Device and method for manufacturing enhanced type welding columns

A preparation device and enhanced technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problem of lack of enhanced welding column technical capabilities, and achieve the effects of good consistency, easy device operation and less damage

Active Publication Date: 2017-05-10
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The country does not yet have the technical ability to prepare enhanced welding pillars, and can only independently prepare 90Pb10Sn conventional welding pillars

Method used

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  • Device and method for manufacturing enhanced type welding columns
  • Device and method for manufacturing enhanced type welding columns
  • Device and method for manufacturing enhanced type welding columns

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Experimental program
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Embodiment Construction

[0037] Below in conjunction with embodiment the present invention is described in further detail:

[0038] The present invention proposes an enhanced welding column preparation device, such as figure 1 As shown, it includes a welding wire supply mechanism 1 , a copper strip winding mechanism 2 , a copper strip dipping mechanism 3 and a welding wire leveling and cutting mechanism 4 .

[0039] Welding wire feeding mechanism 1 is used to deliver straight welding wire to copper tape winding mechanism 2, such as figure 2 As shown, it includes a welding wire conveying structure 11 and a first welding wire leveling structure 12. The welding wire conveying structure 11 includes a rotating screw and a bracket for fixing the rotating screw. The coiled welding wire is placed on the rotating screw to adjust the welding wire feeding mechanism 1. to the proper height, ensuring that the wire moves horizontally throughout the unit. The first welding wire leveling structure 12 includes mult...

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PUM

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Abstract

The invention provides a device and method for manufacturing enhanced type welding columns and belongs to the field of ceramic electron component packaging. The device comprises a welding wire supplying mechanism, a copper strip winding mechanism, a copper strip dip soldering mechanism and a welding wire cutting-off mechanism. Straight welding wires are supplied by the welding wire supplying mechanism, and copper strips with a certain thickness are wound on the welding wires by the copper strip winding mechanism, the whole outer surfaces of the welding wires are subjected to tin dipping through the copper strip dip soldering mechanism, and enhanced type welding wires are obtained; the enhanced type welding wires are conveyed to the welding wire cutting-off mechanism for leveling and cutting off, and a plurality of enhanced type welding columns are obtained. The gap that currently the enhanced type welding columns can not be independently manufactured in domestic is filled up, and the device and method are simple in operation and can ensure that the manufactured welding columns are good in surface state and end face smoothness.

Description

technical field [0001] The invention relates to a preparation device and a preparation method of enhanced welding pillars, which belong to the field of packaging of ceramic electronic components. Background technique [0002] With the rapid development of modern integrated circuit technology, the miniaturization, high speed and high reliability of integrated circuits require electronic components to be miniaturized and integrated, and at the same time, new packaging technologies are also emerging and developing. As a package form of ball grid array package, ceramic ball grid array package has the advantages of high interconnection density, strong air tightness, good moisture resistance and high reliability. Ceramic column grid array package is the development and improvement of ceramic ball grid array package. , Replacing the ball grid with the column grid greatly solves the thermal fatigue problem caused by the mismatch of the thermal expansion system between the alumina ce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/04B23K35/40H01L21/60
CPCB23K35/0205B23K35/402H01L24/74
Inventor 黄颖卓唐超林鹏荣练滨浩
Owner BEIJING MXTRONICS CORP
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