80results about How to "Reduce thermal interference" patented technology

In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

To provide an image display apparatus that is allowed to incorporate a panel module with excellent mechanical strength even if a screen is upsized and the apparatus is slimmed down. Strengthening units are mounted along a horizontal direction on canopies provided on an upper portion and a lower portion of a panel module constituting a display unit of a large-size, thin image display apparatus. Also, supporting members are mounted on the upper and lower strengthening units in such a manner that the supporting members bridge between the upper and lower strengthening units, so that a stand, or a chain or a string to be used when hanging the image display apparatus is mountable to the supporting members. This prevents direct application of external force to the panel module.

The electric rotating machine is provided with an intermediate plate having a power circuit connection portion that is connected with an outgoing lead drawn out from a power circuit unit and an armature winding connection portion that is connected with the power circuit connection portion and an outgoing lead drawn out from an armature winding. The power circuit connection portion and the armature winding connection portion are arranged at desired positions and outgoing leads from the armature winding of the stator are drawn out in such a way as to fall within a given space, so that intermediate connection lines for connecting windings can be shortened. Accordingly, not only the breakage of an intermediate connection line caused by a vibration can be prevented, but also the switching elements can separately be arranged so as to reduce thermal interference between the switching elements; therefore, the switching elements can effectively be cooled.

The thermal interference due to the self heating of transistors constituting a gilbert cell circuit is reduced, thereby largely improving the receiving sensitivity to signals. A mixer circuit composed of a gilbert cell circuit comprises transistors T1 to T6. Each of the transistors T1 to T4 is con figured so that four transistors may be connected in parallel. In a layout on a semiconductor chip, four transistors T1a to T1d and T2a to T2d respectively constituting the transistors T1 and T2 are respectively separated into two pairs, and the respective two pairs are laid out in a crisscross shape so that they are crossed with each other. Similarly, four transistors T3a to T3d and T4a to T4d respectively constituting the transistors T3 and T4 are respectively separated into two pairs, and the respective two pairs are laid out in a crisscross shape so that they are crossed with each other. Thus, the thermal influence applied on the transistors T1 to T4 is uniformed.

In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

The invention discloses a double-wall efficient water-cooling base plate which comprises a grooved plate, a flat plate I fixed to the upper surface of the grooved plate, a flat plate II fixed to the lower surface of the grooved plate, a water inlet and a water outlet. The double-wall efficient water-cooling base plate is characterized in that the grooved plate comprises a left retainer plate, a right retainer plate, and a transverse plate, wherein the left retainer plate and the right retainer plate form an I-shaped grooved plate, and the transverse plate fixed between the left retainer plate and the right retainer plate divides the grooved plate into double cavities. A partition is further disposed between the left retainer plate and the right retainer plate and divides the transverse plate into an inlet cavity transverse plate and an outlet cavity transverse plate. The double cavities divided by the transverse plate are partitioned into four cavities allowing for flowing of coolant, namely an inlet cavity I, an inlet cavity II, an outlet cavity I and an outlet cavity II. Both the inlet cavity I and the inlet cavity II are provided with radiating fins inside. The double-wall efficient water-cooling base plate is capable of cooling on two sides, effectively decreases cooling interference between mounting surfaces of power modules on two sides and weakens the effect of high-temperature cooling water at the water outlet upon the power modules, so that the reliability of the power modules is improved and the service lives of the power modules are prolonged.

In a disc driving apparatus, wherein a laser diode and a laser driver circuit board are mounted on a pickup housing in thermal contact therewith and are disposed adjacent to each other, a heat separation member is provided between the laser diode and the laser driver circuit board for effecting thermal separation therebetween, thereby reducing the thermal interference between the heat-generating elements that are adjacent to each other in the optical pickup. This makes it possible to protect the heat-generating elements from being deteriorated, leading to a reduction in the lifetime thereof, as well as, to improve the reliability thereof.

A multi-layer phase change material, including: a multi-layer film structure. The multi-layer film structure includes a plurality of periodic units. The periodic units each includes a first single-layer film phase change material and a second single-layer film phase change material. The first single-layer film phase change material and the second single-layer film phase change material are alternately stacked. The first single-layer film phase change material includes chemical components that are different from chemical components included in the second single-layer film phase change material, or the first single-layer film phase change material includes chemical components that are the same as chemical components included in the second single-layer film phase change material and a percent composition of the chemical components included in the first single-layer film phase change material is different from a percent composition of the chemical components included in the second single-layer film phase change material.

A semiconductor memory device includes first conductive lines on a substrate, an interlayer insulating layer with a plurality of via holes on the substrate, second conductive lines on the interlayer insulating layer, and a resistive memory material in the via holes and electrically connected to the first and second conductive lines, the resistive memory material having a vertically non-uniform specific resistance profile with respect to the substrate.

The electric rotating machine is provided with an intermediate plate having a power circuit connection portion that is connected with an outgoing lead drawn out from a power circuit unit and an armature winding connection portion that is connected with the power circuit connection portion and an outgoing lead drawn out from an armature winding. The power circuit connection portion and the armature winding connection portion are arranged at desired positions and outgoing leads from the armature winding of the stator are drawn out in such a way as to fall within a given space, so that intermediate connection lines for connecting windings can be shortened. Accordingly, not only the breakage of an intermediate connection line caused by a vibration can be prevented, but also the switching elements can separately be arranged so as to reduce thermal interference between the switching elements; therefore, the switching elements can effectively be cooled.

The apparatus and method according to the invention includes an objective (8) which is capable of operating basically in two different measuring modes. In a first interference mode, a measuring object (9) is interference—optically measured. In a second imaging operating mode on a detector array (12) designed like a camera, an optical image is generated, which is supplied to an image processing routine. The switching over between the two operating modes occurs by switching the illumination devices which are associated with different locations of the beam path of the apparatus—when viewed from the camera, one in front of a beam divider and the other behind the beam divider, which couples a reference light path to the beam path.

The present invention provides a phase change non-volatile memory material comprising a base material and at least one non-metallic light element selected from the group consisting of boron, carbon, nitrogen and oxygen, wherein the base material has a composition which corresponds to either that of congruent melting of the type with a minimum melting point or that of eutectic melting within the range of ±0.15 atomic fraction for each constituent element, thereby having a melting temperature of 600° C. or lower. The phase change non-volatile memory material according to the present invention may be utilized to reduce the electric power needed for reset / set operation and thermal interference between memory cells.

An apparatus is disclosed that drives an inductive load according to a control signal from an external controller transmits temperature data to it for indicating a condition of the inductive load through a line driver. The external controller regenerates the control signal according to the temperature data. According to the control signal, the apparatus operates a pair of power supply circuits to complementarily supply power to the load. Thermal conditions of the power supply circuits and the line driver are monitored for detecting an overheat condition. The transmission of temperature data to the external controller is enabled as long as no overheat condition is detected in both of the power supply circuits and line driver. If an overheat condition is detected in at least one of the power supply circuits and line driver, heat protection is performed and the overheat condition is communicated to the external controller.

An optical recording medium including: a substrate having a surface on which grooves are concentrically or spirally formed, and a recording layer which is formed on the surface of the substrate and contains a dye, the recording layer being irradiated with a laser beam to record or reproduce information, wherein a region of the substrate corresponding to a recording pit forming region is transformed into a convex form or a concave form by irradiating the recording layer with the laser beam to form the recording pit at the time of recording the information, a maximum height of a convex portion is in the range of from 3 nm to 15 nm or a maximum depth of a concave portion is in the range of from 3 nm to 15 nm, and a void is generated in the recording pit forming region of the recording layer.

A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive pattern, and a negative-side switching device and a negative-side diode device which are mounted on an output-side conductive pattern. When an insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device are disposed between the positive-side switching device and the negative-side switching device, and the negative-side diode device is disposed closer to the positive-side switching device than the positive-side diode device is.

A multilaser device has a first laser chip and a second laser chip produced from one and the same wafer lot, a common back beam sensor for receiving a first back beam and a second back beam emitted from the first laser chip and the second laser chip, respectively, and a package containing the first laser chip, the second laser chip and the back beam sensor.

Disclosed is a light emitting diode assembly. The light emitting diode assembly comprised: a red light emitting diode chip; a short-wavelength light emitting diode chip emitting a light having a wavelength relatively shorter than that of a light emitted from the red light emitting diode chip; a first heat-dispersion member for dispersing most of the heat generated in the short wavelength light emitting diode chip; and a second heat-dispersion member for dispersing most of the heat generated in the red light emitting diode chip. Further, the second heat-dispersion member has heat dispersion performance relatively superior to that of the first heat dispersion member. Thus, spectrum movement in the red light emitted from the red light emitting diode chip may be prevented so as to prevent a color-coordinate transformation during the operation time of same.

The invention belongs to the plant tissue culture technology and provides a plant tissue culture shelf with ballasts installed at the top. The prior art has the following defects: the ballasts of the plant tissue culture shelves continuously emit heat, thus reducing the service lives of the ballasts; adverse effects are caused on tissue culture seedlings; and the ballasts and the light source tubes are difficult to overhaul. The plant tissue culture shelf comprises a shelf body (2), separators (7), support legs (8), a switch (3), fluorescent lights (4) and ballasts (5), wherein a ballast installation plate (1) is arranged at the top of the tissue culture shelf body (2); the ballasts (5) are intensively installed on the installation plate (1); the switch (3) is arranged on the front side of the tissue culture shelf body (2); the switch (3) is a multiposition switch; and the position number of the multiposition switch is the same as the number of layers of the tissue culture shelf. The plant tissue culture shelf has the following advantages: the service lives of the ballasts are prolonged; thermal interference with the tissue culture seedlings is avoided, thus being beneficial to growth of the tissue culture seedlings; and the ballasts and the tissue culture shelf lines are convenient to overhaul.

A simple gas sensor for detecting a concentration of a detected gas with high accuracy, in which a thermal interference can hardly occur between a normal detection element pair and a reference detection element pair, is provided.

The invention relates to the technical field of polymerase chain reaction, specifically to a polymerase chain reaction machine and a temperature control system thereof. The system comprises multiple heating modules for temperature regulation of different areas of a porous reaction plate, thermal insulating layers which are arranged between different areas of the porous reaction plate and used for isolating heat exchange between different areas of the porous reaction plate, and a controller which is respectively connected to the multiple heating modules and used for controlling the multiple heating modules to respectively regulate temperature in different areas of the porous reaction plate. The porous reaction plate is divided into multiple areas beforehand to be in one-to-one correspondence with the multiple heating modules. By adding the thermal insulating layers between different areas of the porous reaction plate so as to isolate heat exchange between the different areas, thermal interference between the different areas of the porous reaction plate during temperature control is reduced so as to raise temperature control precision.

The present invention relates to a method of recording information to an optical recording medium that can reduce the influence from heat caused when neighboring recording marks are formed and can prevent cross-talk and cross-erase of information. According to the present invention, when forming recording marks in the optical recording medium by projecting a pulse-modulated laser beam thereonto, since the recording powers of a top pulse and a last pulse are set to Pw2 lower than the recording power Pw1 of any of intermediate pulses-and the width Tcl of a cooling pulse is set to be equal to or wider than 1.0 T wider than the width of a pulse of the recording power, it is possible to improve cooling efficiency when recording marks are formed, thereby decreasing thermal interference between recording marks and achieve high density recording and high data transfer rate.

The apparatus and method according to the invention includes an objective (8) which is capable of operating basically in two different measuring modes. In a first interference mode, a measuring object (9) is interference—optically measured. In a second imaging operating mode on a detector array (12) designed like a camera, an optical image is generated, which is supplied to an image processing routine. The switching over between the two operating modes occurs by switching the illumination devices which are associated with different locations of the beam path of the apparatus—when viewed from the camera, one in front of a beam divider and the other behind the beam divider, which couples a reference light path to the beam path.

The invention relates to a high-sensitivity quick response heat flux sensor. A curved line is manufactured by using a constantan foil piece, and copper plating is performed on the line through the electroplating technology according to the certain rules. When incident heat flux along the normal direction of sensor heat resistance material appears, the temperature difference generates on the upper and lower planes of the heat resistance material, differential thermocouples output signals and the thermo-electric pile in the sensor is equivalent to accumulation of the output of all the included differential thermocouples so that the sensitivity of the sensor can be enhanced, and the sensor can also quickly respond because of low thickness of the heat resistance material when the incident heat flux is small. Compared with the conventional circular foil heat flux sensor, the high-sensitivity quick response heat flux sensor has the following advantages of being small in the sensor size and low in weight; the sensor is piece-shaped, quick in response and convenient to install and can be directly fit on the measured surface; the sensor has high sensitivity and can cover small range heat flux which cannot be measured by the circular foil heat flux sensor; and the sensor is simple in technology and convenient for batch production.

The invention discloses a geothermal heat exchanger capable of improving the heat transfer efficiency for prefab energy balls. A sphere framework is composed of structural ribs and stirrups which are mutually connected. The two or more sets of structural ribs are in a circle shape and form longitude lines of a sphere. The stirrups are in a regular polygon shape and form latitude lines of the sphere. Heat exchange tubes each composed of an inlet section, a spiral tube section and an outlet section are arranged in the sphere framework, and the inlet section, the spiral tube section and the outlet section of each heat exchange tube are connected. The inlet sections are arranged on the inner sides of the stirrups at the top, the spiral tube sections are spirally arranged along the sphere framework, the outlet sections are located in the centers of the stirrups, and the inlet sections and the outlet sections vertically and upwards extend out of the top of the sphere framework by a certain distance. The sphere framework is filled with a backfill material. According to the heat exchanger, the heat exchange tubes are spirally arranged along the spherical surface, the spiral heat exchange tubes are arranged in a staggered mode in the horizontal direction, and thermal interference of adjacent spiral tubes in the vertical direction is weakened, so that the heat transfer capacity of the spiral tubes in the vertical direction is improved, and the heat exchange capacity between the heat exchanger and a soil body is further improved through 360-degree heat exchange between the heat exchanger and the soil body.

Provided are a wafer having a thermal circuit and power supplier therefor, which enable the wafer to heat or cool itself without using any additional heating or cooling system. The wafer includes the thermal circuit that is installed on one side of the wafer to be capable of self-heating or self-cooling the wafer in order to perform a heating process or cooling process on a semiconductor device formed on the surface of the wafer and exchanges heat with the semiconductor device. Thus, a temperature of a semiconductor device can be precisely controlled, and heating and cooling energies are greatly reduced through a direct heat exchange method, thus attaining high efficiency. Since the thermal circuit is directly installed in the wafer, it is structurally simple and the costs of production and installation can be notably reduced. Also, the present invention is very advantageous for optimization, miniaturization, simplification, and environmentally friendly production of a wafer heating / cooling system. Furthermore, a temperature measuring circuit is installed on a reverse surface of the wafer so that the amount of energy that acts on an actual semiconductor device or actual temperature can be accurately measured in real time.

An optical disk having excellent recording characteristics at both low speed and high speed is provided by modifying a cyanine dye serving as a material of a recording layer such that the cyanine dye does not excessively remain in a groove in an optically transparent substrate. The optical disc comprises the recording layer on a surface of the optically transparent substrate, a reflective layer on the recording layer, and a protective layer on the reflective layer, wherein the recording layer contains at least one cyanine dye expressed by the following chemical formula I: wherein, R1, R2 R3, R4, R5, and R6 are hydrocarbon groups, and A and B are independently a fused benzene ring or a fused naphthalene ring optionally having a substituent, and wherein the recording layer is formed by applying the at least one cyanine dye in a fluoroalcohol solvent to the optically transparent substrate.