The invention discloses a parallel 
loop heat pipe heat dissipation device used for heat dissipation of a 
server chip, which comprises a cooling box, N evaporators, N-1 three-way structure, N-section gas lines, N-section 
liquid line sand N-1 
evaporation lines; N evaporators pass through the 
evaporation pipeline, a 
liquid line and a gas line are connecte in parallel to that cooling box; At that sametime, the first gas line extend into the cooling box, A loop of coil is formed inside that cooling box, A coil extends out of the cooling box and communicates with the 
liquid line of the first section, the N 
evaporator extends into the interior of the 
server and contact N chips and fixed with the N chips; The heat generated in the working process on the 
chip evaporates the liquid in the 
evaporator into gas, which is sent to the cooling box by the 
evaporation pipeline and the 
gas pipeline, and the 
cooling fluid in the cooling box is heat exchanged with the 
cooling fluid in the cooling box andcondensed into liquid, thereby realizing the 
chip heat dissipation, N >= 1. The invention simplifies the heat dissipation structure, improves the heat dissipation efficiency, and reduces the 
energy consumption cost and the potential safety 
hazard.