High-temperature lead-free halogen-free solder paste and preparation method thereof

A lead-free halogen-free solder paste, high temperature technology, applied in the field of high-temperature lead-free halogen-free solder paste and its preparation, achieves the effects of strong oxidation resistance, meeting environmental protection requirements and good wettability

Inactive Publication Date: 2012-06-27
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, with the advancement of electronic solder technology and the requirements of environmental protection, solder with high lead content will be replaced by lead-free solder. Halogen solder paste can fill the technical gap

Method used

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  • High-temperature lead-free halogen-free solder paste and preparation method thereof
  • High-temperature lead-free halogen-free solder paste and preparation method thereof
  • High-temperature lead-free halogen-free solder paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] In the reactor, add 25 grams of high softening point rosin resin, 24 grams of polymerized rosin, 19 grams of diethylene glycol monocapryl ether, 15 grams of triethyl carbitol ether, 3 grams of succinic acid, 2.5 grams of dipropionic acid, 1 gram of triethanolamine, 4 grams of ethylimidazole were mixed and stirred evenly, heated until completely dissolved to prepare a mixed solution, and when the mixed solution was cooled to 80°C, 1.5 grams of polyethylene glycol type nonionic surfactant and 5 grams of stearin were added Acid amide, then fully stir evenly, and then continue to cool to room temperature to become a paste. After standing for 12 hours or refrigerated for 12 hours, the paste completely recovers thixotropy to prepare solder paste. Take 20 grams of solder paste and 80 grams of Sn89.5Sb10Ni0.5 in a mixing barrel and stir evenly to obtain high-temperature lead-free Halogen-free solder paste. Then pack it into cans or syringes according to the requirements of the...

Embodiment 2

[0047] In the reactor, add 28 grams of high softening point rosin resin, 24 grams of polymerized rosin, 19 grams of diethylene glycol monocaprylyl ether, 15 grams of triethyl carbitol ether, 3 grams of succinic acid, 2 grams of dipropionic acid, 1 gram of triethanolamine, 4 grams of phenylacryltriazole were mixed and stirred evenly, and heated until completely dissolved to prepare a mixed solution. When the mixed solution was cooled to 80° C., 1 gram of polyethylene glycol type nonionic surfactant, 2 grams of Stearic acid amide and 3 grams of modified hydrogenated castor oil are fully stirred evenly again, then continue to cool to room temperature and become paste. After standing for 12 hours or refrigerated for 12 hours, the paste completely recovers thixotropy to prepare solder paste. Take 15 grams of solder paste and 85 grams of Sn89.5Sb10Ni0.5 in a mixing barrel and stir evenly to obtain high-temperature lead-free Halogen-free solder paste. Then pack it into cans or syrin...

Embodiment 3

[0049]In the reaction kettle, add 20 grams of high softening point rosin resin, 10 grams of polymerized rosin, 19 grams of hydrogenated abietyl alcohol, 19 grams of diethylene glycol monooctyl ether, 15 grams of hexanediol, 3 grams of succinic acid, and 2.5 grams of dipropionic acid , 2.5 grams of itaconic acid, 1 gram of triethanolamine, and 5 grams of ethyl imidazole were mixed and stirred evenly, and heated until completely dissolved to prepare a mixed solution. When the mixed solution was cooled to 80 ° C, 0.5 gram of polyethylene glycol-type non-ionic surface was added Active agent and 5 grams of stearic acid amide are fully stirred again, then continue to cool to room temperature and become paste. After standing for 12 hours or refrigerated for 12 hours, the paste will completely recover the thixotropy to prepare soldering paste. Take 9 grams of soldering paste and 91 grams of Sn89.4Sb10Ni0.5Ge0.1 in the mixing barrel and stir evenly to obtain high temperature Lead-free ...

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Abstract

The invention provides a high-temperature lead-free halogen-free solder paste and a preparation method thereof. The high-temperature lead-free halogen-free solder paste is prepared from the components in percentage by weight: 80-91 percent of solder powder and 20-90 percent of flux paste, wherein the solder powder is tin-nickel-antimony or tin-nickel-antimony alloy powder. The high-temperature lead-free halogen-free solder paste has the beneficial effects that 1, the solder paste provided by the invention does not contain lead and is environmentally friendly, and the solder paste replaces a high-lead solder paste to be used for packaging semiconductor devices, particularly power devices and LED (Light Emitting Diode) in high temperature operation, packaging high-density integrated circuits and welding circuit boards needing secondary backflow; 2, the solder paste provided by the invention has stable chemical property and strong antioxidant capacity and is easily stored; 3, after the high-temperature lead-free halogen-free solder paste provided by the invention is adopted for welding, no solder ball exists, residues are less, the welding position is transparent, the surface impedance is high, and the safety performance of a product working in a high temperature and humid environment is effectively increased; the wetting property of gold-plated, silver-plated and nickel-plated devices is good, and the welding strength is large; 4, a precision device adopts the high-temperature lead-free halogen-free solder paste provided by the invention, a needle tube glue-dispensing process has uniform and smooth flow, and the void content after welding is lower than 8%.

Description

technical field [0001] The invention relates to a high-temperature lead-free and halogen-free solder paste and a preparation method thereof, in particular to a high-temperature lead-free and halogen-free solder paste with environmental protection, stable chemical properties, strong oxidation resistance and easy storage and a preparation method thereof. Background technique [0002] At present, semiconductor devices working at high temperature, especially power devices and LED packages, high-density integrated circuit packages, and the assembly of some precision integrated circuits, require the second or even third reflow soldering process, which uses high lead content (Pb Solder paste with a content greater than 85%) for soldering. However, the harm of lead and its compounds to the human body and the pollution to the environment have been paid more and more attention by human beings, and the EU ROHS also has a clear deadline for the exemption of some devices such as high-tem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 钱雪行资春芳
Owner 深圳市晨日科技股份有限公司
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