The invention discloses a parallel
loop heat pipe heat dissipation device used for heat dissipation of a
server chip, which comprises a cooling box, N evaporators, N-1 three-way structure, N-section gas lines, N-section
liquid line sand N-1
evaporation lines; N evaporators pass through the
evaporation pipeline, a
liquid line and a gas line are connecte in parallel to that cooling box; At that sametime, the first gas line extend into the cooling box, A loop of coil is formed inside that cooling box, A coil extends out of the cooling box and communicates with the
liquid line of the first section, the N
evaporator extends into the interior of the
server and contact N chips and fixed with the N chips; The heat generated in the working process on the
chip evaporates the liquid in the
evaporator into gas, which is sent to the cooling box by the
evaporation pipeline and the
gas pipeline, and the
cooling fluid in the cooling box is heat exchanged with the
cooling fluid in the cooling box andcondensed into liquid, thereby realizing the
chip heat dissipation, N >= 1. The invention simplifies the heat dissipation structure, improves the heat dissipation efficiency, and reduces the
energy consumption cost and the potential safety
hazard.