77results about How to "Reduce thermal interference" patented technology

In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

To provide an image display apparatus that is allowed to incorporate a panel module with excellent mechanical strength even if a screen is upsized and the apparatus is slimmed down. Strengthening units are mounted along a horizontal direction on canopies provided on an upper portion and a lower portion of a panel module constituting a display unit of a large-size, thin image display apparatus. Also, supporting members are mounted on the upper and lower strengthening units in such a manner that the supporting members bridge between the upper and lower strengthening units, so that a stand, or a chain or a string to be used when hanging the image display apparatus is mountable to the supporting members. This prevents direct application of external force to the panel module.

The electric rotating machine is provided with an intermediate plate having a power circuit connection portion that is connected with an outgoing lead drawn out from a power circuit unit and an armature winding connection portion that is connected with the power circuit connection portion and an outgoing lead drawn out from an armature winding. The power circuit connection portion and the armature winding connection portion are arranged at desired positions and outgoing leads from the armature winding of the stator are drawn out in such a way as to fall within a given space, so that intermediate connection lines for connecting windings can be shortened. Accordingly, not only the breakage of an intermediate connection line caused by a vibration can be prevented, but also the switching elements can separately be arranged so as to reduce thermal interference between the switching elements; therefore, the switching elements can effectively be cooled.

The thermal interference due to the self heating of transistors constituting a gilbert cell circuit is reduced, thereby largely improving the receiving sensitivity to signals. A mixer circuit composed of a gilbert cell circuit comprises transistors T1 to T6. Each of the transistors T1 to T4 is con figured so that four transistors may be connected in parallel. In a layout on a semiconductor chip, four transistors T1a to T1d and T2a to T2d respectively constituting the transistors T1 and T2 are respectively separated into two pairs, and the respective two pairs are laid out in a crisscross shape so that they are crossed with each other. Similarly, four transistors T3a to T3d and T4a to T4d respectively constituting the transistors T3 and T4 are respectively separated into two pairs, and the respective two pairs are laid out in a crisscross shape so that they are crossed with each other. Thus, the thermal influence applied on the transistors T1 to T4 is uniformed.

In a disc driving apparatus, wherein a laser diode and a laser driver circuit board are mounted on a pickup housing in thermal contact therewith and are disposed adjacent to each other, a heat separation member is provided between the laser diode and the laser driver circuit board for effecting thermal separation therebetween, thereby reducing the thermal interference between the heat-generating elements that are adjacent to each other in the optical pickup. This makes it possible to protect the heat-generating elements from being deteriorated, leading to a reduction in the lifetime thereof, as well as, to improve the reliability thereof.

The apparatus and method according to the invention includes an objective (8) which is capable of operating basically in two different measuring modes. In a first interference mode, a measuring object (9) is interference—optically measured. In a second imaging operating mode on a detector array (12) designed like a camera, an optical image is generated, which is supplied to an image processing routine. The switching over between the two operating modes occurs by switching the illumination devices which are associated with different locations of the beam path of the apparatus—when viewed from the camera, one in front of a beam divider and the other behind the beam divider, which couples a reference light path to the beam path.

The present invention provides a phase change non-volatile memory material comprising a base material and at least one non-metallic light element selected from the group consisting of boron, carbon, nitrogen and oxygen, wherein the base material has a composition which corresponds to either that of congruent melting of the type with a minimum melting point or that of eutectic melting within the range of ±0.15 atomic fraction for each constituent element, thereby having a melting temperature of 600° C. or lower. The phase change non-volatile memory material according to the present invention may be utilized to reduce the electric power needed for reset/set operation and thermal interference between memory cells.

An apparatus is disclosed that drives an inductive load according to a control signal from an external controller transmits temperature data to it for indicating a condition of the inductive load through a line driver. The external controller regenerates the control signal according to the temperature data. According to the control signal, the apparatus operates a pair of power supply circuits to complementarily supply power to the load. Thermal conditions of the power supply circuits and the line driver are monitored for detecting an overheat condition. The transmission of temperature data to the external controller is enabled as long as no overheat condition is detected in both of the power supply circuits and line driver. If an overheat condition is detected in at least one of the power supply circuits and line driver, heat protection is performed and the overheat condition is communicated to the external controller.

A power semiconductor module including a positive-side switching device and a positive-side diode device which are mounted on a positive-side conductive pattern, and a negative-side switching device and a negative-side diode device which are mounted on an output-side conductive pattern. When an insulating substrate is viewed in plan view, the positive-side diode device and the negative-side diode device are disposed between the positive-side switching device and the negative-side switching device, and the negative-side diode device is disposed closer to the positive-side switching device than the positive-side diode device is.

A multilaser device has a first laser chip and a second laser chip produced from one and the same wafer lot, a common back beam sensor for receiving a first back beam and a second back beam emitted from the first laser chip and the second laser chip, respectively, and a package containing the first laser chip, the second laser chip and the back beam sensor.

Disclosed is a light emitting diode assembly. The light emitting diode assembly comprised: a red light emitting diode chip; a short-wavelength light emitting diode chip emitting a light having a wavelength relatively shorter than that of a light emitted from the red light emitting diode chip; a first heat-dispersion member for dispersing most of the heat generated in the short wavelength light emitting diode chip; and a second heat-dispersion member for dispersing most of the heat generated in the red light emitting diode chip. Further, the second heat-dispersion member has heat dispersion performance relatively superior to that of the first heat dispersion member. Thus, spectrum movement in the red light emitted from the red light emitting diode chip may be prevented so as to prevent a color-coordinate transformation during the operation time of same.

The invention belongs to the plant tissue culture technology and provides a plant tissue culture shelf with ballasts installed at the top. The prior art has the following defects: the ballasts of the plant tissue culture shelves continuously emit heat, thus reducing the service lives of the ballasts; adverse effects are caused on tissue culture seedlings; and the ballasts and the light source tubes are difficult to overhaul. The plant tissue culture shelf comprises a shelf body (2), separators (7), support legs (8), a switch (3), fluorescent lights (4) and ballasts (5), wherein a ballast installation plate (1) is arranged at the top of the tissue culture shelf body (2); the ballasts (5) are intensively installed on the installation plate (1); the switch (3) is arranged on the front side of the tissue culture shelf body (2); the switch (3) is a multiposition switch; and the position number of the multiposition switch is the same as the number of layers of the tissue culture shelf. The plant tissue culture shelf has the following advantages: the service lives of the ballasts are prolonged; thermal interference with the tissue culture seedlings is avoided, thus being beneficial to growth of the tissue culture seedlings; and the ballasts and the tissue culture shelf lines are convenient to overhaul.

The invention relates to a high-sensitivity quick response heat flux sensor. A curved line is manufactured by using a constantan foil piece, and copper plating is performed on the line through the electroplating technology according to the certain rules. When incident heat flux along the normal direction of sensor heat resistance material appears, the temperature difference generates on the upper and lower planes of the heat resistance material, differential thermocouples output signals and the thermo-electric pile in the sensor is equivalent to accumulation of the output of all the included differential thermocouples so that the sensitivity of the sensor can be enhanced, and the sensor can also quickly respond because of low thickness of the heat resistance material when the incident heat flux is small. Compared with the conventional circular foil heat flux sensor, the high-sensitivity quick response heat flux sensor has the following advantages of being small in the sensor size and low in weight; the sensor is piece-shaped, quick in response and convenient to install and can be directly fit on the measured surface; the sensor has high sensitivity and can cover small range heat flux which cannot be measured by the circular foil heat flux sensor; and the sensor is simple in technology and convenient for batch production.

The invention discloses a geothermal heat exchanger capable of improving the heat transfer efficiency for prefab energy balls. A sphere framework is composed of structural ribs and stirrups which are mutually connected. The two or more sets of structural ribs are in a circle shape and form longitude lines of a sphere. The stirrups are in a regular polygon shape and form latitude lines of the sphere. Heat exchange tubes each composed of an inlet section, a spiral tube section and an outlet section are arranged in the sphere framework, and the inlet section, the spiral tube section and the outlet section of each heat exchange tube are connected. The inlet sections are arranged on the inner sides of the stirrups at the top, the spiral tube sections are spirally arranged along the sphere framework, the outlet sections are located in the centers of the stirrups, and the inlet sections and the outlet sections vertically and upwards extend out of the top of the sphere framework by a certain distance. The sphere framework is filled with a backfill material. According to the heat exchanger, the heat exchange tubes are spirally arranged along the spherical surface, the spiral heat exchange tubes are arranged in a staggered mode in the horizontal direction, and thermal interference of adjacent spiral tubes in the vertical direction is weakened, so that the heat transfer capacity of the spiral tubes in the vertical direction is improved, and the heat exchange capacity between the heat exchanger and a soil body is further improved through 360-degree heat exchange between the heat exchanger and the soil body.

Provided are a wafer having a thermal circuit and power supplier therefor, which enable the wafer to heat or cool itself without using any additional heating or cooling system. The wafer includes the thermal circuit that is installed on one side of the wafer to be capable of self-heating or self-cooling the wafer in order to perform a heating process or cooling process on a semiconductor device formed on the surface of the wafer and exchanges heat with the semiconductor device. Thus, a temperature of a semiconductor device can be precisely controlled, and heating and cooling energies are greatly reduced through a direct heat exchange method, thus attaining high efficiency. Since the thermal circuit is directly installed in the wafer, it is structurally simple and the costs of production and installation can be notably reduced. Also, the present invention is very advantageous for optimization, miniaturization, simplification, and environmentally friendly production of a wafer heating/cooling system. Furthermore, a temperature measuring circuit is installed on a reverse surface of the wafer so that the amount of energy that acts on an actual semiconductor device or actual temperature can be accurately measured in real time.