Flip device packaging method and structure

A device packaging and flip-chip technology, which is applied in the field of flip-chip device packaging methods and structures, can solve problems such as voids, reduce void rates, and improve operating efficiency
CN110660891AInactive Publication Date: 2020-01-07宁波安芯美半导体有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
宁波安芯美半导体有限公司
Publication Date
2020-01-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a flip device packaging method, and the method at least comprises the steps: enabling a substrate to be placed at a preset position, wherein the substrate is provided with at least one hole which is through from the top to the bottom; placing a flip chip on the substrate, wherein the solder balls on the flip chip are correspondingly connected with the bonding pads on the substrate; welding the bonding pads on the substrate and the solder balls of the flip chip, and carrying out cooling treatment; and injecting filling materials into the holes. Besides, the invention alsoprovides a flip device packaging structure, and by applying the embodiment of the invention, the problem that holes of different degrees are generated due to the influence of the flowing speed and the like when filling materials are injected around the chip in the prior art is solved.
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Description

technical field

[0001] The invention relates to the technical field of flip-chip packaging, in particular to a flip-chip device packaging method and structure. Background technique

[0002] LED front-mount chip is the earliest chip structure, and it is also a chip structure commonly used in low-power chips. In this structure, the electrodes are on the top, and the materials from top to bottom are: P-GaN, light emitting layer, N-GaN, substrate. Therefore, the structure of the flip chip is just the opposite of that of the front chip, so it is called a flip chip. Flip-chip packaging also includes flip-chip ICs. Flip-chip is to deposit tin-lead balls on the I / O pad, and then flip the chip to heat and use molten tin-lead balls to combine with ceramic substrates. This technology replaces conventional wire bonding and has gradually become The mainstream of packaging in the future is currently mainly used in high-frequency CPUs, GPUs (Graphic Processor Units) and Chipsets and othe...

Claims

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