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Surface mounting device and method for silver solder paste connection

A surface mount and silver soldering technology, which is applied to the assembly of printed circuits with electrical components, electrical components, and printed circuit manufacturing, can solve the problems of not being able to significantly reduce the void rate of the solder paste layer, and achieve compact structure, overall appearance and firmness, well-structured effects

Pending Publication Date: 2018-02-23
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The current common surface mount devices can only realize the accurate installation between the chip and the substrate, and the function of squeezing the connection layer in the Z-axis direction, and cannot significantly reduce the void rate of the solder paste layer

Method used

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  • Surface mounting device and method for silver solder paste connection
  • Surface mounting device and method for silver solder paste connection
  • Surface mounting device and method for silver solder paste connection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] 1. Sample preparation: Print the silver solder paste evenly on the surface of the substrate by screen printing to ensure a smooth surface.

[0033] 2. Lofting: Place the substrate coated with solder paste and the chip to be mounted on the sample stage (6) respectively, and use the optical microscope (2) to ensure that the sample is within a reasonable field of view.

[0034]3. Picking: adjust the high-precision differential head (5) and combine the visual centering system (2) to make the chip move to the bottom of the vacuum nozzle (7), and adjust the displacement adjustment knob (9) to make the vacuum nozzle (7) Drop and contact the chip, turn on the vacuum pump, pick up the chip, and pick up the chip by adjusting the displacement adjustment knob (9).

[0035] 3. Positioning: adjust the high-precision differential head (5) and combine with the visual centering system (2), so that the solder paste printing position of the substrate is translated to the directly below th...

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Abstract

The invention relates to a surface mounting device and method for silver solder paste connection. The surface mounting device comprises an optical adjustment rack and a vision processing system fixedon the rack, wherein a precise mobile platform is arranged on a base plate at the lower part of the vision processing system; the precise mobile platform is provided with high-precision micrometer heads on the horizontal plane along X-axis and Y-axis directions separately; the precise mobile platform is provided with a sample platform; a vacuum nozzle is arranged above the sample platform; the upper part of the vacuum nozzle can be connected with a vacuum pump through a sealing pipeline; the vacuum nozzle and a displacement adjustment knob are fixed on the optical adjustment rack; and the optical adjustment rack is fixed on the base plate. According to the surface mounting device, high-precision chip mounting at the position, at which solder paste is printed, on a substrate can be achievedby combining the vision processing system through multi-axis coordination work; and high vacuum can be achieved by the vacuum nozzle, so that the surface mounting device is suitable for chips of allsizes and shapes, and is reasonable in structure and simple in operation.

Description

technical field [0001] The invention relates to a surface mount device and method for silver solder paste connection, in particular to a method for reducing the void rate of the silver solder paste connection layer in the process of using silver solder paste to realize the interconnection of chips and substrates, thereby improving the silver solder paste. Surface mount device and method for paste connection reliability. Background technique [0002] Chip interconnect materials usually play the roles of electrical / thermal conduction, physical protection and mechanical support in the work of electronic components, and are an important part of high-power integrated circuits. With the development of third-generation semiconductor materials, traditional low-melting-point solder alloys can no longer meet the high-temperature applications of high-power electronic components. Low-temperature sintered silver solder paste, as a new type of solder substitute alloy, has high connection...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K3/34
CPCH05K3/341H05K13/0408H05K2203/0195
Inventor 李欣李洁梅云辉陆国权
Owner TIANJIN UNIV
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