34 results about "Bulk micromachining" patented technology

A microphone having an optical component for converting the sound-induced motion of the diaphragm into an electronic signal using a diffraction grating. The microphone with inter-digitated fingers is fabricated on a silicon substrate using a combination of surface and bulk micromachining techniques. A 1 mm×2 mm microphone diaphragm, made of polysilicon, has stiffeners and hinge supports to ensure that it responds like a rigid body on flexible hinges. The diaphragm is designed to respond to pressure gradients, giving it a first order directional response to incident sound. This mechanical structure is integrated with a compact optoelectronic readout system that displays results based on optical interferometry.

A wire-bonding free packaging structure for light emitting diode (LED) is provided. Prepare a silicon sub-mount having a backside bulk micromachining reach-through U-shape cavity for accommodating a flip-chip LED. This stack-integrated packaging module with solder bumps on the surface is than bonded to an aluminum PC board with flip-chip surface mount packaging or bump technology. This gives very good heat conduction to the heat sink of the PC board and can endure more current to enhance light intensity of the LED. This stack-integrated packaging module can also be bonded on a lead frame with two leg packaging, which can also increase heat conduction.

Micromachined, CMOS p+-active / n-well diodes are used as infrared sensing elements in uncooled Focal Plane Arrays (FPA). The FPAs are fabricated using a standard CMOS process followed by post-CMOS bulk-micromachining steps without any critical lithography or complicated deposition processes. Micromachining steps include Reactive Ion Etching (RIE) to reach the bulk silicon and anisotropic silicon wet etching together with electrochemical etch-stop technique to obtain thermally isolated p+-active / n-well diodes. The FPAs are monolithically integrated with their readout circuit since they are fabricated in any standard CMOS technology.

A two-stage acceleration sensing apparatus is disclosed which has applications for use in a fuze assembly for a projected munition. The apparatus, which can be formed by bulk micromachining or LIGA, can sense acceleration components along two orthogonal directions to enable movement of a shuttle from an “as-fabricated” position to a final position and locking of the shuttle in the final position. With the shuttle moved to the final position, the apparatus can perform one or more functions including completing an explosive train or an electrical switch closure, or allowing a light beam to be transmitted through the device.

A method and apparatus for making a polymeric printhead having one or more pins for fluid transfer and printing, including the steps of forming a positive mold of the printhead using a bulk micromachining process, forming a negative mold of the printhead from the positive mold using an electroforming process, and forming the printhead from a polymeric material in the negative mold, the polymeric printhead being operative for fluid transfer and / or printing. Also, printheads and pins, holders and dispensing trays microfabricated from a polymeric materials for fluid transfer and printing.

A hydrogel-driven micropump, comprising: two fluid chambers; a fluid channel, connecting the two fluid chambers; a first substrate plate and a second substrate plate, which are glass wafers produced by micromechanical working, each having accommodation chambers which are filled in hydrogel which are placed next to the two fluid chambers and connected by inward extending bridges, with electric terminals leading to the accommodation chambers; a middle substrate, sandwiched between the first and second substrate plates and made by a bulk micromachining process, having separated accommodation chambers close to ends thereof. A separating block is placed between the accommodation chambers. The middle substrate between the first and second substrate plates forms a micropump body. All of the substrates are separated by membranes. The accommodation chambers for electrophoretic fluid are located between the membranes and the first and second substrate plates, respectively, and insulating material. An electrophoretic fluid channel is left between the membranes and the bridges. The fluid channel is placed within the middle substrate between the membranes. The first substrate plate has through holes from outside to the two fluid chambers, allowing fluid to be injected.

The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution of the sacrificial material can be carried out in mild environments. Sacrificial materials of the present invention may be useful for surface micromachining, bulk micromachining, and other microfabrication processes in which a sacrificial layer is employed for producing a selected and corresponding physical structure.

A submount substrate for mounting a light emitting device and a method of fabricating the same, wherein since a submount substrate for mouthing a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.

The invention relates to a micro-type dynamic piezoresistive pressure sensor and its making method, using MEMS silicon bulk micromachining method to make a pressure sensitive chip of E-shaped silicon cup structure, the reverse side of the chip is welded with static seal technique, Pyres glass ring and Hitachi alloy ring, to form silicon back contact medium quasi-level packaging, the reverse back of the chip is covered with anti-interference insulating layer, the right side of the chip is connected with a lead cable through connecting circuit, the sensor tube cap with cable drawing-off mouth at the tail is hermetically welded to the Hitachi alloy ring to form sealed isolation between the side pressure surface and the back pressure cavity, the tail of the tube cap squeezes tightly the cable without sealing, the nozzle part of the sleeve covered on the cable is hermetically covered on the tail of the tube cap, the heat-shrinkable tube segment covered on the cable is hermetically fixed with the outer end part of the sleeve nozzle, thus implementing atmosphere connection between the back pressure cavity and the measured environment, and it is used in shrinkage mould test for hydraulic engineering like dam, ship gate, pier, embankment, etc. and has low measuring range, high sensitivity, strong anti-interference performance, and good dynamic performance during fluid dynamic test.

A silicon bulk-micromachining technology is used to fabricate a GMR filter by exploiting the structure of a suspended silicon nitride (SiNx) membrane on the silicon substrate. A first silicon nitride (SiNx) thin film and a second silicon nitride (SiNx) thin film are formed on opposite sides of the silicon substrate. A first opening is defined in the first silicon nitride (SiNx) thin film, and a grating structure is defined in the second silicon nitride (SiNx) thin film. By etching off a portion of the silicon substrate exposed from the first opening until a portion of the second silicon nitride (SiNx) thin film is exposed from the first opening, a light path space is defined.

A vibratory sensor is fabricated as a three-dimensional batch-micromachined shell adapted to vibrate and support elastic wave propagation and wave precession in the shell or membrane and at least one driving electrode and preferably a plurality of driving electrodes directly or indirectly coupled to the shell to excite and sustain the elastic waves in the shell. The pattern of elastic waves is determined by the configuration of the driving electrode(s). At least one sensing electrode and preferably a plurality of sensing electrodes are provided to detect the precession of the elastic wave pattern in the shell. The rotation of the shell induces precession of the elastic wave pattern in the shell which is usable to measure the rotation angle or rate of the vibratory sensor.

A two-stage acceleration sensing apparatus is disclosed which has applications for use in a fuze assembly for a projected munition. The apparatus, which can be formed by bulk micromachining or LIGA, can sense acceleration components along two orthogonal directions to enable movement of a shuttle from an “as-fabricated” position to a final position and locking of the shuttle in the final position. With the shuttle moved to the final position, the apparatus can perform one or more functions including completing an explosive train or an electrical switch closure, or allowing a light beam to be transmitted through the device.

The present invention provides fabrication methods using sacrificial materials comprising polymers. In some embodiments, the polymer may be treated to alter its solubility with respect to at least one solvent (e.g., aqueous solution) used in the fabrication process. The preparation of the sacrificial materials is rapid and simple, and dissolution of the sacrificial material can be carried out in mild environments. Sacrificial materials of the present invention may be useful for surface micromachining, bulk micromachining, and other microfabrication processes in which a sacrificial layer is employed for producing a selected and corresponding physical structure.

A hydrogel-driven micropump, comprising: two fluid chambers; a fluid channel, connecting the two fluid chambers; a first substrate plate and a second substrate plate, which are glass wafers produced by micromechanical working, each having accommodation chambers which are filled in hydrogel which are placed next to the two fluid chambers and connected by inward extending bridges, with electric terminals leading to the accommodation chambers; a middle substrate, sandwiched between the first and second substrate plates and made by a bulk micromachining process, having separated accommodation chambers close to ends thereof. A separating block is placed between the accommodation chambers. The middle substrate between the first and second substrate plates forms a micropump body. All of the substrates are separated by membranes. The accommodation chambers for electrophoretic fluid are located between the membranes and the first and second substrate plates, respectively, and insulating material. An electrophoretic fluid channel is left between the membranes and the bridges. The fluid channel is placed within the middle substrate between the membranes. The first substrate plate has through holes from outside to the two fluid chambers, allowing fluid to be injected.

A novel fabrication process uses a combination of negative and positive photoresists with positive tone photomasks, resulting in masking layers suitable for bulk micromachining high-aspect ratio microelectromechanical systems (MEMS) devices. This technique allows the use of positive photomasks with negative resists, opening the door to an ability to create complementary mechanical structures without the fabrication delays and costs associated with having to obtain a negative photomask. In addition, whereas an SU-8 mask would normally be left in place after processing, a technique utilizing a positive photoresist as a release layer has been developed so that the SU-8 masking material can be removed post-etching.

A micromachined spinneret is disclosed which has one or more orifices through which a fiber-forming material can be extruded to form a fiber. Each orifice is surrounded by a concentric annular orifice which allows the fiber to be temporarily or permanently coated with a co-extrudable material. The micromachined spinneret can be formed by a combination of surface and bulk micromachining.

A process producing a single-crystalline device fabricated on a single-sided polished wafer employing processing from only the front-side and having a significant separation between the device and substrate is provided. In one embodiment, a method comprises an upper layer and a lower substrate. A device is formed in the upper layer, defined by gaps. The gaps are filled with at least one material that has etch characteristics different from those of the device and the substrate. At least a top portion of the gap material is removed from the upper layer. The gap material is etched so that a portion of the gap-material remains on the sidewalls of the surrounding upper layer. The material beneath the device is then etched, excluding an insulating layer beneath the device, releasing the device from the substrate. The insulating material beneath the device is then etched, the etch being selective to the insulating material and the gap material.

A process producing a single-crystalline device fabricated on a single-sided polished wafer employing processing from only the front-side and having a significant separation between the device and substrate is provided. In one embodiment, a method comprises an upper layer and a lower substrate. A device is formed in the upper layer, defined by gaps. The gaps are filled with at least one material that has etch characteristics different from those of the device and the substrate. At least a top portion of the gap material is removed from the upper layer. The gap material is etched so that a portion of the gap-material remains on the sidewalls of the surrounding upper layer. The material beneath the device is then etched, excluding an insulating layer beneath the device, releasing the device from the substrate. The insulating material beneath the device is then etched, the etch being selective to the insulating material and the gap material.

A performance-adjusting device for inertia device is constructed by both suspension structure and micro-electroplating structure. The suspension structure may be manufactured by surface micromachining technique of sacrificial layer process or bulk micromachining technique incorporating with thin film process. One side of the suspension structure is arranged firmly to a supporting piece, such that another side of the suspension structure is shown as a suspension state. The suspension side of the suspension structure is made as micro-electroplating structure through the micro-electroplating process and is functioned as inertia mass for an inertia sensor. The size of the micro-electroplating structure may be changed through the micro-electroplating process, such that the inertia sensor may be adapted for sensing in different levels. Furthermore, a microstructure of high aspect-ratio may be achieved by taking the advantage of a metal during the selection of a processing material, such that the objective for lateral sensing or driving signal may be fulfilled.

A silicon bulk-micromachining technology is used to fabricate a GMR filter by exploiting the structure of a suspended silicon nitride (SiNx) membrane on the silicon substrate. A first silicon nitride (SiNx) thin film and a second silicon nitride (SiNx) thin film are formed on opposite sides of the silicon substrate. A first opening is defined in the first silicon nitride (SiNx) thin film, and a grating structure is defined in the second silicon nitride (SiNx) thin film. By etching off a portion of the silicon substrate exposed from the first opening until a portion of the second silicon nitride (SiNx) thin film is exposed from the first opening, a light path space is defined.

The invention relates to a micro-type dynamic piezoresistive pressure sensor and its making method, using MEMS silicon bulk micromachining method to make a pressure sensitive chip of E-shaped silicon cup structure, the reverse side of the chip is welded with static seal technique, Pyres glass ring and Hitachi alloy ring, to form silicon back contact medium quasi-level packaging, the reverse back of the chip is covered with anti-interference insulating layer, the right side of the chip is connected with a lead cable through connecting circuit, the sensor tube cap with cable drawing-off mouth at the tail is hermetically welded to the Hitachi alloy ring to form sealed isolation between the side pressure surface and the back pressure cavity, the tail of the tube cap squeezes tightly the cable without sealing, the nozzle part of the sleeve covered on the cable is hermetically covered on the tail of the tube cap, the heat-shrinkable tube segment covered on the cable is hermetically fixed with the outer end part of the sleeve nozzle, thus implementing atmosphere connection between the back pressure cavity and the measured environment, and it is used in shrinkage mould test for hydraulic engineering like dam, ship gate, pier, embankment, etc. and has low measuring range, high sensitivity, strong anti-interference performance, and good dynamic performance during fluid dynamic test.

A mechanism and method for motion conversion is disclosed. This mechanism can be easily fabricated using standard bulk micromachining technology. Based on this method with appropriate design, a horizontal, in-plane motion can be converted to a vertical or angular displacement out-of-plane. This design has great advantages in micro devices, which are built from a single layer, i.e. wafer fabrication, where an in-plane force is easy to implement, such as by the use of comb drive mechanisms, but an out-of-plane motion may be hard to achieve. The mechanism comprises a pair of beams of different heights, rigidly connected together at a number of points along their length, such that application of an in-plane force to the double beam structure results in out-of-plane motion of the double beam structure at points distant from the point of application of the force.

The disclosure provides a silicon-based suspending antenna with photonic bandgap structure which manufactured by IC thin film process, surface micromachining and bulk Micromachining are provided. The silicon-based suspending antenna with photonic bandgap structure includes a silicon substrate, an electrode layer, a spacing part and an F-shaped structure. The silicon substrate has a first side surface and a second side surface oppositing to the first surface, the first side surface has a plurality of regular recesses and the second side surface has a longitudinal edge. The electrode layer has a flat part, a first base and at least one second base, in which one side of the flat part has a notch, the first base, the second base and the notch are separately disposed on the second side surface and essentially parallel to the longitudinal edge of the second side surface, the first base has a main body and an extension, and the extension extends from the main body and into the notch. The spacing part is disposed on the second base. The F-shaped structure has a longitudinal part disposed on the spacing part and is parallel to the second side surface.

A manufacturing process of a three-layer continuous surface MEMS deformable mirror based on a bonding process, which mainly includes dry etching a release hole on the upper surface of an SOI wafer, partially releasing the middle oxide layer of the SOI wafer, and performing a process on the lower surface of the SOI wafer. Wet etching, and deposit metal on another substrate (silicon wafer or glass) as an electrode structure, and finally bond the substrate with the SOI wafer. It is characterized in that the bulk silicon micromachining process and the surface micromachining process are combined, and the upper two-layer structure obtained by the bulk silicon process is bonded with the lower electrode structure layer obtained by surface micromachining to obtain a three-layer micromechanical structure. . The invention is a three-layer continuous surface MEMS deformable mirror based on a bonding process, and its manufacturing process is relatively easy, which solves the disadvantage that the traditional continuous surface micromechanical deformable mirror is difficult to process through three-layer surface micromachining, and the processing The deformable mirror can obtain a large out-of-plane displacement, and eliminate the defect of short circuit caused by electrostatic pull-in by adding a silicon nitride insulating layer, and can be widely used in the fields of optical communication and adaptive optics.

The invention relates to the fabrication method of the ultra-low-pressure sensor silicon chips, which develops the ultra-low-pressure sensor silicon microchips with high sensitivity under the condition of ensuring the high linear accuracy by adopting the combination of the planar process of silicon and process technology of bulk micromachining, adopting the planar process technology of the integrated circuit and anisotropic erosion of silicon, combining the advantages of the beam diaphragm structure and the plane membrane twin islands structure in the pressure sensor chip design and adopting the twin islands-beam-membrane structure to fully concentrate the stress. The method mainly comprises the steps such as oxidation-dual surface lithography alignment mark- oxidation-lithography back large membrane and lithography facade beam zone-back large membrane and facade beam zone erosion- oxidation-lithography back stress unification zone- back stress unification zone erosion-back glue protection and facade rinse SiO2 layer- oxidation- lithography resistance zone-sensing resistor zone boron dope- lithography heavy boron zone-heavy boron-diffusion formed ohm zone-top and back deposit silicon nitride- lithography pin hole- lithography back small island, lithography back large island-facade aluminum coating, etching back aluminum wire and alloyage-entering the corrosion technology process.