Flip device packaging method and structure

A device packaging and flip-chip technology, which is applied in the field of flip-chip device packaging methods and structures, can solve problems such as voids, reduce void rates, and improve operating efficiency

Inactive Publication Date: 2020-01-07
宁波安芯美半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a flip-chip device packaging method and structure, which aims to solve the problem of injecting filling materials around the chip in the prior art, which will produce different degrees of damage due to the influence of flow speed and the like. empty question

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  • Flip device packaging method and structure
  • Flip device packaging method and structure
  • Flip device packaging method and structure

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Embodiment Construction

[0033] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0034] see Figure 1 to Figure 4 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the concept of the substrate of the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be...

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Abstract

The invention provides a flip device packaging method, and the method at least comprises the steps: enabling a substrate to be placed at a preset position, wherein the substrate is provided with at least one hole which is through from the top to the bottom; placing a flip chip on the substrate, wherein the solder balls on the flip chip are correspondingly connected with the bonding pads on the substrate; welding the bonding pads on the substrate and the solder balls of the flip chip, and carrying out cooling treatment; and injecting filling materials into the holes. Besides, the invention alsoprovides a flip device packaging structure, and by applying the embodiment of the invention, the problem that holes of different degrees are generated due to the influence of the flowing speed and the like when filling materials are injected around the chip in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of flip-chip packaging, in particular to a flip-chip device packaging method and structure. Background technique [0002] LED front-mount chip is the earliest chip structure, and it is also a chip structure commonly used in low-power chips. In this structure, the electrodes are on the top, and the materials from top to bottom are: P-GaN, light emitting layer, N-GaN, substrate. Therefore, the structure of the flip chip is just the opposite of that of the front chip, so it is called a flip chip. Flip-chip packaging also includes flip-chip ICs. Flip-chip is to deposit tin-lead balls on the I / O pad, and then flip the chip to heat and use molten tin-lead balls to combine with ceramic substrates. This technology replaces conventional wire bonding and has gradually become The mainstream of packaging in the future is currently mainly used in high-frequency CPUs, GPUs (Graphic Processor Units) and Chipsets and othe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/48H01L33/52H01L2933/0033H01L2933/005
Inventor 关承浩李华楠陈亮
Owner 宁波安芯美半导体有限公司
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