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486results about How to "Spend less" patented technology

Systems and methods of inventory management utilizing unattended facilities

An inventory management system utilizes unattended facilities remote from a central warehouse for service parts logistics. Items are placed in inventory in secure enclosures at the unattended facilities by the inventory management service. The unattended facilities may be located near one or more customers to reduce a service technician's travel time and customers' inventory costs. A service technician utilizes a passcode to retrieve needed items. The service technician may order items that are not kept in the inventory of the unattended facility in which case the items may be delivered to the unattended facility and the service technician may receive a notification related to all the items that comprise an order that the order is ready for pick up at an unattended facility. Unused, used or damaged parts may be returned by a technician to a remote secure enclosure where such returned parts may be retrieved and disposed of, repaired or placed back into inventory if not damaged or after repair, and the processing of such returned parts begins by information entered into a data entry device at the remote secure enclosure location. Return items that are not damaged may be included in the inventory of an unattended facility.
Owner:UNITED PARCEL SERVICE OF AMERICAN INC

Method for the production of semi-conductor chips

A method for producing a plurality of semiconductor chips, particularly radiation-emitting semiconductor chips, each having at least one epitaxially produced functional semiconductor layer stack, comprising the following method steps:preparing a growth substrate wafer (1) substantially comprised of semiconductor material from a semiconductor material system that is with respect to lattice parameters the same as or similar to that on which a semiconductor layer sequence for the functional semiconductor layer stack is based,forming in the growth substrate wafer (1) a separation zone (4) disposed parallel to a main face (100) of the growth substrate wafer (1),joining the growth substrate wafer (1) to an auxiliary carrier wafer (2),detaching along the separation zone (4) a portion (11) of the growth substrate wafer (1) that faces away from the auxiliary carrier wafer (2) as viewed from the separation zone (4),forming on the portion (12) of the growth substrate wafer remaining on the auxiliary carrier wafer (2) a growth surface for subsequent epitaxial growth of a semiconductor layer sequence,epitaxially growing the semiconductor layer sequence (5) on the growth surface,applying a chip substrate wafer to the semiconductor layer sequence,detaching the auxiliary carrier wafer (2), andsingulating the composite composed of the semiconductor layer sequence and the chip substrate wafer (7) into mutually separate semiconductor chips.
Owner:OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG

Optical detection device for detecting an intensity of a light beam and for detecting data transmitted by the light beam

An optical detection device for detecting an intensity of a light beam in a detection window and for detecting data transmitted by the light beam includes a first detection diode and an array of at least two second detection diodes in a detection window. In addition, provision is made for a first readout circuit connectable to the first detection diode, for reading out the first detection diode at a first readout speed to detect the data, and for a second readout circuit connectable to the second detection diodes, for reading out the second detection diodes at a second readout speed smaller than the first readout speed, so as to detect the intensity of the light beam. A fundamental consideration underlying the present invention is that although the provision of additional detection diodes in the detection window initially is associated with additional expense and a reduction of the surface area of the detection window which may effectively be utilized for data detection, these disadvantages are outweighed however, by the fact that this array of additional detection diodes in the detection window enables more effective and / or less expensive control of the alignment of the light beam transmitting the data with the detection window.
Owner:DEUTSCHE THOMSON-BRANDT GMBH +1
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