1873results about How to "Small space requirement" patented technology

A protective circuit for electrical connection to solar cells of a solar cell module is provided with a protective circuit that has a controlled electronic circuit arrangement. In this way, only minimal heating of the protective circuit for electrical connection of solar cells of a solar cell module occurs in operation. The controlled electronic circuit arrangement can have a trigger circuit and a switching arrangement which can be triggered by the trigger circuit, the switching arrangement being connected parallel to at least one solar cell, and in the case of shading of the solar cells, is at least temporarily activated by the trigger circuit so that a current bypass for the shaded solar cell is achieved.

A protective circuit for electrical connection to solar cells of a solar cell module is provided with a protective circuit that has a controlled electronic circuit arrangement. In this way, only minimal heating of the protective circuit for electrical connection of solar cells of a solar cell module occurs in operation. The controlled electronic circuit arrangement can have a trigger circuit and a switching arrangement which can be triggered by the trigger circuit, the switching arrangement being connected parallel to at least one solar cell, and in the case of shading of the solar cells, is at least temporarily activated by the trigger circuit so that a current bypass for the shaded solar cell is achieved.

A system and method for cooling back to back electronic displays. Transparent first and second gas chambers are co-existive with the front display surfaces of the first and second electronic displays. A closed loop of isolated gas enters the first and second gas chambers and contacts the front surfaces of the electronic displays, where it may extract heat from the front display surfaces. The isolated gas is then directed into a cooling chamber where it is cooled and re-introduced into the first and second gas chambers. Fans may be used to propel the isolated gas through the cooling chamber and the first and second gas chambers. The circulating gas removes heat directly from the electronic display surfaces. The isolated gas is transparent or at least semi-transparent to ensure that the image quality of the electronic displays is minimally impacted.

A powershiftable multistage transmission (LMG) between an input shaft (an), which can be connected to a first transmission shaft (1), and an output shaft (ab=2) as a second transmission shaft, comprising two shaft-lines (WS1 and WS2) which are arranged in parallel in a transmission housing (0), three transfer gears (SG) between these shaft-lines, three planetary gears (PG) each with a sun gear (So), a ring gear (Ho) and a planet-carrier (Pt) with single planets, and a plurality, preferably five, shifting elements (SE). With only five shifting elements eight forward gears and one reverse gear can be switched. The six gear elements have ratios which can be designed easily even if the total ratio range is somewhere between 7<φges<9. Due to the distribution of the gear elements on two shaft-lines, the transmission gearbox has a short length and is suitable for front-cross-applications as well as inline-applications. All shifting elements can be easily fed with oil to control them. With only four shifting elements the transmission still has five well stepped forward gears and one reverse gear. The gear-trains 47 and 58 are very suitable gear elements to link to an electric motor to obtain an advantageous hybrid driveline.

To provide a piezoelectric oscillator in which the size in the thickness direction can be made smaller and the space required for mounting can be made smaller, and a portable telephone and electronic equipment using the piezoelectric oscillator, a resonator package accommodating a piezoelectric resonating element therein, and an IC chip fixed onto a rear surface of the resonator package and having an oscillating circuit therein are provided, and an inner lead portions of a lead frame are fixed onto the rear surface of the resonator package and the resonator package and the IC chip are resin molded except for an outer lead portion of the lead frame.