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346 results about "Infrared focal plane array" patented technology

Wafer-level vacuum encapsulated infrared focal plane array (IRFPA) device and method for producing same

The invention discloses a wafer-level vacuum encapsulated infrared focal plane array (IRFPA) device and a method for producing the same, wherein a double-wafer bonding mode is adopted to produce an infrared detector and realize the wafer-level encapsulation, a complementary metal-oxide-semiconductor integrated chip (CMOSIC) and a micro-electromechanical systems (MEMS) device are separately produced, so the integration of the CMOSIC is realized, the production flexibility of the MEMS infrared detector device is also increased, and the wafer-level encapsulation can be realized at the same time. The invention has the advantages that: a reflector for a complementary metal-oxide-semiconductor integrated chip (CMOS) reading circuit and a resonance absorption structure is produced on a wafer, the other wafer is utilized to produce the MEMS structural part of the IRFPA and is simultaneously used for producing the infrared window of the IRFPA, the resonance absorption structure is utilized to provide the infrared absorption efficiency of the infrared IRFPA device, the wafer-level encapsulation of the IRFPA device is also realized at the same time, so the size and the production cost of the IRFPA device are benefited to be reduced.
Owner:中科芯未来微电子科技成都有限公司

Rapidly converged scene-based non-uniformity correction method

InactiveCN102538973APrevent erroneous updatesBug update avoidanceRadiation pyrometryPhase correlationSteep descent
The invention discloses a rapidly converged scene-based non-uniformity correction method, wherein the aim of non-uniformity correction is achieved by minimizing interframe registration error of two adjacent images. The method mainly comprises the following steps of: initializing gain and offset correction parameters and acquiring an uncorrected original image; acquiring a new uncorrected original image, and carrying out non-uniformity correction on the new uncorrected original image and the previous uncorrected original image by utilizing the current non-uniformity correction parameters; obtaining relative displacement, scene correlation coefficient and interframe registration error of two corrected images by utilizing an original point masking phase correlation method; and updating correction parameters along the negative gradient direction by adopting a steepest descent method. The method disclosed by the invention has the advantages of high correction accuracy, fast convergence speed, no ghost effect and low calculated amount and storage content and is especially applicable to being integrated into an infrared focal plane imaging system, and the effect of improving imaging quality, environmental suitability and time stability of an infrared focal plane array is achieved.
Owner:NANJING UNIV OF SCI & TECH

TEC(thermoelectric cooler)-free uncooled infrared focal plane array reading circuit

The invention discloses a TEC(thermoelectric cooler)-free uncooled infrared focal plane array reading circuit, and relates to the technical field of uncooled infrared focal plane array. A reading circuit comprises a bias generation circuit, a column-level analog front-end circuit, and a row-level circuit; the row-level circuit comprises a row-level mirror image pixel, is controlled by a row selection switch,and can output a third bias voltage; the bias generation circuit is connected with the row-level circuit, the input end of the bias generation circuit is connected with the output end of the row-level circuit; a first bias voltage and a second bias voltage are generated and outputtedbased onan inputted constant voltage and a third bias voltage; the column-level analog front-end circuitcomprises a blind pixel; the column-level analog front-end circuit is electrically connected with the bias generation circuit, the input end of the column-level analog front-end circuit is connected with the output end of the bias generation circuit to obtain two currents, and the difference between the two currents generated is amplified in a transimpedance mode and outputted as a voltage. By adopting the technical scheme of theTEC(thermoelectric cooler)-free uncooled infrared focal plane array reading circuit, the circuit has a stable output point unaffected by the substrate temperature andthe self-heating effect, and the stability of the circuit is improved.
Owner:北京安酷智芯科技有限公司

Foundation cloud measuring method combining infrared and lasers

A foundation cloud measuring method combining infrared and lasers comprises the following steps that (1) atmosphere downward infrared radiation data are obtained through an uncooled infrared focal planar array sensor, zenith backward extinction coefficient profile data are obtained through a laser sensor, and the obtaining time of the atmosphere downward infrared radiation data is synchronous with the obtaining time of the zenith backward extinction coefficient profile data; (2) water vapor and aerosol radiation under cloud are estimated by combining the data, clear sky threshold values calculated through a radiation transmission pattern are used for conducting initial cloud detection, it is assumed that the cloud is a black body, and the cloud base height is obtained through inversion; (3) sequence analysis is conducted on infrared radiation images with high time resolution, the clear sky threshold values are combined to conduct further cloud detection, and the cloud cover is calculated; (4) proportionality coefficients between the cloud base height obtained through the infrared radiation inversion and the cloud base height obtained through laser measurement are fitted; (5) the cloud base height of a whole view field is corrected, and the typical cloud base heights of every ten minutes are obtained through calculation.
Owner:PLA UNIV OF SCI & TECH

Full waveband infrared focal plane array based on MEMS technology

The invention disclose design of a full waveband infrared focal plane array based on the MEMS technology and a manufacturing method thereof and particularly relates to the full waveband infrared focal plane array capable of realizing visible light reading from a substrate side. The full waveband infrared focal plane array comprises a transparent substrate comprising a micro cantilever pixel array and a supporting micro cantilever pixel array, a micro cantilever pixel comprises an infrared sensitive face and a micro cantilever supporting leg, and the infrared sensitive face comprises a main structure layer, an infrared absorption structure layer and an optical reflector face. When infrared light is irradiated to the focal plane array, absorbed energy is converted by the infrared absorption structure arranged on the infrared sensitive face into heat energy to make the micro cantilever pixel generate deflection, and an optical detection system reads deformation quantity and distribution of the micro cantilever pixel array through the transparent substrate. The full waveband infrared focal plane array can carry out full waveband infrared detection and imaging through employing the meta-material structure arranged on the infrared sensitive face, under the non-refrigeration work environment, the simple polyimide sacrificial layer technology can be utilized for manufacturing.
Owner:PEKING UNIV

Infrared focal plane array detector simulation device and method

The invention discloses an infrared focal plane array detector simulation device and an infrared focal plane array detector simulation method. The device comprises a communication interface unit, a control unit, a storage, a driving signal input and detection unit, a direct digital frequency synthesis unit and a detector driving circuit interface, wherein the driving signal input and detection unit acquires driving signals from a detector driving circuit through the detector driving circuit interface; the control unit judges whether the signals meet the requirement of an infrared focal plane array detector; when the driving signals are absolutely right, the control unit reads infrared scene information in the storage or infrared scene information output through the communication interface, and outputs the infrared scene information to the direct digital frequency synthesis unit; and the infrared scene information is synthesized into analog signals according to a rule of detector response signals and then is output. The infrared focal plane array detector simulation device can replace an actual infrared focal plane array detector in the early stage of debugging an infrared imaging system, and can detect the driving signals of the driving circuit and feed information back; and the development schedule is accelerated and the development cost is reduced.
Owner:NANJING UNIV OF SCI & TECH

No-shutter uncooled infrared imaging system and nonuniformity correction method

The invention provides a no-shutter uncooled infrared imaging system and a nonuniformity correction method. The system comprises an optical lens, an infrared detector, a field-programmable gate array, an analog-digital converter, a storage device and an image encoder. The optical lens collects optical signals of a target; the infrared detector converts the optical signals into analog voltage signals which are then converted by the analog-digital converter into digital signals which are output to the field-programmable gate array; the analog-digital converter carries out sampling on the analog signals output by the infrared detector and then transmits the signals to the field-programmable gate array; and the field-programmable gate array processes the digital signals and outputs the processed signals. The method is characterized by, to begin with, collecting response values of the system for the same uniform target background; calculating substrate temperature of an infrared focal plane array; then, calculating background value under the current state according to the background values and the substrate temperature; and finally, carrying out nonuniformity correction by utilizing one-point correction. The method has the advantages of easy realization and high precision and can be widely applied to the current uncooled infrared imaging system.
Owner:BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH

Packaging technology and packaging device of non-refrigerated infrared focal plane array device

InactiveCN101893483AMake up temperatureCompensation functionRadiation pyrometryDecorative surface effectsDiamond-like carbonVacuum chamber
The invention discloses a packaging device of a non-refrigerated infrared focal plane array device and is characterized by comprising a body and a cover which are matched to work and are packaged into a whole by heating and tightly compression in a vacuum chamber, wherein (1) the body comprises a first substrate, the surface of the substrate is provided with a heavily doped region with P and N properties, the middle of the substrate is provided with a strip-shaped metal border, the upper part inside the strip-shaped metal border region is provided with a reading circuit region, a focal plane array region is arranged on the lower part, the area of the heavily doped region is larger than that of the focal plane array region which is provided with M*N units, a plurality of pressure welding discs are arranged between the strip-shaped metal pattern and the substrate edge, and a plurality of reference resistances are arranged in the focal plane array region; and (2) the cover comprises a second substrate, two sides of the second substrate are provided with diamond-like carbon films, any side of the second substrate is provided with a cover metal border corresponding to the strip-shaped metal border in the body, and a metal solder is arranged on the cover metal border.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

An uncooled infrared focal plane array detector

The invention relates to a non-refrigeration infrared focal plane array seeker. The structure is characterized in that one end part of a bridge leg is connected with a bridge surface, and the other end part of the bridge leg is connected to a base through an anchor post; the base is a read-out integrated circuit substrate, and the surface of the base is provided with a reflection film layer; the bridge surface is hanged deadly above the reflection film layer, and forms a vacuum clearance layer with the base; the bridge leg is arranged at two sides corresponding to the bridge surface, and the respective lower surface of the bridge leg and the bridge surface are distributed on the same plane; the bridge surface is sequentially provided with a support layer, an absorption layer, an insulation layer, a heat sensitive layer and a protection layer from bottom to up; the bridge leg is sequentially provided with a heat resistance layer, an electric conduction layer and a passivation layer from bottom to up; and the anchor post consists of a metal tungsten post and an oxide silicon post, and is sequentially provided with metal tungsten and silicon oxide materials from the inside to outside. The anchor post provided by the invention is a novel anchor post, compared with the traditional anchor post formed by the traditional filling technology, the area occupied by the anchor post is shortened, and the technology difficulty is reduced.
Owner:WUHAN GUIDE INFRARED CO LTD

High-precision infrared thermal-imaging temperature measurement method and high-precision infrared thermal-imaging temperature measurement system

The invention relates to a high-precision infrared thermal-imaging temperature measurement method and a high-precision infrared thermal-imaging temperature measurement system. The method includes: acquiring a gray image of a detected area by an infrared focal plane array and an optical mechanism; acquiring a temperature of a reference object and a gray value of a reference object gray image area in the gray image; acquiring a gray value of a to-be-measured object gray image area in the gray image to acquire a first temperature of a to-be-measured object; subtracting the gray value of the to-be-measured object from the gray value of the reference object to obtain a gray difference, and obtaining a temperature difference according to the gray difference and the change relationship between the first temperature and the image gray value; obtaining the temperature of the to-be-measured object by the temperature of the reference object and the temperature difference. The high-precision infrared thermal-imaging temperature measurement method and the high-precision infrared thermal-imaging temperature measurement system achieve high-precision infrared thermal-imaging temperature measurement based on the detector operating temperature and a relative measurement method, thereby being high in temperature measurement precision, small in temperature measurement precision fluctuation and high in stability.
Owner:SUN CREATIVE ZHEJIANG TECH CO LTD

Integrated structure and manufacturing method of an infrared focal plane array detector

The invention discloses an infrared focal plane array seeker integrated structure and a manufacturing method, belonging to the field of semiconductor manufacturing. The structure comprises a first silicon wafer and a second silicon wafer; a second surface of the first silicon wafer is provided with an infrared sensitive element array and a bonding pad; a first surface is provided with a pluralityof first electric contact elements; the first silicon wafer is provided with a plurality of first silicon through hole micro interconnections and a plurality of second silicon through hole micro interconnections; the infrared sensitive element array is correspondingly and electrically connected with the first electric contact element through the first silicon through hole micro interconnections; the bonding pad is correspondingly and electrically connected with the first electric contact element through the second silicon through hole micro interconnections; the first surface of the second silicon wafer is provided a signal processing circuit of the infrared sensitive element and a plurality of second electric contact elements which are electrically connected with the signal processing circuit; and the first electric contact element and the second electric contact element are respectively and correspondingly connected. According to the invention, the thermal disturbance is reduced, and the stability and reliability of a non-refrigeration infrared focal plane array seeker are improved.
Owner:PEKING UNIV
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