Provided are a
wafer having a
thermal circuit and power supplier therefor, which enable the
wafer to heat or cool itself without using any additional heating or cooling
system. The
wafer includes the
thermal circuit that is installed on one side of the wafer to be capable of self-heating or self-cooling the wafer in order to perform a heating process or cooling process on a
semiconductor device formed on the surface of the wafer and exchanges heat with the
semiconductor device. Thus, a temperature of a
semiconductor device can be precisely controlled, and heating and cooling energies are greatly reduced through a direct heat exchange method, thus attaining high efficiency. Since the
thermal circuit is directly installed in the wafer, it is structurally simple and the costs of production and installation can be notably reduced. Also, the present invention is very advantageous for optimization,
miniaturization, simplification, and
environmentally friendly production of a wafer heating / cooling
system. Furthermore, a temperature measuring circuit is installed on a reverse surface of the wafer so that the amount of energy that acts on an actual
semiconductor device or actual temperature can be accurately measured in real time.