Manufacturing method of metal-ceramic composite substrate and composite substrate manufactured by manufacturing method

A technology of ceramic composite and manufacturing method, applied in the field of ceramic metallization, can solve the problems of affecting conductivity and thermal shock resistance, high content of silver in brazing material, decrease in conductivity, etc. The effect of high rate and strong thermal shock resistance

Inactive Publication Date: 2017-01-11
ZHEJIANG TC CERAMIC ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The manufacturing method of the metal-ceramic composite substrate in the prior art uses a layer of brazing material composed of copper, silver and active metal, and the titanium nitride layer formed with aluminum nitride ceramics is relatively thick, which affects the electrical conductivity and thermal shock resistance; Titanium is distributed throughout the braze layer, reducing electrical conductivity; high silver content in the braze is costly

Method used

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  • Manufacturing method of metal-ceramic composite substrate and composite substrate manufactured by manufacturing method
  • Manufacturing method of metal-ceramic composite substrate and composite substrate manufactured by manufacturing method
  • Manufacturing method of metal-ceramic composite substrate and composite substrate manufactured by manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] See figure 1 , Coating the first copper paste with a viscosity of 100 mPa·s on the surface of the ceramic substrate 110 and drying at 90° C. for 15 minutes to obtain the first brazing material layer 120.

[0043] See figure 2 Coating the second copper paste with a viscosity of 100 mPa·s on the surface of the first brazing material layer 120 away from the ceramic substrate 110 and drying at 110° C. for 5 minutes to obtain the second brazing material layer 130.

[0044] See image 3 , The copper foil is soaked in a sodium hydroxide solution with a content of 5wt% at 60°C for 10 minutes, and washed twice with distilled water; then at room temperature, soaked with a sulfuric acid solution with a content of 10wt% for 2 minutes, using distilled water Wash twice. The processed copper foil is placed on the surface of the second brazing material layer 130 away from the first brazing material layer 120 to form a copper layer 140.

[0045] See Figure 4 , The metal-ceramic composite su...

Embodiment 2

[0048] The first copper paste with a viscosity of 300 mPa·s was coated on the surface of the ceramic substrate 110 and dried at 110° C. for 10 minutes to obtain the first brazing material layer 120.

[0049] A second copper paste with a viscosity of 50 mPa·s was applied to the surface of the first brazing material layer 120 away from the ceramic substrate 110 and dried at 90° C. for 15 minutes to obtain the second brazing material layer 130.

[0050] Soak the copper strip in a sodium hydroxide solution with a content of 5wt% at 60℃ for 5 minutes and wash it twice with distilled water; then at room temperature, soak it with a sulfuric acid solution with a content of 10wt% for 1 minute and wash it with distilled water twice. The processed copper tape is placed on the surface of the second brazing material layer 130 away from the first brazing material layer 120 to form a copper layer 140.

[0051] The metal-ceramic composite substrate precursor is placed at a temperature of 400°C for ...

Embodiment 3

[0053] The first copper paste with a viscosity of 150 mPa·s was coated on the surface of the ceramic substrate 110 and dried at 100° C. for 11 minutes to obtain the first brazing material layer 120.

[0054] A second copper paste with a viscosity of 80 mPa·s was applied to the surface of the first brazing material layer 120 far away from the ceramic substrate 110 and dried at 100° C. for 12 minutes to obtain the second brazing material layer 130.

[0055] The copper foil is soaked in a sodium hydroxide solution with a content of 5wt% at 60℃ for 10 minutes and washed twice with distilled water; then at room temperature, it is soaked with a sulfuric acid solution with a content of 10wt% for 2 minutes and washed with distilled water twice. The processed copper foil is placed on the surface of the second brazing material layer 130 away from the first brazing material layer 120 to form a copper layer 140.

[0056] Put the metal-ceramic composite substrate precursor under the condition of...

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Abstract

The invention discloses a manufacturing method of a metal-ceramic composite substrate and a composite substrate manufactured by the manufacturing method, and belongs to the technical field of ceramic metallization. The manufacturing method comprises the following steps: forming a first brazing filler metal layer on the surface of a ceramic substrate, wherein the first brazing filler metal layer is a copper and active metal brazing filler metal layer; forming a second brazing filler metal layer on the surface of the first brazing filler metal layer, wherein the second brazing filler metal layer is a copper and silver brazing filler metal layer; forming a copper layer on the surface of the second brazing filler metal layer in order to form a metal-ceramic composite substrate precursor; and sintering the metal-ceramic composite substrate precursor in vacuum. In the manufacturing method, an active metal of the first brazing filler metal layer reacts with ceramic during vacuum sintering, so that high bonding force and high thermal shock resistance are achieved. Copper and silver of the second brazing filler metal layer undergo a eutectic reaction with a copper foil, so that the copper and the silver are combined tightly with the copper foil, and the metal-ceramic composite substrate has higher resistance to high voltages and heavy current at the same time.

Description

Technical field [0001] The present invention relates to the technical field of ceramic metallization, in particular, to a method for manufacturing a metal-ceramic composite substrate and a composite substrate manufactured therefrom. Background technique [0002] Because the surface structure of ceramic materials is different from that of metal materials, welding often cannot wet the ceramic surface, nor can it act on it to form a firm bond. Therefore, the sealing of ceramic and metal is a special process, that is, metallization. Method: first firmly adhere a layer of metal film on the ceramic surface to realize the welding of ceramic and metal. [0003] The manufacturing method of the prior art metal-ceramic composite substrate uses a layer of brazing material composed of copper, silver and active metal, and the titanium nitride layer formed with aluminum nitride ceramic is thick, which affects the conductivity and thermal shock resistance; Titanium is distributed in the entire br...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4821H01L23/49866
Inventor 钱建波孙林袁超于岩王顾峰聂朝轩王太保黄世东胡士刚
Owner ZHEJIANG TC CERAMIC ELECTRONICS
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