Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug

A preformed solder and flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as poor tinning and virtual welding, and achieve less residue, good wettability, and low The effect of voiding

Active Publication Date: 2016-09-07
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no good technical solution in the industry to solve this kind of problem. They all reduce the void rate by reducing the flux content, but reducing the flux content will lead to poor tinning and abnormal solder joints.

Method used

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  • Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug
  • Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug
  • Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0032] The preparation method of the soldering flux of the present invention is as follows: according to the above proportions, each component is added in sequence and stirred.

[0033] The flux of the present invention can be applied on the solder preform to help and promote the soldering of the solder preform, and / or reduce the void rate after the solder preform is soldered. In specific applications, the flux should be coated on the preform On the surface of the solder preform, the mass of the solder flux accounts for 1.0%-4.0% of the total mass of the solder preform.

Embodiment 1

[0036] A kind of soldering flux is provided in this embodiment, is prepared from the raw material of following weight:

[0037]

[0038]

[0039] The preparation method of the above-mentioned flux is as follows:

[0040] The flux of this embodiment was prepared by adding each component in sequence according to the above weight and stirring.

[0041] Void rate test:

[0042] Spray the flux of this example evenly on the solder preform to form a layer of uniform liquid film, and then use heating and baking equipment to quickly volatilize the organic solvent in the liquid flux at a temperature of 90°C. A layer of evenly distributed solid flux is left on the surface, wherein the mass percentage of the flux accounts for 2.5% of the total mass of the solder preform. Sandwich the sprayed solder preform between two copper plates, lay it flat, and pass it through an infrared reflow oven (model: Genesis608, Made in Suneast Co., Ltd.) together, and set the maximum reflow heating t...

Embodiment 2

[0044] A kind of soldering flux is provided in this embodiment, is prepared from the raw material of following weight:

[0045]

[0046]

[0047] The preparation method and void rate test of the flux in this embodiment are the same as those in Example 1, and the test results are shown in Table 1.

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PUM

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Abstract

The invention provides soldering flux. The preparation raw materials of the soldering flux comprises a heat conducting agent, and preferably further comprises modified rosin, an organic acidic active agent, a surface active agent, a resin film forming agent and organic solvent. The soldering flux is applied to the pre-formed soldering lug, and is good in coating performance, good in wettability and high in weldability. Besides, a little active material is left after welding, and an ultra-low voidage rate is kept after welding.

Description

technical field [0001] The invention relates to the field of soldering flux, in particular to a soldering flux for a preform soldering sheet with less voids after soldering. technical background [0002] In the existing SMT process, solder paste is usually used as the soldering material. Since the mass ratio of flux in solder paste is about 10%, but the volume ratio is about 50%, solder joints are particularly prone to voids. Solder preforms can well solve the problem of solder paste voids mentioned above. Solder preform is a precision-formed solder that can be made into different shapes, sizes and surface shapes as required. It is widely used in printed circuit board (PCB) assembly, connectors and terminal equipment, chip connection, power module substrates Attachment, filter connectors and electronic component assembly and other fields. [0003] A core purpose of soldering with solder preforms is to reduce voiding in solder joints. Usually, the mass of flux coated on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
CPCB23K35/3612B23K35/362
Inventor 唐欣吴晶李维俊刘竞刘芳曹建峰
Owner 深圳市唯特偶新材料股份有限公司
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