White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof

A technology of composite ceramics and LED chips, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem that LED power density is difficult to increase, and achieve the effect of simple packaging structure, good toughness, and simplified packaging structure

Inactive Publication Date: 2012-09-19
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of alumina is not high, only about 24.7W / mK, and it is still difficult to increase the power density of LEDs packaged on alumina ceramic materials

Method used

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  • White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof
  • White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Example 1 Weighing an appropriate amount of AlCl 3 ·6H 2 O, add an appropriate amount of deionized water, stir and dissolve into a solution, add 1:5 ammonia water at an appropriate temperature of 60 oC, and coprecipitate to form Al(OH) 3 , Filtration and drying can be prepared to obtain alumina powder. Thereafter, press Al 2 o 3 / SiC is a ratio of 4:1. Add nano-silicon carbide powder (silicon carbide can be purchased from the Beijing Institute of Chemical Metallurgy, Chinese Academy of Sciences, with an average diameter of 30nm) to the alumina powder, mix evenly, and make a green body by ball milling and isostatic pressing. , Sintered at 1600-1750 oC in a nitrogen atmospheric pressure furnace. Among them, the isostatic pressure is 80Mpa, and the high-temperature sintering at atmospheric pressure is held for 10 hours. After the temperature drops below 300 oC, the ceramic substrate with a diameter of 3 cm and a thickness of 1.2 mm with 3 ear holes is obtained. The LE...

Embodiment 2

[0053] Example 2 Weigh an appropriate amount of alumina powder and silver oxide powder, according to Al 2 o 3 / AgO at a ratio of 10:1 and mixed evenly, after ball milling, isostatic pressing, making green body, and sintering at 1600-1750 oC in a normal pressure atmosphere furnace. Among them, the isostatic pressure is 100Mpa, and the high-temperature sintering at atmospheric pressure is held for 10 hours. After the temperature drops below 300 oC, the ceramic substrate with a diameter of 3 cm and a thickness of 1.2 mm is obtained with 3 ear holes. The LED was prepared through the same process as in Example 1.

Embodiment 3

[0054] Example 3 Weigh an appropriate amount of alumina powder and aluminum nitride powder, according to Al 2 o 3 / AlN at a ratio of 4:1 and mixed evenly, after ball milling, isostatic pressing, making green body, and sintering at 1600-1750 oC in a normal pressure atmosphere furnace. Among them, the isostatic pressure is 100Mpa, and the high-temperature sintering at atmospheric pressure is held for 10 hours. After the temperature drops below 300 oC, the ceramic substrate with a diameter of 3 cm and a thickness of 1.2 mm is obtained with 3 ear holes. The LED was prepared through the same process as in Example 1.

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Abstract

The invention belongs to the technical field of an LED (Light Emitting Diode) light source and specifically relates to a white light LED (Light Emitting Diode) packaged on a composite ceramic substrate. The white light LED provided by the invention comprises a radiating substrate, an LED chip, a gold wire cord, fluorescent powder and silica gel, wherein the composite ceramic substrate is served as the radiating substrate. The composite ceramic substrate is prepared by sintering nanocrystalline high-heat-conduction ceramic material added into nanometer substrate ceramics, namely, is composed of 60-95% of molar nanometer substrate ceramics and 5-40% of molar nanometer added ceramics, and the ceramic metallization is performed on the surface. According to the invention, a nanocrystalline network is formed by adding the nanocrystalline high-heat-conduction ceramic material into the ceramic substrate material, so that a heat-conduction path of a high-heat-conduction network is realized and the heat resistance of the white light LED packaged on the ceramic material is reduced. The white light LED provided by the invention has the advantages of simple packaged structure, small heat resistance, high efficiency, excellent light attenuation resisting capacity, low cost and suitability for the manufacturing of the low-cost, high-efficiency and high-power white light LED.

Description

technical field [0001] The invention belongs to the technical field of LED light sources, and in particular relates to a white light emitting diode (LED) and a preparation method thereof, more specifically, to a white light LED packaged on a composite ceramic substrate and a preparation method thereof. Background technique [0002] Since the Japanese scientist Nakamura Shuji invented the commercial nitride blue light-emitting diode (LED) in 1993, the research and application of nitride LEDs have expanded explosively. Among them, semiconductor solid-state lighting based on high-power white LED technology has high electro-optical conversion efficiency, long life, safety, and environmental protection, and is favored by governments all over the world. Internationally, the United States Department of Energy has formulated a solid-state lighting plan; Japan formulated the "21st Century Lighting Plan" in 1998; the European Union formulated the "Rainbow Project" in 2000, etc., activ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L25/13H01L33/00
CPCH01L2224/49107H01L2224/45144H01L2224/48091H01L2224/73265
Inventor 崔旭高黄高山梅永丰
Owner FUDAN UNIV
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