Method for manufacturing copper-plated aluminum nitride ceramic substrate

A technology of aluminum nitride ceramics and a manufacturing method, which is applied in the field of metallization of ceramic substrates, can solve the problems of high porosity, low peel strength, insufficient bonding force between copper foil and aluminum nitride ceramic substrates, etc., and achieve reduction of air porosity, Effect of improving peel strength, good affinity and cohesion

Inactive Publication Date: 2019-02-15
合肥市闵葵电力工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a method for manufacturing copper-clad aluminum nitride ceramic substrates to solve the problems of insufficient bonding force between existing copper foil and aluminum nitride ceramic substrates, high porosity, and low peel strength. Porosity between the two, improve the bonding force between the two, and enhance the strength of the copper-clad aluminum nitride ceramic substrate

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  • Method for manufacturing copper-plated aluminum nitride ceramic substrate

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Embodiment 1

[0043] The manufacturing method of the copper-clad aluminum nitride ceramic substrate of the present embodiment comprises the following steps:

[0044] (1) Preparation of pitting solution: The pitting solution is made by mixing sodium sulfate, sulfuric acid, slow-release agent and additives, wherein the slow-release agent is made of ethylene glycol, glycerin or a mixture of both, and the additives are oxalic acid, Either one of EDTA or both are mixed, the selected reagents are dissolved in deionized water in proportion, and stirred at 50°C, the stirring speed is 500rpm, and the pitting solution is obtained by filtering after stirring for 40min;

[0045] (2) Descaling treatment: immerse the aluminum nitride ceramic substrate in the degreasing solution, clean it with an ultrasonic cleaning process, remove the dirt on the surface of the aluminum nitride ceramic substrate, and rinse the surface with deionized water under the action of sodium sulfate;

[0046] (3) Degreasing treatm...

Embodiment 2

[0065] The manufacturing method of the copper-clad aluminum nitride ceramic substrate of the present embodiment comprises the following steps:

[0066] (1) Preparation of pitting solution: The pitting solution is made by mixing sodium sulfate, sulfuric acid, slow-release agent and additives, wherein the slow-release agent is made of ethylene glycol, glycerin or a mixture of both, and the additives are oxalic acid, Either one of EDTA or both are mixed, the selected reagent is dissolved in deionized water in proportion, and stirred at 50°C, the stirring speed is 600rpm, and the pitting solution is obtained by filtering after stirring for 60min;

[0067] (2) Descaling treatment: immerse the aluminum nitride ceramic substrate in the degreasing solution, clean it with an ultrasonic cleaning process, remove the dirt on the surface of the aluminum nitride ceramic substrate, and rinse the surface with deionized water under the action of sodium sulfate;

[0068] (3) Degreasing treatmen...

Embodiment 3

[0087] The manufacturing method of the copper-clad aluminum nitride ceramic substrate of the present embodiment comprises the following steps:

[0088] (1) Preparation of pitting solution: The pitting solution is made by mixing sodium sulfate, sulfuric acid, slow-release agent and additives, wherein the slow-release agent is made of ethylene glycol, glycerin or a mixture of both, and the additives are oxalic acid, Either one of EDTA or both are mixed, the selected reagents are dissolved in deionized water in proportion, and stirred at 50°C, the stirring speed is 550rpm, and the pitting solution is obtained by filtering after stirring for 50min;

[0089] (2) Descaling treatment: immerse the aluminum nitride ceramic substrate in the degreasing solution, clean it with an ultrasonic cleaning process, remove the dirt on the surface of the aluminum nitride ceramic substrate, and rinse the surface with deionized water under the action of sodium sulfate;

[0090] (3) Degreasing treatm...

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Abstract

The invention relates to a method for manufacturing a copper-plated aluminum nitride ceramic substrate. The method comprises the following steps: (1) preparing a pitting solution; (2) carrying out descaling treatment; (3) carrying out degreasing treatment; (4) carrying out pitting treatment on the surface of an aluminum nitride ceramic substrate, namely soaking the aluminum nitride ceramic substrate into the pitting solution, and treating with an ultrasonic process; (5) carrying out activation treatment, namely coating the surface of the aluminum nitride ceramic substrate with an activator, wherein the activator is prepared from copper sulfate, sodium persulfate, boric acid and potassium citrate through mixing; (6) carrying out thermal treatment; (7) carrying out nickel plating; (8) carrying out vacuum welding expansion. By adopting the method, the problems that a conventional copper foil is insufficient in binding force with an aluminum nitride ceramic substrate, high in porosity, lowin peeling strength, and the like, can be solved, by reducing the porosity of the copper foil and the aluminum nitride ceramic substrate, the binding force of the two components can be increased, andthe strength of the copper-plated aluminum nitride ceramic substrate can be improved.

Description

technical field [0001] The invention relates to the technical field of ceramic substrate metallization, in particular to a method for manufacturing a copper-clad aluminum nitride ceramic substrate. Background technique [0002] With the development of a new generation of information technology, accompanied by the improvement of integration and the reduction of volume, the power consumption per unit heat dissipation area increases, so heat dissipation has become a key issue in module manufacturing, and copper-clad aluminum nitride ceramics In addition to the high electrical conductivity of copper foil, the substrate also has the high thermal conductivity of aluminum nitride ceramics, which can meet the above heat dissipation requirements. [0003] Specifically, the copper-clad aluminum nitride ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of the aluminum nitride ceramic substrate at high temperature. The produced u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88C04B37/02
CPCC04B41/88C04B37/026C04B41/515
Inventor 何飞
Owner 合肥市闵葵电力工程有限公司
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