welding experiments can be found in Figure 7 . Among them, the size specification of the substrate: 4*8*0.2mm, the size specification of the solder preform: 4*3.2*0.0254mm, and the size specification of the sample chip: 4*3.2*0.10mm.

[0061] The first group: set the preheating temperature of the conveyor belt 3 and the heating substrate 7 to 285°C, provide 60% hot air + 40% radiation for basic heating, set the temperature of the hot nitrogen flow in the vacuum area to 280°C, and set the hot nitrogen flow time to 30 Seconds, once the temperature in the vacuum chamber reaches the preset temperature of 350°C, the nitrogen flow will be automatically closed. After the welding is completed, the void ...

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Abstract

The invention discloses a process method of vacuum reflow eutectic welding. The method comprises the steps of S1, taking out a heating substrate in a vacuum reflow furnace and carrying out plasma cleaning; S2, drying the heating substrate and fixing the heating substrate to a conveying device; S3, placing a sample after die bonding, and adjusting the position of a quartz air pipe; S4, setting eutectic welding parameters; and S5, carrying out welding quality inspection, wherein an improved vacuum reflow furnace is adopted for eutectic welding, the vacuum reflow furnace adopts a first heat source and a second heat source to provide heat required by sample welding, the first heat source provides hot air for heating, and the second heat source provides radiant heat. According to the invention,heat needed by eutectic welding is provided in a hot air heating mode and a radiation heating mode at the same time, the effect of rapid temperature rising can be achieved, the welding quality of a sample is improved, and the welding void ratio is reduced. The process method provided by the invention is simple to operate, high in safety, universal and suitable for production of small-batch and multi-variety products.

Description

technical field [0001] The invention relates to a semiconductor chip eutectic welding method, in particular to a vacuum reflow eutectic welding process. Background technique [0002] With the rapid development of the communication industry, multi-chip components are widely used in aerospace, military communication and other fields due to their high density, high performance, high reliability, light weight, and small size. Eutectic is an important welding process in microelectronics assembly technology, and it is more and more widely used in electronic vehicles, IGBTs and LEDs, especially in high-power devices. [0003] At present, eutectic welding generally adopts manual eutectic method, eutectic furnace sintering method, and automatic eutectic placement machine method. Among them, eutectic furnace sintering method and automatic eutectic placement machine method are due to high equipment purchase costs and are suitable for large quantities. , It is not suitable for the prod...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/488H01L21/02H01L21/324
CPCH01L24/75H01L24/77H01L23/488H01L21/02057H01L21/324H01L2224/75H01L2224/7715
Inventor 王伟邹军石明明
Owner SHANGHAI INST OF TECH
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